IoT: Beyond the Hype

IoT: Beyond the Hype

2 days ago Kevin Parmenter
All the hype surrounding the Internet of Things has me worried. First of all, its my opinion that th…
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2 days agoIoT: Beyond the Hype
Personal Dosimeters, TSMC CMOS Wafer MEMS, DRIE Commercialization: 3 Lessons from MEMS Engineer Forum 2015

Personal Dosimeters, TSMC CMOS Wafer MEMS, DRIE Co…

1 week ago Paul Werbaneth
The initial shock of a major earthquake lasts just a short time, tens of seconds, although it can se…
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1 week agoPersonal Dosimeters, TSMC CMOS Wafer MEMS, DRIE Co…
Spotlight on FOWLP, Monolithic 3D IC and 3D TSVs

Spotlight on FOWLP, Monolithic 3D IC and 3D TSVs

1 week ago Francoise von Trapp
Fan-out wafer level packaging’s star is clearly on the rise as a low-cost solution for consumer mobi…
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1 week agoSpotlight on FOWLP, Monolithic 3D IC and 3D TSVs
SEMI European MEMS Summit 2015: Linking MEMS Markets, Technologies, Executives, and You

SEMI European MEMS Summit 2015: Linking MEMS Marke…

2 weeks ago Paul Werbaneth
Join us in Milan, Italy, on September 17 and 18, 2015 for a new flagship MEMS event being produced b…
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2 weeks agoSEMI European MEMS Summit 2015: Linking MEMS Marke…

3D Topics

Omnivision: OV23850 PureCel Image Sensor
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Omnivision: OV23850 PureCel Image Sensor

OmniVision’s OV23850 PureCel image sensor utilizes the companies advanced stacked die process capture exceptional images and video in 23.8-megapixel resolution while maintaining a compact form f... »

What’s In Store for Attendees at ECTC 2015

What’s In Store for Attendees at ECTC 2015

ECTC 2015 returns to my favorite of its three rotating locations at the Sheraton San Diego Hotel and Marina almost exactly one month from now, May 26-29, 2015. This year, the ECTC technical committee... »

Goofus and Gallant and the Internet of Things
goofusandgallant

Goofus and Gallant and the Internet of Things

If you grew up before about the mid 1980’s, you likely remember the magazine, Highlights for Children (now an online publication, Highlights for Kids) and within that magazine you likely recall a... »

Executive Viewpoint: Inside a Multi-Project Wafer Program for 3D Integration
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Executive Viewpoint: Inside a Multi-Project Wafer Program for 3D Integration

Multi-project wafer (MPW) programs have long been considered an economical way to integrate different IC designs from various teams to produce IC design prototypes and low volumes. Because IC fabricat... »

Image Courtesy of TSMC Ltd.

TSMC 2015 Technology Symposium Highlights Plans for the Coming Year

Last Tuesday, April 7, was another important day for Silicon Valley. TSMC 2015 Technology Symposium celebrated 21 years of holding this annual event to update TSMC’s loyal customers and win ... »

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Scott Jones to Deliver Keynote at 2015 3D InCites Awards Breakfast

Phoenix AZ – May 8, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced Scott Jones, director, Alix Partners, will deliver a keynote addre... »

SEMICON West 2015 Focuses on the Most Critical Issues in Semiconductor Manufacturing

San Jose, CA (May 7, 2015) — SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing. In... »

SPTS Technologies Receives Supplier Excellence Award from Analog Devices

YAVNE, ISRAEL, April 20 2015 | ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor... »

Dow’s SOLDERON™ Tin-Silver Plating Chemistry Wins Prestigious Bronze Edison Award

MARLBOROUGH, MA – April 27, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry wa... »

Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

Flanders, New Jersey (April 27, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follo... »

KLA-Tencor Introduces New Portfolio for Advanced Semiconductor Packaging

KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for characterization and monitoring of... »

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Fifty Years of Moore’s Law Made Possible by Semiconductor Equipment and Materials Suppliers Worldwide

SAN JOSE, CA — April 14, 2015 — April 2015 marks the 50th anniversary of one of the business world’s most profound drivers, now commonly referred to as Moore’s Law. In April 1965, Gordon M... »

Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications

Flanders, New Jersey (April 1, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced that a major semiconductor foundry and a top outsourced semiconductor assembly and test (OSAT) facility have pl... »

3D InCites Opens Nominations for the 2015 3D InCites Awards

Phoenix AZ – March 26, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced it has partnered with Impress foundation to co-host the third a... »

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