More Food for Thought From The 2016 European MEMS Summit

More Food for Thought From The 2016 European MEMS…

3 days ago Francoise von Trapp
Granted, while there may not have been a single “aha!” moment at the 2016 European MEMS Summit, held…
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3 days agoMore Food for Thought From The 2016 European MEMS…
GLOBALFOUNDRIES Exceeds Expectations at GTC 2016

GLOBALFOUNDRIES Exceeds Expectations at GTC 2016

4 days ago Paul Werbaneth
If you need hard evidence that consolidation in the semiconductor industry can be a good thing, then…
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4 days agoGLOBALFOUNDRIES Exceeds Expectations at GTC 2016
European MEMS Summit 2016: Are MEMS Manufacturers Richer than Last Year?

European MEMS Summit 2016: Are MEMS Manufacturers…

4 days ago Francoise von Trapp
After the European MEMS Summit 2016 concluded on Friday afternoon (September 15-16, 2016), one of th…
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4 days agoEuropean MEMS Summit 2016: Are MEMS Manufacturers…
MEMS and Sensors Industry Group Becomes Part of SEMI

MEMS and Sensors Industry Group Becomes Part of SE…

5 days ago Francoise von Trapp
Peter Clarke, EE Times, and I both agree – the biggest news of this year’s SEMI MEMS Summit, which t…
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5 days agoMEMS and Sensors Industry Group Becomes Part of SE…

3D Topics

System Plus Consulting confirms: Apple A10 processor uses TSMC’s inFO technology
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System Plus Consulting confirms: Apple A10 processor uses TSMC’s inFO technology

System Plus Consulting announces the release in the next few weeks of a complete report on TSMC’s Integrated Fan-Out (inFO) technology used for Apple’s A10® processor packaging. And few results ... »

A Fan-Out Wafer Level Packaging Epiphany
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A Fan-Out Wafer Level Packaging Epiphany

I’ve had an epiphany regarding fan-out wafer level packaging (FOWLP). Epiphany: “A usually sudden manifestation or perception of the essential nature or meaning of something.” In FvT’s piece ... »

plasma dicing
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The Growth and Emergence of New Dicing Technologies

Driven by rising demand for thinner wafers and stronger die, dicing technologies are evolving. “Reaching more than US$100 million in 2015, the dicing equipment market will double by 2020-2021”, an... »

Executive Viewpoint: Lithography’s Rising Star in the Year of the Fan-Out Package
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Executive Viewpoint: Lithography’s Rising Star in the Year of the Fan-Out Package

There is no doubt about it, 2016 is turning out to be the year of fan-out wafer level packaging (FOWLP) as the entire semiconductor industry turns to advanced wafer level packaging and system-in-packa... »

Top Ten Reasons to Attend the 2016 European MEMS Summit
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Top Ten Reasons to Attend the 2016 European MEMS Summit

Ok everybody, here it is, back by popular demand: the TOP TEN reasons (this time told in photos) why you don’t want to miss the second annual European MEMS Summit, which takes place September 15-1... »

Video Channels

Company News

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Leti Orders HERCULES® NIL System from EV Group for Joint Nanoimprint Lithography Program

Nanoimprint lithography (NIL) system will bolster process development and demo capabilities of INSPIRE program EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the ME... »

Firefly system Dragonfly system

Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing

Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding needs across front- and back-end processes Wilmington, ... »

Deca Technologies Receives Major Investment for M-Series™ Fan-out Growth

TEMPE, Arizona – September 1, 2016 – Deca Technologies, a wafer level electronic interconnect solutions provider to the semiconductor industry, announced today the receipt of an additional $51.5 m... »

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Will Fan-out Packaging be Sustainable Long-term?

2016 is a turning point for the Fan-Out packaging market since both leaders, Apple and TSMC changed the game and may create a trend of acceptance of fan-out packages. Yole Développement (Yole) is ana... »

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Leading Market Analysts to Explore Future of MEMS at the European MEMS Summit

The second annual European MEMS Summit takes place in Stuttgart, Germany, on September 15-16, 2016. In addition to top MEMS technologists, the summit will feature numerous market experts to speak ab... »

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Rudolph Technologies Announces New Clearfind Technology for Advanced Packaging Inspection

Wilmington, Mass. (July 11, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today unveiled its new patented Clearfind™ technology, which can detect organic defects that are difficult or impossible ... »

EVG50 Automated Metrology System

EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing

FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®50 aut... »

EVG ComBond Automated High-Vacuum Wafer Bonding Platform

EV Group Expands High-Vacuum Wafer Bonding Capabilities of EVG ComBond Platform for High-Volume MEMS Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced new capabilities on the EVG ComBond® automated h... »

MEMS & Sensors Industry Group Invites Collaboration in MEMS, Sensors and ICs at SEMICON West 2016

PITTSBURGH (June 29, 2016) – MEMS & Sensors Industry Group® (MSIG) invites attendees to a special half-day workshop on the convergence of MicroElectroMechanical Systems (MEMS) devices, sensors,... »