Addressing Advanced Packaging Challenges in 2017 and Beyond

Addressing Advanced Packaging Challenges in 2017 and Beyond


January 17, 2017    Gurvinder Singh

As the two-dimensional (2D) shrinking of planar circuits (on which Gordon Moore based his famous observation) has become more difficult and expensive, the semiconductor industry

Outlook 2017: Advanced Packaging Technology Takes Center Stage

Outlook 2017: Advanced Packaging Technology Takes Center Stage


January 12, 2017    Thomas Uhrmann

The era of “More than Moore” was alive and well in 2016 as the semiconductor industry witnessed many new developments in advanced packaging. Among these

What the Heterogeneous Integration Technology Roadmap Will Mean for 2017

What the Heterogeneous Integration Technology Roadmap Will Mean for 2017


January 11, 2017    Robert Kavanagh

While it seems that the semiconductor industry has suddenly embraced heterogeneous integration as the next revolutionary innovation to further the quest for higher performance and

Top Ten Reasons to Attend the 2017 European 3D Summit

Top Ten Reasons to Attend the 2017 European 3D Summit


January 9, 2017    Francoise von Trapp

It’s that time of year again! For the 5th consecutive year, SEMI Europe is hosting the European 3D Summit (formerly known as the 3D TSV

13th 3D ASIP Conference Demonstrates Manufacturer’s Commitment

13th 3D ASIP Conference Demonstrates Manufacturer’s Commitment


January 6, 2017    Herb Reiter

The 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) conference is one of the biggest (if not THE biggest) event focused exclusively on the

imec Collaborates with Antwerp and Flanders to Establish Smart City Living Lab

imec Collaborates with Antwerp and Flanders to Establish Smart City Living Lab


January 6, 2017    imec

How can the Internet of Things change the future of the average citizen? To answer this question, imec joins forces with the City of Antwerp

Outlook 2017:  SoC Goes on a Dielet

Outlook 2017: SoC Goes on a Dielet


January 4, 2017    Paul Werbaneth

It’s 2017, and system-on-a-chip (SoC) is headed for a dielet. At least that’s my 2017 outlook, based on takeaways from some of the recent conferences

Hugo Pristauz Drops the F-bomb at 3D ASIP 2016, You Won’t Believe What Happens Next!

Hugo Pristauz Drops the F-bomb at 3D ASIP 2016, You Won’t Believe What Happens Next!


December 20, 2016    Francoise von Trapp

Sorry everybody, but I couldn’t resist this Buzzfeed-esque title, because Besi’s Hugo Pristauz’ unprecedented use of “colorful” language to illustrate the “turbulent plane ride” of

Happy Holidays, from 3D InCites!

Happy Holidays, from 3D InCites!


December 20, 2016    Francoise von Trapp

 

Embedded Die: from Incubation to High Volume Production


December 16, 2016    Jean-Christophe ELOY

The embedded-die-in-substrate platform has its own history and adoption scheme compared to other advanced packaging platforms, explains Yole Développement (Yole). Indeed while the first significant

IEDM 2016 Demonstrates Device Physics For The Semiconductor Industry

IEDM 2016 Demonstrates Device Physics For The Semiconductor Industry


December 13, 2016    Herb Reiter

In the past few months I have been reading a lot of depressing news about our semiconductor industry’s declining growth rates, shrinking profit margins, many

High Productivity UBM/RDL Deposition by PVD for FOWLP Applications

High Productivity UBM/RDL Deposition by PVD for FOWLP Applications


December 7, 2016    SPTS Technologies

Fan-out wafer level packaging (FOWLP) technology is an increasingly popular solution for obtaining high levels of device integration with a greater number of I/O contacts,

3D ASIP Returns Under The IMAPS Umbrella for Its 13th Edition

3D ASIP Returns Under The IMAPS Umbrella for Its 13th Edition


December 1, 2016    Francoise von Trapp

In less than two weeks, the 13th Annual Architectures for Semiconductor Integration and Packaging Conference (3D ASIP) kicks off at the Marriott San Francisco Airport,

Fan-out is the Most Dynamic IP Landscape in Advanced Packaging

Fan-out is the Most Dynamic IP Landscape in Advanced Packaging


December 1, 2016    Jean-Christophe ELOY

In the fast-growing fan-out market showing 80% increase between 2015 and 2017[1], it is today essential to deeply understand the patent strategies of the key

SiP Impact, Smartphone Market Saturation… What is the Future of Fan-in Packaging?

SiP Impact, Smartphone Market Saturation… What is the Future of Fan-in Packaging?


December 1, 2016    Jean-Christophe ELOY

Fan-in packaging has been a successful and steadily growing platform for over a decade. However, fan-in packaging should face a challenging future, announces Yole Développement

What’s New for the 2017 European 3D Summit

What’s New for the 2017 European 3D Summit


November 28, 2016    Francoise von Trapp

For the fifth consecutive year, the European 3D Summit returns to Grenoble, January 23-25, 2017. The event has evolved over those years, beginning its tenure