Will 2.5D and 3D Stacking Save the Semiconductor Industry?

Will 2.5D and 3D Stacking Save the Semiconductor I…

2 days ago Francoise von Trapp
Year’s ago, when I was managing editor of Advanced Packaging Magazine, each January issue featured a…
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2 days agoWill 2.5D and 3D Stacking Save the Semiconductor I…
Glass Substrates for Advanced Packaging

Glass Substrates for Advanced Packaging

3 days ago Aric Shorey
Glass has many properties that make it an ideal substrate for interposers such as: ultra-high resist…
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3 days agoGlass Substrates for Advanced Packaging
Highlights from HotChips 2014: 21 HBM Design-ins Ongoing!

Highlights from HotChips 2014: 21 HBM Design-ins O…

1 week ago Herb Reiter
Last week, HotChips 2014 (aka HC26) was held at the Flint Center within the De Anza College in Cuper…
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1 week agoHighlights from HotChips 2014: 21 HBM Design-ins O…
Are Chip Architects Finally Climbing on the 2.5D and 3D Bandwagon?

Are Chip Architects Finally Climbing on the 2.5D a…

2 weeks ago Francoise von Trapp
Ever since SEMICON West 2014, I’ve been seeing a lot of coverage of the 2.5D and 3D adoption questio…
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2 weeks agoAre Chip Architects Finally Climbing on the 2.5D a…
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3D Topics

Lithography Process Innovations Part 2: Improving Thermo-mechanical Reliability of TSV Interconnects
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Lithography Process Innovations Part 2: Improving Thermo-mechanical Reliability of TSV Interconnects

In Part 1 of this article series, we noted that despite the potential benefits associated with 3D and interposer-based 2.5D designs, the incorporation of TSVs poses significant challenges to the perfo... »

Lithography Process Innovations for 2.5/3D Part 1: Alleviating TSV Stress
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Lithography Process Innovations for 2.5/3D Part 1: Alleviating TSV Stress

As traditional semiconductor scaling becomes increasingly complex and cost-prohibitive, transitioning from planar chip packaging architectures to 2.5D/3D stacked die package architectures has become k... »

IWLPC 2014 To Feature 3D InCites Panel: System-level Advantages of 3D Integration
BelHaba Mike Gianfagna photo SimonMcElrea alapati rbeica haba2 JustBob Simon

IWLPC 2014 To Feature 3D InCites Panel: System-level Advantages of 3D Integration

For the first time this year, 3D InCites is sponsoring a panel discussion at  IWLPC on the topic of System-level Advantages of 3D Integration. For years the industry has discussed and debated 3D inte... »

Low-Temp, Ultra-Fine-Pitch Cu Interconnections for Manufacturable, Solder-free Assembly
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Low-Temp, Ultra-Fine-Pitch Cu Interconnections for Manufacturable, Solder-free Assembly

A novel copper interconnection technology is being pioneered by Georgia Tech’s Packaging Research Center (GT-PRC) to achieve manufacturable solder-free assembly at low temperatures. By interfac... »

TSV MEOL Process Flow for Mobile 3D IC Stacking
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TSV MEOL Process Flow for Mobile 3D IC Stacking

Moore’s law is approaching physical limitations of CMOS scaling, and three dimensional (3D) integration technologies have been proposed as solutions. Wide band transmission between logic and mem... »

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Company News

Rudolph Receives Volume Purchase Order from Major Taiwan OSAT for 2D/3D Inspection Systems

Flanders, New Jersey (August 11, 2014)—Rudolph Technologies, Inc. announced today that it has received a large order from one of Taiwan’s providers of independent semiconductor manufacturing servi... »

Tessera and Micron Execute Technology and Patent License Agreements

Tessera Technologies, Inc.and Micron Technology, Inc. announced today the execution of new, multiyear technology and patent license agreements. In addition to the new patent license agreement, Tesser... »

Rudolph Announces New SONUS Technology and Collaboration with TEL NEXX for Advanced Packaging Process Control

Non-contact, non-destructive acoustic technology fulfills growing need in advanced packaging for thick film metrology up to 100μm and void detection down to 0.5μm Flanders, New Jersey (July 21, 2014... »

Orbotech to Acquire SPTS Technologies to Extend Leadership in Advanced Micro Manufacturing

Yavne, Israel – July 7, 2014 - Orbotech Ltd. (NASDAQ: ORBK) today announced the signing of a definitive share purchase agreement to acquire SPTS Technologies Group Limited (“SPTS”), a U.K.-base... »

SPTS Technologies’ Sigma fxP PVD System Selected by HuaTian Technologies for 300mm Flip Chip Bumping and CMOS Image Sensor Applications

One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion Newport, United Kingdom, 8 July, 2014 – SPTS Technologies, a supplier of advanced wafer... »

SUSS MicroTec launches ELD300 Excimer Laser Debonder for 3D Integration

Garching, July 8, 2014 – SÜSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, announced today the launch of its excimer laser debonde... »

Xcerra™ President and CEO to Join Panel Discussion at Semicon West

Xcerra™ Corporation announced that Dave Tacelli will join the panel discussion “Testing into the Future” at SEMICON West, scheduled to take place July 8 to 10 in San Francisco. The panel discuss... »

EVG GEMINI FB XT Photo

EV Group Clears Key Barriers to 3D-IC/TSVs HVM with Breakthrough Fusion Wafer Bonding Solution

GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50 percent increased throughput.  ST. FLORIAN, Austria... »

SPTS Technologies and CEA-Leti / Nanoelec RTI collaborate on 3D TSV Technology

Leading Semiconductor Equipment Maker and Renowned European Research Institute to Collaborate in Advanced Packaging Technologies under the Framework of Nanoelec RTI Newport, United Kingdom – June 2... »

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