Cast your votes for the 2016 3D InCites Awards

Cast your votes for the 2016 3D InCites Awards

6 days ago Francoise von Trapp
This year’s awards will be decided entirely by your industry peers through this online voting proces…
Read More
6 days agoCast your votes for the 2016 3D InCites Awards
Ag Tech, Analog Devices, and the Quantified Tomato

Ag Tech, Analog Devices, and the Quantified Tomato

6 days ago Paul Werbaneth
The Quantified Self movement has made headlines and grabbed press attention in recent years, ever si…
Read More
6 days agoAg Tech, Analog Devices, and the Quantified Tomato
3D/TSV Officially Recognized as Advanced Manufacturing Technology at SEMI ASMC 2016

3D/TSV Officially Recognized as Advanced Manufactu…

1 week ago Paul Werbaneth
As Dick James, Chipworks, puts it, the SEMI Advanced Manufacturing Conference is “… an annual confer…
Read More
1 week ago3D/TSV Officially Recognized as Advanced Manufactu…
Supplier Updates from ECTC 2016

Supplier Updates from ECTC 2016

2 weeks ago Francoise von Trapp
In addition to attending the panel and plenary sessions at ECTC 2016, which took place May 31-June 3…
Read More
2 weeks agoSupplier Updates from ECTC 2016

3D Topics

Reinventing Paper for Electronics and 3D Technology
Figure3 Figure1a Figure2 Figure1b

Reinventing Paper for Electronics and 3D Technology

Organic paper, particularly cellulose-based paper, efficiently served in previous eras as an engineering material. In the Tang dynasty, soldier armors were mainly made of paper [57]. In the era of ana... »

What is Driving the Advanced Packaging Market in China?
ADVPackaging_China_ICMarketForecast_YOLE_June2016_373x280 ADVPackaging_China_WaferForecastYOLE_June2016_373x280 ILLUS_ADVPackaging_China_ICMarketForecast_YOLE_June2016 ILLUS_ADVPackaging_China_WaferForecastYOLE_June2016

What is Driving the Advanced Packaging Market in China?

Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach... »

Advancements in Carbon Nanostructures for Advanced Packaging Applications
Download it here.

Advancements in Carbon Nanostructures for Advanced Packaging Applications

Moore’s law has guided the continuing miniaturization and performance enhancements of silicon chips for the semiconductor industry by scaling the transistor size. After 50 years, the industry is now... »

DAC 2016: There is More to Life than IC Design
DAC2016

DAC 2016: There is More to Life than IC Design

In the past, the Design Automation Conference was known to me and many of my colleagues as the annual event that focused on IC design tools, flows, and methodologies. EDA tools vendors and users got ... »

Make Every Market Smarter: An Interview with SEMI’s Yann Guillou on the European MEMS Summit

Make Every Market Smarter: An Interview with SEMI’s Yann Guillou on the European MEMS Summit

SEMI’s first edition of the European MEMS Summit, which took place in 2015 in Milan, was a stellar success, attracting 265 attendees from 21 countries. The second edition will take September 15-16, ... »

Video Channels

Company News

EV Group Scores Fourth Consecutive Triple Crown Win in Annual VLSIresearch Customer Satisfaction Survey

FLORIAN, Austria, June 21, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that, for the fo... »

Nanotech company, Smoltek, retains Boucher-Lensch Associates as its financial advisor

Smoltek has appointed Boucher-Lensch Associates LLC (BLA) as financial advisor for its $7 million financing round for the commercialization phase of its unique nanotechnology. BLA provides strategic a... »

EVG GEMINI FB XT Photo 1 EVG GEMINI FB XT Photo 2

EV Group Receives Multiple Orders for GEMINI® FB XT Fusion Wafer Bonder for 3D Chip Stacking Production Applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received multiple orders for its GEMIN... »

Amkor and Cadence to Develop PADK for Amkor’s SLIM and SWIFT Packaging Technologies

TEMPE, Ariz., May 2, 2016 — Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cad... »

Cypress Subsidiary Deca Technologies to Receive $60 Million Investment from ASE

SAN JOSE, Calif.,- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX and Deca Technologies, a subsidiary of Cypress Semiconductor Corp. (NASDAQ: CY), today announced the signing of an a... »

Invensas Announces That Sandia National Laboratories Has Licensed ZiBond and DBI Technologies for Advanced 3D Semiconductor Applications

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a new license agreement for ZiBond® and Direct ... »

scw-extnd-splychn-forum_300x120_0

Extended Supply Chain Presents Exhibitors with New Opportunities at SEMICON West

SAN JOSE, Calif. — April 18, 2016 — Leading innovators in today’s integrated electronics supply chain are preparing to showcase their products and services at SEMICON West 2016. Attendees will d... »

VLSI

Semiconductor Experts Chart Chip Industry’s Future Direction Beyond the “Moore’s Law” Horizon

HONOLULU, HI (APRIL 20, 2016) – Reflecting the semiconductor industry’s ongoing transition from a focus on geometric scaling to the integration of heterogeneous technologies that will enable the f... »

FOGALE Nanotech Acquires Altatech: Expanded Portfolio Includes Wafer Inspection and Deposition Tools

Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in the development of wafer inspection and material deposition tools fo... »

Community Activity