Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services and a strategic manufacturing partner to leading semiconductor companies, foundries and electronics OEMs. Founded in 1968, Amkor’s operational base includes production facilities, product development centers and sales and support offices in Asia, Europe and the USA.
Amkor’s broad package portfolio includes leadframe, FCBGA, fcCSP and WLCSP products. MEMS, sensors and SiP packaging with unique development and high-volume production requirements are also supported. Amkor’s MicroLeadFrame® (MLF®) and ChipArray® BGA packages have become industry standards as QFNs and FBGAs. Large scale and complex 2.5/3D system solutions are supported using High-Density Fan-Out (SWIFT®) technology. Amkor also provides high volume copper pillar bumping and Package-on-Package (PoP) assemblies found in many smart mobile products.
Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.
As the provider of choice for semiconductor assembly and test, Amkor offers comprehensive manufacturing capability and scale along with a broad global presence. Visit www.amkor.com
Semiconductor Packaging, Laminate Packaging, Leadframe Packaging, Power Discrete Packaging, MicroLeadFrame® (MLF®), Wafer Level Packaging, Antenna in Package/Antenna on Package (AiP/AoP), 2.5D/3D TSV, Chip-on-Chip, Chip-on-Wafer, Flip Chip, MEMS and Sensors, System in Package (SiP), Stacked Die, SWIFT®, Wafer Bumping, Design Services, Test Services
Artificial Intelligence, Automotive, Communications, Computing, Consumer, Industrial, IoT, Networking
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