GSA 3D IC Working Group Looks at 3D IC Readiness from Design through Manufacturing

GSA 3D IC Working Group Looks at 3D IC Readiness f…

1 day ago Francoise von Trapp
At the recent GSA 3D IC Working Group Meeting (October 22, 2014), where speakers from BroadPak, Amko…
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1 day agoGSA 3D IC Working Group Looks at 3D IC Readiness f…
3D Technology Snapshots from IMAPS 2014

3D Technology Snapshots from IMAPS 2014

3 days ago Francoise von Trapp
This year’s IMAPS International Symposium purported to have “the most interposer and 3D content unde…
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3 days ago3D Technology Snapshots from IMAPS 2014
IMAPS 2014: The Future of Packaging is System Integration

IMAPS 2014: The Future of Packaging is System Inte…

6 days ago Francoise von Trapp
The annual International Microelectronics and Packaging Society (IMAPS) International Symposium has…
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6 days agoIMAPS 2014: The Future of Packaging is System Inte…
3D By Design: Exploring Viable Path Finding

3D By Design: Exploring Viable Path Finding

1 week ago Bill Martin
Fruitful path finding eventually identifies solutions that are viable for mechanical, electrical, t…
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1 week ago3D By Design: Exploring Viable Path Finding
 

3D Topics

2014 Advanced Packaging and Integration Technology Symposium Spreads Message of Collaborative Innovation
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2014 Advanced Packaging and Integration Technology Symposium Spreads Message of Collaborative Innovation

Intent in fostering collaborative innovation across the supply chain, Yole Développement and the National Center for Advanced Packaging (NCAP) teamed up to present the first Advanced Packaging and In... »

Book Review: Vertical 3D Memory Technologies
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Book Review: Vertical 3D Memory Technologies

“From so simple a beginning endless forms most beautiful and most wonderful have been, and are being, evolved.” ~ Charles Darwin Charles Darwin was obviously not thinking of 3D semiconductor memor... »

Addressing 3D Integration Challenges: Designing Materials for a Complex Landscape
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Addressing 3D Integration Challenges: Designing Materials for a Complex Landscape

3D integration has created a complex landscape of many different package architectures and integration approaches that have diverse materials needs and uncertain insertion timing. The multitude of pro... »

Kulicke & Soffa Stack the Dice for 2.5D and 3D IC Assembly
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Kulicke & Soffa Stack the Dice for 2.5D and 3D IC Assembly

It’s been a long time coming, but Kulicke & Soffa has seen the writing on the wall, and it reads: “2.5D and 3D IC assembly is a hot market.” Why else would the wire-bond giant invest in ... »

The Future of Image Sensors is Chip Stacking
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The Future of Image Sensors is Chip Stacking

CMOS image sensors (CIS) have often been heralded as the first 3D devices in volume manufacturing. However this is not really the case. Shellcase MVP, the first generation of CIS that used through s... »

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Company News

3D ASIP 2014 Pre-Conference Symposia Place Emphasis on 3D Design Tools and Flow, and Manufacturing Process Technology

As 3D integration processes move into volume manufacturing, the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP), which takes place December 10-12 in San F... »

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SUSS MicroTec Launches SB6/8 Gen2: A Next-Generation Semi-Automated Permanent Wafer Bonder

Garching, October 7, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched its next-generation semi-automated permanent ... »

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European 3D TSV Summit: “Smarter System Integration” Theme to Focus on Both Business and Technology

On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France. After the last successful edition that brought over 330 participants from over 21 countries in... »

TechSearch International 3D IC Gap Analysis Details Market Growth for 3D ICs and 2.5D Interposers

Major DRAM makers Micron, SK Hynix, and Samsung have announced versions of stacked memory with through silicon vias (TSVs) for high-performance applications. Some CMOS image sensors are also in produc... »

Fermilab Implements Ziptronix’s DBI Hybrid Bonding in High-End 3D Image Sensors

Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D... »

Kulicke & Soffa Introduces APAMA – New Thermo-Compression Bonder

Kulicke and Soffa Industries, Inc. announced the introduction of APAMA (Advanced Packaging with Adaptive Machine Analytics), the Company’s new Chip-to-Substrate (C2S) bonder that answers today’s t... »

Rudolph Receives Volume Purchase Order from Major Taiwan OSAT for 2D/3D Inspection Systems

Flanders, New Jersey (August 11, 2014)—Rudolph Technologies, Inc. announced today that it has received a large order from one of Taiwan’s providers of independent semiconductor manufacturing servi... »

Tessera and Micron Execute Technology and Patent License Agreements

Tessera Technologies, Inc.and Micron Technology, Inc. announced today the execution of new, multiyear technology and patent license agreements. In addition to the new patent license agreement, Tesser... »

Rudolph Announces New SONUS Technology and Collaboration with TEL NEXX for Advanced Packaging Process Control

Non-contact, non-destructive acoustic technology fulfills growing need in advanced packaging for thick film metrology up to 100μm and void detection down to 0.5μm Flanders, New Jersey (July 21, 2014... »

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