Discussing Panel Scale Packaging at SEMI’s Northeast Forum

Discussing Panel Scale Packaging at SEMI’s Northea…

2 weeks ago Paul Werbaneth
SEMI did a great job at SEMICON West 2016 organizing a bursting-at-the-seams amount of technical con…
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2 weeks agoDiscussing Panel Scale Packaging at SEMI’s Northea…
The Great Divide Between Semiconductor Design and Manufacturing

The Great Divide Between Semiconductor Design and…

2 weeks ago Herb Reiter
Shortly before the summer break started, I attended a number of industry conferences: MEPTEC, ECTC,…
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2 weeks agoThe Great Divide Between Semiconductor Design and…
Fraunhofer IZM Panel Level Packaging Consortium Launches in Berlin

Fraunhofer IZM Panel Level Packaging Consortium La…

3 weeks ago Paul Werbaneth
In the bric-à-brac collection that seems to form my particular set of memories and mental associatio…
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3 weeks agoFraunhofer IZM Panel Level Packaging Consortium La…
SEMI 2020: Transforming for the New Supply Chain

SEMI 2020: Transforming for the New Supply Chain

3 weeks ago Denny McGuirk
2015 will be remembered mostly for the ‘wild ride’ that fundamentally changed the industry.  An unpr…
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3 weeks agoSEMI 2020: Transforming for the New Supply Chain

3D Topics

SEMICON Europa Advanced Packaging Conference Looks at Consumer and Harsh Environment Packaging
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SEMICON Europa Advanced Packaging Conference Looks at Consumer and Harsh Environment Packaging

System integration is moving forward.  Denser and high performing systems require advanced packaging, assembly, and test players to move closer together, and they mandatorily need to be involved in t... »

Making Connections at SEMICON West 2016
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Making Connections at SEMICON West 2016

If you attended SEMICON West 2016 last week, you probably noticed that the event is undergoing a metamorphosis. It was hard to miss. The signs were everywhere. Literally: It’s not surprising, since ... »

Heterogeneous Integration enabled by Advanced Packaging Leads the Way at SEMICON West 2016
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Heterogeneous Integration enabled by Advanced Packaging Leads the Way at SEMICON West 2016

I have to admit, after attending this week’s SEMICON West 2016, I’m feeling a little smug. Why? Because after years of waiting in the shadows for its day in the sun, advanced packaging is finally ... »

And the Winners of the 2016 3D InCites Awards are…..
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And the Winners of the 2016 3D InCites Awards are…..

 For the fourth consecutive year, the Impress Lounge played host to the 3D InCites Awards Ceremony, during which individuals, companies, and products were recognized by their peers for excellence in ... »

Convergence on the “Big Five”: Focus on Wafer-based Advanced SiP
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Convergence on the “Big Five”: Focus on Wafer-based Advanced SiP

In the fourth installment of the series “Convergence on the Big Five,” we compared conventional SiP with advanced system-in-package (SiP), which is focused on laminate-based approaches, and is ava... »

Video Channels

Company News

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Will Fan-out Packaging be Sustainable Long-term?

2016 is a turning point for the Fan-Out packaging market since both leaders, Apple and TSMC changed the game and may create a trend of acceptance of fan-out packages. Yole Développement (Yole) is ana... »

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Leading Market Analysts to Explore Future of MEMS at the European MEMS Summit

The second annual European MEMS Summit takes place in Stuttgart, Germany, on September 15-16, 2016. In addition to top MEMS technologists, the summit will feature numerous market experts to speak ab... »

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Rudolph Technologies Announces New Clearfind Technology for Advanced Packaging Inspection

Wilmington, Mass. (July 11, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today unveiled its new patented Clearfind™ technology, which can detect organic defects that are difficult or impossible ... »

EVG50 Automated Metrology System

EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing

FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®50 aut... »

EVG ComBond Automated High-Vacuum Wafer Bonding Platform

EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced new capabilities on the EVG ComBond® automated h... »

MEMS & Sensors Industry Group Invites Collaboration in MEMS, Sensors and ICs at SEMICON West 2016

PITTSBURGH (June 29, 2016) – MEMS & Sensors Industry Group® (MSIG) invites attendees to a special half-day workshop on the convergence of MicroElectroMechanical Systems (MEMS) devices, sensors,... »

Rudolph Receives Multi-System Order From a Leading OSAT for Fan-out Wafer Level Packaging Inspection

Wilmington, Mass. (June 28, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspection, lithography, metrology, and process con... »

Amkor Opens MEMS Packaging Line in China

TEMPE, Ariz., June 28, 2016 – Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconduct... »

EV Group Scores Fourth Consecutive Triple Crown Win in Annual VLSIresearch Customer Satisfaction Survey

FLORIAN, Austria, June 21, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that, for the fo... »