Convergence of the Big Five: Focus on Low-cost Flip Chip

Convergence of the Big Five: Focus on Low-cost Fli…

1 week ago Ron Huemoeller
Over the past few years, there has been a significant shift from PCs and notebooks to smartphones an…
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1 week agoConvergence of the Big Five: Focus on Low-cost Fli…
Start Your 2.5D HBM Design Today

Start Your 2.5D HBM Design Today

2 weeks ago Amkor Technology
High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technol…
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2 weeks agoStart Your 2.5D HBM Design Today
Opportunities for 2.5D and 3D Cost Reduction

Opportunities for 2.5D and 3D Cost Reduction

3 weeks ago Amy Palesko Lujan
A little over a year ago, I wrote a Knowledge Portal entry about the cost of 3D ICs. Here I am again…
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3 weeks agoOpportunities for 2.5D and 3D Cost Reduction
High Tech, AgTech, Steinbeck: A Distinctive Note of Silicon in the Salinas Valley Terroir

High Tech, AgTech, Steinbeck: A Distinctive Note…

4 weeks ago Paul Werbaneth
Keizai Silicon Valley, the organization here promoting network-building as a means of achieving succ…
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4 weeks agoHigh Tech, AgTech, Steinbeck: A Distinctive Note…

3D Topics

What to Expect on 3D Integration and IoT at the 2016 Symposium on VLSI Technology

What to Expect on 3D Integration and IoT at the 2016 Symposium on VLSI Technology

If you’re planning to attend this year’s combined Symposium on VLSI Technology and Circuits, themed “Inflections for a Smart Society,” which takes place June 13-15, 2016 in Honolulu, HI, and y... »

Making MEMS Lemonade
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Making MEMS Lemonade

In the USA, to motivate optimism when things haven’t turned out as expected, we say: “When life gives you lemons, make lemonade!” In other words, take the sour stuff, and find a way... »

3D Packaging Technologies for Power Electronics
cpesflex

3D Packaging Technologies for Power Electronics

There are a some upcoming events in the realm of power electronics that promise to be very interesting and thought provoking for those interested in 3D packaging. Some of the best and brightest minds... »

Image source gratisography.com
Figure 1. Standard wafer test. Figure 2. 3D test. Hybrid test. 3D IC memory BIST

3D IC Test: Now and The Road Ahead

Solutions for 3D IC test are ready today, but they will be more ready tomorrow. At the 2015 ISTFA, I presented a tutorial titled “What is New in 3D, Digital Testing?” and I’ll summarize the main... »

Advanced Packaging and 3D come to MRS Spring Meeting
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Advanced Packaging and 3D come to MRS Spring Meeting

For the first time ever, the Materials Research Society (MRS) brought its annual Spring meeting to Phoenix. I have never attended this event, as it is deeply academic, and has not been on my radar for... »

Video Channels

Company News

Invensas Announces That Sandia National Laboratories Has Licensed ZiBond and DBI Technologies for Advanced 3D Semiconductor Applications

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a new license agreement for ZiBond® and Direct ... »

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Extended Supply Chain Presents Exhibitors with New Opportunities at SEMICON West

SAN JOSE, Calif. — April 18, 2016 — Leading innovators in today’s integrated electronics supply chain are preparing to showcase their products and services at SEMICON West 2016. Attendees will d... »

VLSI

Semiconductor Experts Chart Chip Industry’s Future Direction Beyond the “Moore’s Law” Horizon

HONOLULU, HI (APRIL 20, 2016) – Reflecting the semiconductor industry’s ongoing transition from a focus on geometric scaling to the integration of heterogeneous technologies that will enable the f... »

FOGALE Nanotech Acquires Altatech: Expanded Portfolio Includes Wafer Inspection and Deposition Tools

Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in the development of wafer inspection and material deposition tools fo... »

Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control

Wilmington, Mass.—Rudolph Technologies, Inc. (NYSE: RTEC) is pleased to announce the availability of new, high-speed 3D metrology on its flagship NSX® Series, a highly-flexible inspection and meas... »

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The Advanced Packaging Industry Reaches its Zenith

To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies. Leaders... »

Amkor Technology Takes Leadership Position in Advanced System-in-Package Market

TEMPE, Ariz. – March 23, 2016 – Amkor Technology Inc. (Nasdaq: AMKR), a leading semiconductor packaging and test service provider, today announced it has shipped 700 million RF and front-end advan... »

KLA-Tencor Corp. Receives Intel’s Preferred Quality Supplier Award

KLA-Tencor Corp. has been recognized as one of 26 companies receiving Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2015. KLA-Tencor Corp.has demonstrated indus... »

EV Group Joins IRT Nanoelec 3D Integration Program

ST. FLORIAN, Austria – Feb. 5, 2016 – EV Group (EVG), an industry-leading supplier of wafer-bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning and inspect... »

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