3D ASIP Returns Under The IMAPS Umbrella for Its 13th Edition

3D ASIP Returns Under The IMAPS Umbrella for Its 13th Edition


December 1, 2016    Francoise von Trapp

In less than two weeks, the 13th Annual Architectures for Semiconductor Integration and Packaging Conference (3D ASIP) kicks off at the Marriott San Francisco Airport,

SiP Impact, Smartphone Market Saturation… What is the Future of Fan-in Packaging?

SiP Impact, Smartphone Market Saturation… What is the Future of Fan-in Packaging?


December 1, 2016    Jean-Christophe ELOY

Fan-in packaging has been a successful and steadily growing platform for over a decade. However, fan-in packaging should face a challenging future, announces Yole Développement

What’s New for the 2017 European 3D Summit

What’s New for the 2017 European 3D Summit


November 28, 2016    Francoise von Trapp

For the fifth consecutive year, the European 3D Summit returns to Grenoble, January 23-25, 2017. The event has evolved over those years, beginning its tenure

3D TSV IP Landscape for Memory Applications: Who Owns What?

3D TSV IP Landscape for Memory Applications: Who Owns What?


November 22, 2016    Jean-Christophe ELOY

The last two years have shown some important changes within the 3D through silicon via (TSV) memory market. First commercial products including 3D stacked (3DS),

MEPTEC Roadmap 2016: Best Time in History to be in the Packaging Business

MEPTEC Roadmap 2016: Best Time in History to be in the Packaging Business


November 21, 2016    Paul Werbaneth

With nary a farewell glance in the rearview mirror at the terrain successfully covered over the decades during which we followed the ITRS’ Guide Michelin;

MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless Things

MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless Things


November 17, 2016    Francoise von Trapp

A shift has occurred. As MEMS becomes mainstream, the focus of the annual MEMS & Sensors Executive Congress (MEC 2016) was less on MEMS development

Direct Bond Interconnect (DBI®) Technology as an Alternative to Thermocompression Bonding

Direct Bond Interconnect (DBI®) Technology as an Alternative to Thermocompression Bonding


November 15, 2016    Invensas Corporation

The industry standard interconnect technology for fine-pitch 2.5D assembly and 3D stacking is thermocompression bonding of solder capped μbumps. This technology has several challenges which

At the Crossroads of CVD and ALD, KOBUS Makes its Mark on 3D TSVs

At the Crossroads of CVD and ALD, KOBUS Makes its Mark on 3D TSVs


November 15, 2016    Francoise von Trapp

Last July at SEMICON West, I was honored to witness the dramatic unveiling of UnitySC, the new company formed as a result of Fogale Group’s

SEMICON Europa 2017 Moves to Munich

SEMICON Europa 2017 Moves to Munich


November 11, 2016    Francoise von Trapp

So here’s a funny story.  At the MEMS Summit in Stuttgart in September, while chatting with Denny McGuirk President and CEO, SEMI, I suggested that

IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced Packaging

IWLPC 2016 Keynotes Look to A Connected Future Enabled by Advanced Packaging


November 4, 2016    Francoise von Trapp

The 2016 International Wafer-Level Packaging Conference (IWLPC), which took place October 18-20, 2016 in San Jose, CA, focused on a theme of “Bridging the Interconnect

MEMS & Sensors Industry Group Reveals Tech Showcase Finalists

MEMS & Sensors Industry Group Reveals Tech Showcase Finalists


November 3, 2016    MEMS & Sensors Industry Group

MEMS & Sensors Industry Group (MSIG)’s annual MEMS & Sensors Technology Showcase at MEMS & Sensors Executive Congress® 2016 (November 9-11, 2016 in Scottsdale, AZ)

Package-on-Package Interconnects for Fan-out Wafer Level Packages

Package-on-Package Interconnects for Fan-out Wafer Level Packages


November 3, 2016    Invensas Corporation

Consumer electronics designers continue to demand thinner and lighter packages while devices increase in functional complexity. The Fan-Out Wafer Level Package (FOWLP) platform has been

TechSearch International Analysis Shows CSP Growth Remains Strong

TechSearch International Analysis Shows CSP Growth Remains Strong


November 3, 2016    TechSearch International, Inc.

Despite a slowing growth rate for smartphones, the industry is experiencing strong growth for CSP packages such as QFNs and stacked die CSPs.  TechSearch International’s

Orbotech’s SPTS Technologies Extends Leadership in FOWLP PVD Equipment

Orbotech’s SPTS Technologies Extends Leadership in FOWLP PVD Equipment


November 3, 2016    SPTS Technologies

NEWPORT, UK, November 3, 2016 | SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries,

What Will Happen With the Chinese Advanced Packaging Ecosystem?

What Will Happen With the Chinese Advanced Packaging Ecosystem?


November 3, 2016    Jean-Christophe ELOY

In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole Développement (Yole) in its report Status and Prospects for the

First-Mover Advantage: Fan-Out Panel Level Packaging at IWLPC 2016

First-Mover Advantage: Fan-Out Panel Level Packaging at IWLPC 2016


October 28, 2016    Paul Werbaneth

“It is better to be first than it is to be better.” (Ries and Trout, in The 22 Immutable Laws of Marketing.) Or is it