DesignCon 2016: Where the Chip meets the Board and Great Ideas Come to Life

DesignCon 2016: Where the Chip meets the Board and…

7 days ago Herb Reiter
DesignCon 2016 at the Santa Clara Convention Center gave football fans among us an opportunity to wa…
Read More
7 days agoDesignCon 2016: Where the Chip meets the Board and…
Success for 3D: What A Difference a Year Makes

Success for 3D: What A Difference a Year Makes

1 week ago Francoise von Trapp
During the 2015 European 3D TSV Summit, I drove attendees to distraction by asking each presenter wh…
Read More
1 week agoSuccess for 3D: What A Difference a Year Makes
European 3D Summit: Putting 3D Packaging To Work

European 3D Summit: Putting 3D Packaging To Work

1 week ago Francoise von Trapp
Now that we’ve determined that advanced wafer level packaging — including embedded technologies, fan…
Read More
1 week agoEuropean 3D Summit: Putting 3D Packaging To Work
The European 3D Summit: The Gala Quiz

The European 3D Summit: The Gala Quiz

2 weeks ago Francoise von Trapp
Hands-down, the best part of last week’s 2016 European 3D Summit was the Gala Dinner at the Chateau…
Read More
2 weeks agoThe European 3D Summit: The Gala Quiz

3D Topics

Panel-level Packaging: the High Volume Manufacturing Roadmap has Yet to be Built
PanelLevelPackaging_PlayersPositioning_YOLE_Nov2015_409x280 illus_panellevelpackaging_playerspositioning_yole

Panel-level Packaging: the High Volume Manufacturing Roadmap has Yet to be Built

Over the past few years, it becomes clear that some panel-level packaging choices will be more suitable than others for successful commercial development. So, when will the panel-level packaging indus... »

European 3D Summit: Market Analysts Weigh in on FOWLP,  3D Packaging, and SiP
Samsungvsskhynix samsunghynix2 YoleTSVsinproducts copy techsearchFOWLP yoleFOWLP copy

European 3D Summit: Market Analysts Weigh in on FOWLP, 3D Packaging, and SiP

As it has in year’s past, the 2016 European 3D Summit kicked off with a market briefing. We heard from the usual suspects: Yole Dévéloppement (Rozalia Beica) and TechSearch International Inc. (Lin... »

The European 3D Summit: From Roadmaps to Reality
2016-01-20 08.27.23 pGarrouGab copy naniumembedded

The European 3D Summit: From Roadmaps to Reality

In its fourth edition and with a new name, the European 3D Summit (formerly the European 3D TSV Summit) reflected the shift from R&D to the real business of 3D integration and advanced packaging, ... »

SPTS sees a Brighter 2016
David_Butler

SPTS sees a Brighter 2016

In contrast to some of the gloomier predictions of the analysts, we think 2016 will be a growth year for our business. In packaging, we see a number of development projects moving into production this... »

Fraunhofer EMFT: Our Early and Ongoing Work in 3D Integration
Early and Ongoing Work in 3D Integration

Fraunhofer EMFT: Our Early and Ongoing Work in 3D Integration

Fraunhofer has been working on 3D integration for the past three decades, starting in1987 with a consortium of Siemens, AEG, Philips and the Munich institute IFT (now EMFT).  By 1988, we could succe... »

Video Channels

Company News

EV Group Joins IRT Nanoelec 3D Integration Program

ST. FLORIAN, Austria – Feb. 5, 2016 – EV Group (EVG), an industry-leading supplier of wafer-bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning and inspect... »

Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line

Flanders, New Jersey —Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep® Lithography System fo... »

Presto Engineering Expands Turnkey IC Production Management Services with Three New Operations in Asia

San Jose, Calif., USA – Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, announced today that it has significantly expanded its turnkey IC pr... »

SET joins IRT Nanoelec 3D Integration Program

SAINT-JEOIRE, France – Jan. 15, 2016 – SET, Smart Equipment Technology, the leading supplier in high-accuracy die-to-die and die-to-wafer bonders, today announced its participation in the 3D integ... »

StatusAPIndustry_APplatform_Smartphones_YOLE_Dec2015_433x280 StatusAdvancedPackagingIndustry_APplatform_Smartphones_YOLE_Dec2015

Advanced Packaging Industry: What’s New on the Market?

The mobile sector is driving production and market growth; however a new market driver, the Internet of Things (IoT) is on the horizon and is expected to have a significant impact on the advanced pac... »

PanelLevelPackaging_Roadmap_YOLE_Nov2015 illus_PanelLevelPackaging_Revenue_YOLE_Nov2015

Panel-level Packaging: a Promising Market

 For many years now, the semiconductor industry development has been governed by  Moore’s law and the increasing demand for higher performance and lower manufacturing costs. Under this context, th... »

LeslieTugman

SEMI Foundation Appoints Leslie Tugman as Executive Director

SEMI Foundation, a nonprofit affiliate of SEMI established to support education and career awareness in the field of high-tech, has announced the appointment of Leslie Tugman as its executive director... »

Invensas Licenses BVA Vertical Interconnect Technology to Tong Hsing for MEMS Applications

  Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), announced that Tong Hsing Electronic Industries Ltd., a leading Taiwanese provider of microelectr... »

illus_flipchip_bumpcapacity_yole_oct2015

Flip Chip Technology: Which Companies will Invest to Support Growth?

Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of flip chip technology for LED and CMOS Image Sensors (CIS) applications, the flip chip... »

Community Activity