“How Do You Create The Future?” Through Innovations in Heterogeneous Integration and SiP

“How Do You Create The Future?” Through Innovation…

12 hours ago Paul Werbaneth
MEPTEC Luncheons returned big to The Bay Area on Wednesday, May 25, 2016, with a new venue (SEMI HQ)…
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12 hours ago“How Do You Create The Future?” Through Innovation…
IPSO Challenge Update: The Smart Rock Bolt Success Story

IPSO Challenge Update: The Smart Rock Bolt Success…

1 week ago Francoise von Trapp
Six months ago, I interviewed Jens Eliasson, associate professor at Luleå University of Technology (…
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1 week agoIPSO Challenge Update: The Smart Rock Bolt Success…
Convergence on the “Big Five”: Focus on WLCSP

Convergence on the “Big Five”: Focus on WLCSP

2 weeks ago Ron Huemoeller
Part two of a five-part series. How did we determine which technologies are “the Big Five,” for s…
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2 weeks agoConvergence on the “Big Five”: Focus on WLCSP
ASMC 2016, the Return of MEPTEC Luncheons, and Your May Calendar

ASMC 2016, the Return of MEPTEC Luncheons, and You…

3 weeks ago Paul Werbaneth
The Saratoga Springs, NY, horse racing season starts in late July, following a racing tradition that…
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3 weeks agoASMC 2016, the Return of MEPTEC Luncheons, and You…

3D Topics

Meet Me at ECTC 2016 in Las Vegas

Meet Me at ECTC 2016 in Las Vegas

With the industry-wide shift in focus from furthering Moore’s Law to the realization that 3D integration and advanced packaging technologies are the shining stars of the next generation of electroni... »

Challenges and Solutions for EDA of 3D Chip Stacks
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Challenges and Solutions for EDA of 3D Chip Stacks

It is often claimed that 3D chip stacks offer the potential to meet current and future requirements of digital circuits, such as for performance, functionality, and power consumption. Specifically, bo... »

What to Expect on 3D Integration and IoT at the 2016 Symposium on VLSI Technology

What to Expect on 3D Integration and IoT at the 2016 Symposium on VLSI Technology

If you’re planning to attend this year’s combined Symposium on VLSI Technology and Circuits, themed “Inflections for a Smart Society,” which takes place June 13-15, 2016 in Honolulu, HI, and y... »

Making MEMS Lemonade
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Making MEMS Lemonade

In the USA, to motivate optimism when things haven’t turned out as expected, we say: “When life gives you lemons, make lemonade!” In other words, take the sour stuff, and find a way... »

3D Packaging Technologies for Power Electronics
cpesflex

3D Packaging Technologies for Power Electronics

There are a some upcoming events in the realm of power electronics that promise to be very interesting and thought provoking for those interested in 3D packaging. Some of the best and brightest minds... »

Video Channels

Company News

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EV Group Receives Multiple Orders for GEMINI® FB XT Fusion Wafer Bonder for 3D Chip Stacking Production Applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received multiple orders for its GEMIN... »

Amkor and Cadence to Develop PADK for Amkor’s SLIM and SWIFT Packaging Technologies

TEMPE, Ariz., May 2, 2016 — Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cad... »

Cypress Subsidiary Deca Technologies to Receive $60 Million Investment from ASE

SAN JOSE, Calif.,- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX and Deca Technologies, a subsidiary of Cypress Semiconductor Corp. (NASDAQ: CY), today announced the signing of an a... »

Invensas Announces That Sandia National Laboratories Has Licensed ZiBond and DBI Technologies for Advanced 3D Semiconductor Applications

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a new license agreement for ZiBond® and Direct ... »

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Extended Supply Chain Presents Exhibitors with New Opportunities at SEMICON West

SAN JOSE, Calif. — April 18, 2016 — Leading innovators in today’s integrated electronics supply chain are preparing to showcase their products and services at SEMICON West 2016. Attendees will d... »

VLSI

Semiconductor Experts Chart Chip Industry’s Future Direction Beyond the “Moore’s Law” Horizon

HONOLULU, HI (APRIL 20, 2016) – Reflecting the semiconductor industry’s ongoing transition from a focus on geometric scaling to the integration of heterogeneous technologies that will enable the f... »

FOGALE Nanotech Acquires Altatech: Expanded Portfolio Includes Wafer Inspection and Deposition Tools

Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in the development of wafer inspection and material deposition tools fo... »

Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control

Wilmington, Mass.—Rudolph Technologies, Inc. (NYSE: RTEC) is pleased to announce the availability of new, high-speed 3D metrology on its flagship NSX® Series, a highly-flexible inspection and meas... »

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The Advanced Packaging Industry Reaches its Zenith

To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies. Leaders... »

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