The Future of Image Sensors is Chip Stacking

The Future of Image Sensors is Chip Stacking

1 day ago Francoise von Trapp
CMOS image sensors (CIS) have often been heralded as the first 3D devices in volume manufacturing. H…
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1 day agoThe Future of Image Sensors is Chip Stacking
The Intel Developer Forum 2014

The Intel Developer Forum 2014

5 days ago Herb Reiter
This week I had the privilege to attend my first Intel Developer Forum (IDF). Like many of us, I hav…
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5 days agoThe Intel Developer Forum 2014
Lithography Challenges for 2.5D Interposer Manufacturing

Lithography Challenges for 2.5D Interposer Manufac…

2 weeks ago Klaus Ruhmer
In recent years, 2.5D packaging has quickly gained acceptance as an advanced packaging process, and…
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2 weeks agoLithography Challenges for 2.5D Interposer Manufac…
Are we Getting Mixed Messages on 3D IC Production?

Are we Getting Mixed Messages on 3D IC Production?

2 weeks ago Francoise von Trapp
While 3D IC production is underway for memory devices, some say demand for 3D ICs is still years awa…
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2 weeks agoAre we Getting Mixed Messages on 3D IC Production?
 

3D Topics

Next-Gen MEMS Simulation Tool Makes Life Easier for ASIC Designers
MEMS+ 50 Briefing 2014-09-09

Next-Gen MEMS Simulation Tool Makes Life Easier for ASIC Designers

I don’t usually write about MEMS. But every once in a while, when MEMS (stands for micro-electromechanical systems) touches anything to do with 3D integration, usually at the system-level, I might v... »

Semicon EUROPA

Where to find 3D Integration at SEMICON Europa

While at first glance, 3D integration technologies seem to be relegated to one two-hour session at this year’s SEMICON Europa, which takes place October 7-9, 2014 in Grenoble, France; in reality 3D ... »

Glass Substrates for Advanced Packaging
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Glass Substrates for Advanced Packaging

Glass has many properties that make it an ideal substrate for interposers such as: ultra-high resistivity and low electrical loss, low dielectric constant, and adjustable coefficient of thermal expans... »

Lithography Process Innovations Part 2: Improving Thermo-mechanical Reliability of TSV Interconnects
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Lithography Process Innovations Part 2: Improving Thermo-mechanical Reliability of TSV Interconnects

In Part 1 of this article series, we noted that despite the potential benefits associated with 3D and interposer-based 2.5D designs, the incorporation of TSVs poses significant challenges to the perfo... »

Lithography Process Innovations for 2.5/3D Part 1: Alleviating TSV Stress
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Lithography Process Innovations for 2.5/3D Part 1: Alleviating TSV Stress

As traditional semiconductor scaling becomes increasingly complex and cost-prohibitive, transitioning from planar chip packaging architectures to 2.5D/3D stacked die package architectures has become k... »

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Company News

Fermilab Implements Ziptronix’s DBI Hybrid Bonding in High-End 3D Image Sensors

Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D... »

Kulicke & Soffa Introduces APAMA – New Thermo-Compression Bonder

Kulicke and Soffa Industries, Inc. announced the introduction of APAMA (Advanced Packaging with Adaptive Machine Analytics), the Company’s new Chip-to-Substrate (C2S) bonder that answers today’s t... »

Rudolph Receives Volume Purchase Order from Major Taiwan OSAT for 2D/3D Inspection Systems

Flanders, New Jersey (August 11, 2014)—Rudolph Technologies, Inc. announced today that it has received a large order from one of Taiwan’s providers of independent semiconductor manufacturing servi... »

Tessera and Micron Execute Technology and Patent License Agreements

Tessera Technologies, Inc.and Micron Technology, Inc. announced today the execution of new, multiyear technology and patent license agreements. In addition to the new patent license agreement, Tesser... »

Rudolph Announces New SONUS Technology and Collaboration with TEL NEXX for Advanced Packaging Process Control

Non-contact, non-destructive acoustic technology fulfills growing need in advanced packaging for thick film metrology up to 100μm and void detection down to 0.5μm Flanders, New Jersey (July 21, 2014... »

Orbotech to Acquire SPTS Technologies to Extend Leadership in Advanced Micro Manufacturing

Yavne, Israel – July 7, 2014 - Orbotech Ltd. (NASDAQ: ORBK) today announced the signing of a definitive share purchase agreement to acquire SPTS Technologies Group Limited (“SPTS”), a U.K.-base... »

SPTS Technologies’ Sigma fxP PVD System Selected by HuaTian Technologies for 300mm Flip Chip Bumping and CMOS Image Sensor Applications

One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion Newport, United Kingdom, 8 July, 2014 – SPTS Technologies, a supplier of advanced wafer... »

SUSS MicroTec launches ELD300 Excimer Laser Debonder for 3D Integration

Garching, July 8, 2014 – SÜSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, announced today the launch of its excimer laser debonde... »

Xcerra™ President and CEO to Join Panel Discussion at Semicon West

Xcerra™ Corporation announced that Dave Tacelli will join the panel discussion “Testing into the Future” at SEMICON West, scheduled to take place July 8 to 10 in San Francisco. The panel discuss... »

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