Comparing Two Flavors of Chip Stacking Yield

Comparing Two Flavors of Chip Stacking Yield

4 days ago imec
One of the ways to build more complex, powerful, and cost-effective electronic systems is stacking c…
Read More
4 days agoComparing Two Flavors of Chip Stacking Yield
The 2015 3D InCites Guide to 3D at SEMICON West

The 2015 3D InCites Guide to 3D at SEMICON West

5 days ago Francoise von Trapp
2015 will go down in history as the year 3D finally got real. It’s not an emerging technology anymor…
Read More
5 days agoThe 2015 3D InCites Guide to 3D at SEMICON West
Will the Internet of Everything Really Make the World a Better Place?

Will the Internet of Everything Really Make the Wo…

7 days ago Francoise von Trapp
I recently started watching the HBO sitcom, Silicon Valley. If you haven’t seen it, it's a great par…
Read More
7 days agoWill the Internet of Everything Really Make the Wo…
Path Finding and 3DPF

Path Finding and 3DPF

2 weeks ago Bill Martin
In the past year, I have written short pieces explaining how Path Finding methodology can proactivel…
Read More
2 weeks agoPath Finding and 3DPF

3D Topics

Lam Research: SABRE 3D
Sabre

Lam Research: SABRE 3D

SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications.  This product leverages proprietary front-end manufa... »

Nordson ASYMTEK: Programmable Tilt + Rotate 5-Axis Fluid Dispenser
nordson-asymtek-tilt-and-rotate-500pix Programmable Tilt + Rotate 5-Axis Fluid Dispenser

Nordson ASYMTEK: Programmable Tilt + Rotate 5-Axis Fluid Dispenser

Nordson ASYMTEK’s programmable Tilt + Rotate 5-Axis Fluid Dispenser dispenses using 5 axes instead of 3. The X and Y tilt enables dispensing from a vertical position, varying tilt angles to all side... »

Mentor Graphics: Xpedition Package Integrator
mentorfig copy

Mentor Graphics: Xpedition Package Integrator

Xpedition® Package Integrator provides a holistic co-design methodology that automates planning and optimization of connectivity from a chip through multiple packaging variables, while targeting mult... »

Dow Corning: Thermally Conductive Gel TC-3040
TC-3040 TC3040 copy

Dow Corning: Thermally Conductive Gel TC-3040

TC-3040 is designed for advanced flip chip devices requiring improved heat dissipation.  The material features a combination of low modulus and high elongation – enabling it to accommodate war... »

SPTS: Sigma fxP PVD with Multi-Wafer Degas
sigma-pvd-cvd-mwd

SPTS: Sigma fxP PVD with Multi-Wafer Degas

SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It utilizes batch degas technology that can improve Rc whilst maintaining high throu... »

Video Channels

Company News

TechSearch International Makes Sense of Package Alphabet Soup

With new packages continuously being introduced, TechSearch International’s latest Advanced Packaging Update focuses on making some sense out of the alphabet soup of package options for split die. A... »

BIO Pic

Scott Jones to Deliver Keynote at 2015 3D InCites Awards Breakfast

Phoenix AZ – May 8, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced Scott Jones, director, Alix Partners, will deliver a keynote addre... »

SEMICON West 2015 Focuses on the Most Critical Issues in Semiconductor Manufacturing

San Jose, CA (May 7, 2015) — SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing. In... »

SPTS Technologies Receives Supplier Excellence Award from Analog Devices

YAVNE, ISRAEL, April 20 2015 | ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor... »

Dow’s SOLDERON™ Tin-Silver Plating Chemistry Wins Prestigious Bronze Edison Award

MARLBOROUGH, MA – April 27, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry wa... »

Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

Flanders, New Jersey (April 27, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follo... »

KLA-Tencor Introduces New Portfolio for Advanced Semiconductor Packaging

KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for characterization and monitoring of... »

SEMI-WafersExponents_1392px-webCC

Fifty Years of Moore’s Law Made Possible by Semiconductor Equipment and Materials Suppliers Worldwide

SAN JOSE, CA — April 14, 2015 — April 2015 marks the 50th anniversary of one of the business world’s most profound drivers, now commonly referred to as Moore’s Law. In April 1965, Gordon M... »

Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications

Flanders, New Jersey (April 1, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced that a major semiconductor foundry and a top outsourced semiconductor assembly and test (OSAT) facility have pl... »

Community Activity