Advances in Heterogeneous Integration Through Wafer Bonding

Advances in Heterogeneous Integration Through Wafe…

2 days ago Thomas Uhrmann
Emerging “More than Moore” and photonic applications benefit tremendously from the close integration…
Read More
2 days agoAdvances in Heterogeneous Integration Through Wafe…
Samsung’s V-NAND Flash at the 2015 ISSCC –The Only Way Left is Up

Samsung’s V-NAND Flash at the 2015 ISSCC –The Only…

2 days ago Andrew Walker
Samsung continued their 3D NAND march with an impressive presentation at the 2015 IEEE International…
Read More
2 days agoSamsung’s V-NAND Flash at the 2015 ISSCC –The Only…
Addressing Emerging Technology Start-up Dilemmas

Addressing Emerging Technology Start-up Dilemmas

3 days ago Phil Marcoux
We see it all the time, someone has a great idea of how to implement emerging technologies, such as…
Read More
3 days agoAddressing Emerging Technology Start-up Dilemmas
Xilinx Ultrascale+: 3D on Steroids

Xilinx Ultrascale+: 3D on Steroids

1 week ago Francoise von Trapp
Ever since 3D transistors (aka FinFETS or Intel’s Tri Gate) 3D NAND, and monolithic 3D IC processes…
Read More
1 week agoXilinx Ultrascale+: 3D on Steroids
 

3D Topics

ESD in 3D IC Packages
Global Semiconductor Alliance White Paper:  ESD for 3D IC Packaging

ESD in 3D IC Packages

For single die packages, electrostatic discharge (ESD) is well understood, and precautions are taken to minimize the possibility of charge build-up and ESD strikes. In single die designs, Input-Output... »

Executive Viewpoint: An Interposer Integration and 3D IC Success Story
Farhang Yazdani rigidinterposer

Executive Viewpoint: An Interposer Integration and 3D IC Success Story

While the rest of the industry anticipates the coming of 3D ICs, and along with it the long anticipated return on investment that goes with it, one small Silicon Valley fabless has been chugging along... »

Technology Options and Their Influence on Routing for Interposer-based Memory Processor Integration
heinigfig1 heinigfig2 heinigtable1new heinigfig3 heinigtable2 heinigfig4

Technology Options and Their Influence on Routing for Interposer-based Memory Processor Integration

Currently  in advanced integration, mainly stacked solutions (Figure 1b) are considered due to their attractive compactness. But if the ASIC or the processor is a high-performance circuit, there are ... »

Understanding Heterogeneous 3D Integration
KPRammfig1 KPRammFig2 KPRammfig3 KPRammfig4 KPRammfig5

Understanding Heterogeneous 3D Integration

“How is heterogeneous 3D integration defined?” There are certainly different understandings in the microelectronics community regarding the definition of heterogenous 3D integration. In a very ge... »

Executive Interview: Si2 Aims to Boost Confidence in Designing 3D ICs
Watering_steam_locomotive si2 stevenschulz

Executive Interview: Si2 Aims to Boost Confidence in Designing 3D ICs

There’s no doubt left in the minds of semiconductor device manufacturers that the processes required to build interposer-based and 3D IC devices are matured and ready for production. However, the ju... »

Video Channels

Company News

Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications

Flanders, New Jersey (February 2, 2015)—Rudolph Technologies, Inc. has shipped the JetStep® Advanced Packaging Lithography System to a leading outsourced assembly and test (OSAT) facility. This new... »

Akrion Systems Intensifies Focus on 3D TSV Advanced Packaging

Allentown, Pa., January 29, 2015 – Akrion Systems was well represented exhibiting at the 2015 European 3D TSV Summit earlier this month, as the company intensifies its focus on 3D TSV Advanced P... »

SPTS and Fraunhofer IZM Work to Advance Wafer Level Packaging

Fraunhofer IZM Selects SPTS’ DRIE and Low Temperature CVD to Develop Next Generation Manufacturing Techniques ORBOTECH LTD. announced that SPTS Technologies, an Orbotech company and a supplier of ad... »

IWLPC Best Papers Announced

SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer L... »

Georgia Tech Forms a Panel-based Global Glass Industry Consortium

At the IEEE Global Interposer Technology (GIT2014) Workshop held at Georgia Tech on November 5-7, 2014, Georgia Tech announced the formation of a Panel-based Global Glass Industry Consortium for low... »

Ultratech Introduces Superfast 4G Low-cost In-line Inspection System for Patterned Wafers

Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today introduced the Superfast... »

3D ASIP 2014 Covers All the Bases from Design to Applications for Interposer and 3D IC Technologies

One look at the agenda for the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP), and it becomes clear that this year the conference organizers have left no... »

Bill-Chen Timo-Henttonen Bryan-Black

European 3D TSV Summit Committee Announces Keynote Speakers; Pre-Conference Symposium to Focus on the Market

This year’s European 3D TSV Summit, January 19-21, 2015, Grenoble France, will focus on how interposers and 3D ICs can help us create smarter systems. To help set the stage, the steering committee e... »

Nordson DAGE Announces Latest Order for XM8000

Nordson DAGE, a division of Nordson Corporation, is pleased to announce its most recent order from a major customer in the semiconductor industry for its XM8000 wafer x-ray metrology tool that will be... »

Community Activity