SEMICON West 2016: Update from the Semiconductor Suppliers

SEMICON West 2016: Update from the Semiconductor S…

5 days ago Francoise von Trapp
Every year at SEMICON West, in addition to taking in keynotes and technology sessions, I like to cat…
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5 days agoSEMICON West 2016: Update from the Semiconductor S…
The New Heterogeneous Integration Roadmap: Seeing Beyond the Lamp Post

The New Heterogeneous Integration Roadmap: Seeing…

6 days ago Paul Werbaneth
If you, like me, have been wondering about when and where it was you last saw an International Techn…
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6 days agoThe New Heterogeneous Integration Roadmap: Seeing…
Making Connections at SEMICON West 2016

Making Connections at SEMICON West 2016

1 week ago Francoise von Trapp
If you attended SEMICON West 2016 last week, you probably noticed that the event is undergoing a met…
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1 week agoMaking Connections at SEMICON West 2016
Heterogeneous Integration enabled by Advanced Packaging Leads the Way at SEMICON West 2016

Heterogeneous Integration enabled by Advanced Pack…

2 weeks ago Francoise von Trapp
I have to admit, after attending this week’s SEMICON West 2016, I’m feeling a little smug. Why?…
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2 weeks agoHeterogeneous Integration enabled by Advanced Pack…

3D Topics

Convergence on the “Big Five”: Focus on Wafer-based Advanced SiP
wafer-based copy

Convergence on the “Big Five”: Focus on Wafer-based Advanced SiP

In the fourth installment of the series “Convergence on the Big Five,” we compared conventional SiP with advanced system-in-package (SiP), which is focused on laminate-based approaches, and is ava... »

Cast your votes for the 2016 3D InCites Awards

Cast your votes for the 2016 3D InCites Awards

This year’s awards will be decided entirely by your industry peers through this online voting process. The nominees are listed below by category. You must be registered and logged in to vote. Please... »

3D InCites Guide to SEMICON WEST 2016

3D InCites Guide to SEMICON WEST 2016

In past years, we have provided 3D InCites readers with a guide for navigating through the myriad programs that specifically address 3D integration and packaging at SEMICON West. This year, as SEMI ha... »

DAC 2016: There is More to Life than IC Design, Part 2
DAC2016part2

DAC 2016: There is More to Life than IC Design, Part 2

Part 1 of my DAC 53 reporting focused on this year’s really impressive keynotes, now posted on the DAC website, together with videos of other remarkable pavilion presentations, panels, interviews, d... »

Convergence on the “Big Five”: Focus on Laminate-based Advanced SiP
SiP laminate illustration Rama_Alapati_Color_Jun2016[1] copy

Convergence on the “Big Five”: Focus on Laminate-based Advanced SiP

Part four in a five-part series While many industry experts have long predicted the demise of Moore’s law, it’s only in the past few months that it seems we have exhausted current CMOS scaling met... »

Video Channels

Company News

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Rudolph Technologies Announces New Clearfind Technology for Advanced Packaging Inspection

Wilmington, Mass. (July 11, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today unveiled its new patented Clearfind™ technology, which can detect organic defects that are difficult or impossible ... »

EVG50 Automated Metrology System

EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing

FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®50 aut... »

EVG ComBond Automated High-Vacuum Wafer Bonding Platform

EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced new capabilities on the EVG ComBond® automated h... »

MEMS & Sensors Industry Group Invites Collaboration in MEMS, Sensors and ICs at SEMICON West 2016

PITTSBURGH (June 29, 2016) – MEMS & Sensors Industry Group® (MSIG) invites attendees to a special half-day workshop on the convergence of MicroElectroMechanical Systems (MEMS) devices, sensors,... »

Rudolph Receives Multi-System Order From a Leading OSAT for Fan-out Wafer Level Packaging Inspection

Wilmington, Mass. (June 28, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspection, lithography, metrology, and process con... »

Amkor Opens MEMS Packaging Line in China

TEMPE, Ariz., June 28, 2016 – Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconduct... »

EV Group Scores Fourth Consecutive Triple Crown Win in Annual VLSIresearch Customer Satisfaction Survey

FLORIAN, Austria, June 21, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that, for the fo... »

Nanotech company, Smoltek, retains Boucher-Lensch Associates as its financial advisor

Smoltek has appointed Boucher-Lensch Associates LLC (BLA) as financial advisor for its $7 million financing round for the commercialization phase of its unique nanotechnology. BLA provides strategic a... »

EVG GEMINI FB XT Photo 1 EVG GEMINI FB XT Photo 2

EV Group Receives Multiple Orders for GEMINI® FB XT Fusion Wafer Bonder for 3D Chip Stacking Production Applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received multiple orders for its GEMIN... »

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