Semiconductor Equipment Manufacturer Consolidation Update

Semiconductor Equipment Manufacturer Consolidation…

5 hours ago Francoise von Trapp
It was a much-talked-about topic this year at SEMICON West 2014 (SW2014) – this trend of semiconduct…
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5 hours agoSemiconductor Equipment Manufacturer Consolidation…
The Internet of Things and Semiconductor Test

The Internet of Things and Semiconductor Test

1 day ago Herb Reiter
Herb Reiter,eda2asic, presented this poster presentation titled "The Internet of Things and Semicond…
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1 day agoThe Internet of Things and Semiconductor Test
SEMICON West 2014: Supplier Updates for 2.5D and 3D Processes

SEMICON West 2014: Supplier Updates for 2.5D and 3…

2 days ago Francoise von Trapp
SEMICON West 2014 brought its usual flurry of supplier announcements on new equipment and process im…
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2 days agoSEMICON West 2014: Supplier Updates for 2.5D and 3…
Apple and IBM on the Way to Demonstrate That ONE plus ONE is More Than TWO

Apple and IBM on the Way to Demonstrate That ONE p…

6 days ago Herb Reiter
Tuesday’s (July 15) Nightly Business Report surprised me with an – in my view – very important annou…
Read More
6 days agoApple and IBM on the Way to Demonstrate That ONE p…
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3D Topics

Market Outlook for Permanent Wafer Bonding
amandine philg Illustration#1_TechnologyOverview_PermanentWaferBonding_YoleDeveloppement_July2014 Illustration#2_Ziptronix Cu-Cu_PermanentWaferBonding_YoleDeveloppement_July2014 Illustration#3_PermanentWaferBondingVsApplications_YoleDeveloppement_July2014

Market Outlook for Permanent Wafer Bonding

Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized into insulating layers including glass frit bonding, adhesi... »

Electrical Design and Modeling Challenges for 3D Systems Integration
Electrical Design and Modeling Challenges for 3D Systems Integration 3DTutorialDesignCon2012 New

Electrical Design and Modeling Challenges for 3D Systems Integration

Over the last several years, the buzzword in the electronics industry has been “More than Moore”, referring to the embedding of components in the the package substrate and stacking of ICs ... »

A Path Finding Based SI Design Methodology for 3D Integration
A Path Finding Based SI Design Methodology for 3D Integration

A Path Finding Based SI Design Methodology for 3D Integration

3D integration is being touted as the next semiconductor revolution by industry. 3D integration involves the use of various interconnects that include balls, pillars, bond wires, through silicon vias ... »

Path Finding: Who Performs and When?
Path Finding: Who Performs and When?

Path Finding: Who Performs and When?

Microelectronic products all have mechanical, thermal and electrical properties that degrade until the device is permanently damaged. Path finding adds value to an end-product by pre-determining where... »

2.5/3D Packaging: Path Finding
pathfinding copy 2.5/3.0D packaging: Path Finding

2.5/3D Packaging: Path Finding

2.5D/3D packaging technologies are revitalizing creativity in high technology products. We thought we knew what faster, better, lighter and smaller meant. 2.5D/3D packaging can revolutionize what we t... »

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Company News

Rudolph Announces New SONUS Technology and Collaboration with TEL NEXX for Advanced Packaging Process Control

Non-contact, non-destructive acoustic technology fulfills growing need in advanced packaging for thick film metrology up to 100μm and void detection down to 0.5μm Flanders, New Jersey (July 21, 2014... »

Orbotech to Acquire SPTS Technologies to Extend Leadership in Advanced Micro Manufacturing

Yavne, Israel – July 7, 2014 - Orbotech Ltd. (NASDAQ: ORBK) today announced the signing of a definitive share purchase agreement to acquire SPTS Technologies Group Limited (“SPTS”), a U.K.-base... »

SPTS Technologies’ Sigma fxP PVD System Selected by HuaTian Technologies for 300mm Flip Chip Bumping and CMOS Image Sensor Applications

One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion Newport, United Kingdom, 8 July, 2014 – SPTS Technologies, a supplier of advanced wafer... »

SUSS MicroTec launches ELD300 Excimer Laser Debonder for 3D Integration

Garching, July 8, 2014 – SÜSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, announced today the launch of its excimer laser debonde... »

Xcerra™ President and CEO to Join Panel Discussion at Semicon West

Xcerra™ Corporation announced that Dave Tacelli will join the panel discussion “Testing into the Future” at SEMICON West, scheduled to take place July 8 to 10 in San Francisco. The panel discuss... »

EVG GEMINI FB XT Photo

EV Group Clears Key Barriers to 3D-IC/TSVs HVM with Breakthrough Fusion Wafer Bonding Solution

GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50 percent increased throughput.  ST. FLORIAN, Austria... »

SPTS Technologies and CEA-Leti / Nanoelec RTI collaborate on 3D TSV Technology

Leading Semiconductor Equipment Maker and Renowned European Research Institute to Collaborate in Advanced Packaging Technologies under the Framework of Nanoelec RTI Newport, United Kingdom – June 2... »

SUSS MicroTec Receives Order for Next-Gen Projection Scanner DSC300 Gen2

Garching, June 12, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully qualified its new DSC300 Gen2 proje... »

SPTS Technologies’ Silicon Etch Tool Chosen for 300mm CMOS Image Sensor Applicatons

Move to 300mm Strengthens Customer’s Position in the Rapidly Growing CMOS Image Sensor Market Newport, United Kingdom, 29 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing sol... »


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