How Will Future Capex Spending Affect Semiconductor Suppliers?

How Will Future Capex Spending Affect Semiconducto…

3 days ago Francoise von Trapp
At the recent Arizona SEMI Breakfast Forum, held April 17, 2015, semiconductor suppliers gathered at…
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3 days agoHow Will Future Capex Spending Affect Semiconducto…
A Trip Down Silicon Valley’s Memory Lane with Bill Hugle

A Trip Down Silicon Valley’s Memory Lane with Bill…

4 days ago Francoise von Trapp
Inspired by all the recent attention for the 50th anniversary of Moore’s Law and SEMI’s cool new Inf…
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4 days agoA Trip Down Silicon Valley’s Memory Lane with Bill…
TSMC 2015 Technology Symposium Highlights Plans for the Coming Year

TSMC 2015 Technology Symposium Highlights Plans fo…

2 weeks ago Herb Reiter
Last Tuesday, April 7, was another important day for Silicon Valley. TSMC 2015 Technology Symposium …
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2 weeks agoTSMC 2015 Technology Symposium Highlights Plans fo…
Will the Internet of Things Deliver on its Promise?

Will the Internet of Things Deliver on its Promise…

2 weeks ago Francoise von Trapp
“Firsts are good but lasts are better. The Internet of Everything (IoE) is ushering in many firsts b…
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2 weeks agoWill the Internet of Things Deliver on its Promise…

3D Topics

Goofus and Gallant and the Internet of Things
goofusandgallant

Goofus and Gallant and the Internet of Things

If you grew up before about the mid 1980’s, you likely remember the magazine, Highlights for Children (now an online publication, Highlights for Kids) and within that magazine you likely recall a... »

Executive Viewpoint: Inside a Multi-Project Wafer Program for 3D Integration
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Executive Viewpoint: Inside a Multi-Project Wafer Program for 3D Integration

Multi-project wafer (MPW) programs have long been considered an economical way to integrate different IC designs from various teams to produce IC design prototypes and low volumes. Because IC fabricat... »

Addressing 3D IC Assembly Challenges at IMAPS DPC 2015
DowTWB C2C test vehicle front C2W test vehicle front

Addressing 3D IC Assembly Challenges at IMAPS DPC 2015

While we wait in the 3D IC holding pattern for products to go into high volume, processes continue to be tweaked and optimized to address the remaining 3D IC assembly challenges. At IMAPS DPC 2015, a ... »

SEMI-THERM 2015: Thermal Innovations that Make the World’s Technology Cool
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SEMI-THERM 2015: Thermal Innovations that Make the World’s Technology Cool

From March 16-20 the annual SEMI-THERM Conference (SEMI-THERM 2015) in San Jose gave me the opportunity to meet many assembly, materials, and thermal management experts. I also learned a lot about ho... »

Flying Many Flags: Heterogeneous Integration at CS International 2015
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Flying Many Flags: Heterogeneous Integration at CS International 2015

The fifth annual CS International Conference, 2015 edition, was held in Frankfurt, Germany, March 11-12, 2015. Very conveniently located in the Sheraton Frankfurt Airport Hotel & Conference Center... »

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Company News

KLA-Tencor Introduces New Portfolio for Advanced Semiconductor Packaging

KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for characterization and monitoring of... »

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Fifty Years of Moore’s Law Made Possible by Semiconductor Equipment and Materials Suppliers Worldwide

SAN JOSE, CA — April 14, 2015 — April 2015 marks the 50th anniversary of one of the business world’s most profound drivers, now commonly referred to as Moore’s Law. In April 1965, Gordon M... »

Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications

Flanders, New Jersey (April 1, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced that a major semiconductor foundry and a top outsourced semiconductor assembly and test (OSAT) facility have pl... »

3D InCites Opens Nominations for the 2015 3D InCites Awards

Phoenix AZ – March 26, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced it has partnered with Impress foundation to co-host the third a... »

Ziptronix Licenses DBI® Hybrid Bonding Patents to Sony for Advanced Image Sensor Applications

RESEARCH TRIANGLE PARK, N.C., March 18, 2015 – Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology for 3D integration, today announced a patent licens... »

TechSearch International Analyzes Flip Chip and Wafer Level Package Growth

TechSearch International Analyzes Flip Chip and Wafer Level Package Growth Flip chip and wafer level package (WLPs) shipments continue to increase. TechSearch International’s new study, 2015 Flip Ch... »

MIG Takes a Roll-Up-Your-Sleeves Approach with Revamped MEMS/Sensors Technical Event

MEMS Industry Group (MIG) announced  a technical event with a hands-on focus: MEMS Technical Congress™, May 6-7, 2015 in Boston, Mass. MEMS Technical Congress opens MIG’s annual technical event ... »

Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications

Flanders, New Jersey (March 10, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep® Advanced Packag... »

French Institutes IRT Nanoelec and CMP Team up to Offer World’s First Service for Post-process 3D Technologies on Multi-Project-Wafer

GRENOBLE, France – March 5, 2015 – IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEM... »

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