With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall

With 3D Memory Cubes You Can Finally Break Down th…

2 days ago Herb Reiter
In July and August schools are closed and many people like to take vacation. Typically nothing major…
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2 days agoWith 3D Memory Cubes You Can Finally Break Down th…
Executive Viewpoint: Update on Cleans

Executive Viewpoint: Update on Cleans

1 week ago Francoise von Trapp
Last time I checked in with Kim Pollard, Technology Manager, Dynaloy, was a few years ago, when we t…
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1 week agoExecutive Viewpoint: Update on Cleans
3D NAND at the 2015 Flash Memory Summit - Slipping the Surly Bonds of Earth?

3D NAND at the 2015 Flash Memory Summit – Slipping…

1 week ago Andrew Walker
It’s been many years since I realized that semiconductor conferences were not purely scientific but…
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1 week ago3D NAND at the 2015 Flash Memory Summit – Slipping…
We Few, We Happy Few – Eli Harari and the Golden Thread to System Flash

We Few, We Happy Few – Eli Harari and the Golden T…

2 weeks ago Andrew Walker
An epiphany struck me last week when I attended the Flash Memory Summit in Santa Clara, California.…
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2 weeks agoWe Few, We Happy Few – Eli Harari and the Golden T…

3D Topics

Subscription Renewals:  Can We Move to the 21st Century?

Subscription Renewals: Can We Move to the 21st Century?

If my fitness regimen can be Internet enabled, why can’t my magazine subscription renewals be? We all get them. Some come in emails while most use the phone call approach. You know, the “unrecogni... »

Improving R&D Efficiency to get “Moore” out of Chips
IMS Getting more out of chips OUTLOOK2015

Improving R&D Efficiency to get “Moore” out of Chips

The semiconductor industry invests more in R&D than any other industry except pharmaceuticals. At the same time, It is dealing with shortening product life cycles. How is the industry expected to ... »

Assembly Design Kits are the Future of Package Design Verification
Fig 1 Ferguson Fig 2 Ferguson Fig 3 Ferguson Fig 4 Ferguson 27193114_s

Assembly Design Kits are the Future of Package Design Verification

Unlike the traditional system-on-chip (SoC) design process, which has fully qualified verification methods embodied in the form of process design kits (PDKs), chip design companies and assembly houses... »

In Conversation with Yann Guillou About the SEMI European MEMS Summit 2015
Stefan Finkbeiner Benedetto Vigna Milan 2 Atahotel 1

In Conversation with Yann Guillou About the SEMI European MEMS Summit 2015

Yann Guillou, Membership & Business Development, SEMI Europe, talked with 3D InCites / 3D+ about the upcoming European MEMS Summit 2015, which will be held in Milan, Italy, on 17-18 September. 3D ... »

Cladogenesis: The Clouds Parted Over California to Reveal … IoT, MEMS, FD-SOI, and Heterointegration
Cladogenesis 3D Pitchers 3D InCites Awards Trophies Blooming Flowers

Cladogenesis: The Clouds Parted Over California to Reveal … IoT, MEMS, FD-SOI, and Heterointegration

The semiconductor fabrication industry has been wandering in something of a wilderness recently, what with the continued delays in EUV lithography as a production-ready technology, 450mm gone quiet, ... »

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Company News

TechSearch International Analyzes CSP Market Growth: QFNs Remain “Work Horse” of the Industry

Driven by use in mobile products such as smartphones, CSPs continue to show growth. TechSearch International’s latest CSP market forecast shows an 11% CAGR from 2014 to 2019. One of the categories w... »

New Competence Center for Nanoimprint in North America

Garching/Germany, August 18, 2015 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, and the Singh Center for Nanotechnology at... »

Finetech sigma die bonder

Finetech’s Sigma Die Bonder High Accuracy Targets Advanced Wafer Level Packaging Applications

GILBERT, AZ — August 6, 2015 — Finetech introduces its new FINEPLACER® Sigma bonder, designed to provide a solution for large die up to 100mm, combined with a working area of 450 x 300mm. The FI... »

Samsung 3D Stacked DDR4 DRAM Brings Via-Mid Technology to the Mainstream

LYON, France – July 31, 2015 – System Plus Consulting, sister company of Yole Développement (Yole), released its new reverse costing report, Samsung 3D TSV stacked DDR4 DRAM. In August 2014 Samsu... »

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EV Group Receives 3D InCites Award for Gemini FB XT Automated Fusion Wafer Bonder

ST. FLORIAN, Austria, July 30, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has ... »

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

Flanders, New Jersey (July 14, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software... »

Equipment Sentinel Fault Detection and Classification Software from Rudolph Technologies Maximizes Value from all Fab Data

Flanders, New Jersey (July 14, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) today introduced Equipment Sentinel™, a state-of-the-art, automated fault detection and classification (FDC) software s... »

Aveni_Logo_FL

Alchimer Rebrands as aveni; Enters Technology Commercialization Phase

Company secures $13.5M in funding led by a semiconductor chipmaker and ALIAD; Positioned to revolutionize the copper plating processes at 14nm and below  MASSY, France – July 13, 2015 – Alchimer ... »

CODEX-Stocker_700

Genmark Automation Launches CODEX Stocker; Industry’s First Integrated Stocker, Sorter and Metrology System

Tool frees up valuable fab floor space for production equipment; allows for internal expansion of manufacturing capacity  Fremont, Calif., July 13, 2015 ­– Genmark Automation, a global leader in t... »

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