There is an active and robust supply chain currently supporting these wafer sizes in the semiconductor manufacturing industry: 3”; 4”; 6”; 200mm; 300mm; and 330mm.
Thermal management is one of the last vestiges of 3D integration challenges. As such, the European 3D Summit (Jan 23-25, 2017) devoted its entire R&D
The 5th Annual European 3D Summit drew 220 attendees from 18 countries who gathered to understand the latest advanced packaging, 2.5D and 3D IC technologies
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and
Last week, I posted an executive summary of this year’s European 3D Summit, touching on the highlights and general takeaways based on the closing remarks
In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology offerings of Fogale Nanotech Semicon
“Those who cannot remember the past are condemned to repeat it” ~ George Santayana Over the past forty years, the presence of legally protected Intellectual Property (IP) has dramatically grown
Every year, I attend most of the events that are focused on 3D integration and related approaches to semiconductor advanced packaging. One thing that I’ve
Grenoble, France – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan-out WLP (FO-WLP).
As the two-dimensional (2D) shrinking of planar circuits (on which Gordon Moore based his famous observation) has become more difficult and expensive, the semiconductor industry
The era of “More than Moore” was alive and well in 2016 as the semiconductor industry witnessed many new developments in advanced packaging. Among these
While it seems that the semiconductor industry has suddenly embraced heterogeneous integration as the next revolutionary innovation to further the quest for higher performance and
It’s that time of year again! For the 5th consecutive year, SEMI Europe is hosting the European 3D Summit (formerly known as the 3D TSV
The 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) conference is one of the biggest (if not THE biggest) event focused exclusively on the
How can the Internet of Things change the future of the average citizen? To answer this question, imec joins forces with the City of Antwerp