A Sneak Peek at IITC and AMC 2014

A Sneak Peek at IITC and AMC 2014

3 days ago Herb Reiter
The recent announcement of the International Interconnect Technology Conference (IITC), combined wit…
Read More
3 days agoA Sneak Peek at IITC and AMC 2014
GSA Silicon Summit: What’s next for the 2.5D/3D Ecosystem?

GSA Silicon Summit: What’s next for the 2.5D/3D Ec…

1 week ago Francoise von Trapp
Due to schedule conflicts, I was unable to attend this year’s Silicon Summit, which took place April…
Read More
1 week agoGSA Silicon Summit: What’s next for the 2.5D/3D Ec…
Oerlikon Systems: Pragmatic and Poised for 3D IC High Volume Manufacturing

Oerlikon Systems: Pragmatic and Poised for 3D IC…

1 week ago Francoise von Trapp
In the last 40 years, the Principality of Liechtenstein has evolved from a purely agricultural state…
Read More
1 week agoOerlikon Systems: Pragmatic and Poised for 3D IC…
When You Come to a Fork In the Road, Take It

When You Come to a Fork In the Road, Take It

2 weeks ago Herb Reiter
When Yogi Berra made this very wise statement, he certainly didn’t mean to give specific advice what…
Read More
2 weeks agoWhen You Come to a Fork In the Road, Take It
The Web's best
WordPress slider

 

Latest Posts
Manufacturing Materials Process and Technology Design EDA Tools Test and Inspection Standards Value Chain Devices Applications

STS Semiconductor and Invensas to Partner on High Volume Bond Via Array (BVA) Mobile Solutions

STS Semiconductor and Invensas to Partner on High Volume Bond Via Array (BVA) Mobile Solutions

Tessera Technologies, Inc., announced today that Invensas Corporation, its wholly owned subsidiary, and Seoul, South Korea-based STS Semiconductor & Telecommunications Co. Ltd., a leading semicond... »

2013 ITRS Roadmap Calls for 3D Power Scaling; Monolithic 3D Gains Traction
11235297_s

2013 ITRS Roadmap Calls for 3D Power Scaling; Monolithic 3D Gains Traction

At the beginning of April, the Semiconductor Industry Association released the 2013 International Roadmap for Semiconductors (ITRS), which has traditionally served as a guide for “assessing and impr... »

Rudolph Technologies: JetStep Panel Lithography System
jetstep-panel-system

Rudolph Technologies: JetStep Panel Lithography System

Product Description As advanced packaging facilities transition their manufacturing from round wafers to square panels, the JetStep Panel Lithography System is fully capable of handling panels up to G... »

ASE and Inotera Memories to Offer Novel 2.5D Manufacturing Solutions

ASE and Inotera Memories to Offer Novel 2.5D Manufacturing Solutions

Last week, ASE and Inotera Memories announced they had entered into a joint development project (JDP) intended to both strengthen ASE’s system-in-package (SiP) capabilities and expand Inotera’s fo... »

3D Test

Cascade Microtech: In the imec 3D Test Lab

My visit to imec to meet with the Cascade Micorotech and imec 3D Test collaboration team included a tour of the 3D test lab to see the CM300 in action, so we suited up for Class 1000 cleanroom and ste... »

Video Channels


Community Activity


Company News

Deca Technologies Ships 100-Millionth WLP Component

Fully Automated Manufacturing Technology Drives Growth for WLP Startup Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipp... »

SUSS MicroTec Launches Mask Aligner MA200 Gen3

Garching, April 2, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the new Mask Aligner MA200 Gen3 today. ... »

3D InCites Partners with SEMI and TechSearch International for the 2014 3D InCites Awards Program

Proceeds to Benefit STEM-based Scholarship Programs PHOENIX– March 18, 2014 – 3D InCites, the premier online content source for reliable 3D technology information, today announced that it has part... »

EV Group Boosts 2.5D and 3D-IC/TSV Performance with New Nanospray Application

ST. FLORIAN, Austria, March 12, 2014 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its ... »

STATS ChipPAC Introduces Breakthrough Manufacturing Method for Wafer Level Packaging

Singapore – 11 March 2014 – STATS ChipPAC, a leading provider of advanced semiconductor packaging and test services, has designed and implemented an innovative new manufacturing method for wafer l... »