Intent in fostering collaborative innovation across the supply chain, Yole Développement and the National Center for Advanced Packaging (NCAP) teamed up to present the first Advanced Packaging and In... »
“From so simple a beginning endless forms most beautiful and most wonderful have been, and are being, evolved.” ~ Charles Darwin Charles Darwin was obviously not thinking of 3D semiconductor memor... »
3D integration has created a complex landscape of many different package architectures and integration approaches that have diverse materials needs and uncertain insertion timing. The multitude of pro... »
CMOS image sensors (CIS) have often been heralded as the first 3D devices in volume manufacturing. However this is not really the case. Shellcase MVP, the first generation of CIS that used through s... »
One look at the agenda for the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP), and it becomes clear that this year the conference organizers have left no... »
This year’s European 3D TSV Summit, January 19-21, 2015, Grenoble France, will focus on how interposers and 3D ICs can help us create smarter systems. To help set the stage, the steering committee e... »
Nordson DAGE, a division of Nordson Corporation, is pleased to announce its most recent order from a major customer in the semiconductor industry for its XM8000 wafer x-ray metrology tool that will be... »
OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, today announced the OV23850 and OV21840, a family of PureCel-S™ 20+ megapixel image sensors w... »
Tango Systems Inc., a leading innovator in high-performance, cost-effective physical vapor deposition (PVD) systems, today announced it has published results for conformal step seed layer coverage for... »
As 3D integration processes move into volume manufacturing, the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP), which takes place December 10-12 in San F... »
Garching, October 7, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched its next-generation semi-automated permanent ... »
On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France. After the last successful edition that brought over 330 participants from over 21 countries in... »
Major DRAM makers Micron, SK Hynix, and Samsung have announced versions of stacked memory with through silicon vias (TSVs) for high-performance applications. Some CMOS image sensors are also in produc... »
I’m pretty sure the time I got to spend last week at the SEMI High Tech U Graduation ceremonies was the most fun I’ve had all year. The event was held at KLA Tencor in San Jose, CA, November 13, 2014, and I was […]
One look at the agenda for the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP), and it becomes clear that this year the conference organizers have left no stone […]
When I was a little kid, my (much older) brothers had to have PF Flyers, because according to the commercial on TV, they made you “jump high” and “run fast”. The Playtex Cross-Your Heart Bra boasted that it could “lift and separate”. And angle-necked Reach toothbrushes were the latest advancement in preventing tooth decay.
This year’s European 3D TSV Summit, January 19-21, 2015, Grenoble France, will focus on how interposers and 3D ICs can help us create smarter systems. To help set the stage, the steering committee engaged a number of influential industry speakers to share their perspectives.
Bryan Black, Senior Fellow, AMD will present new information in his…[Read more]
If you are anyone doing anything important, or wanting to know anything important about MEMS and Sensors, then you were probably at the MEMS Industry Group (MIG)’s MEMS Executive Congress US 2014, from November 5-7, in Scottsdale, AZ.
(Or else you were in Phoenix for the NASCAR race, which is why I couldn’t get the Avis car I had reserved. But…[Read more]