Integration is the KEY
- “The word “Integration” not only refers to the technical process of integrating but also to the integration of people and their knowledge.” Erik Jan Marinissen, imec
- “Your blog is part of the solution. It is the education component that is critical to lowering any adoption barrier, spreading knowledge and ideas to anyone considering 3D and TSVs.” Bill Martin, E-System Design
The 3D InCites Community was established in 2009 to stir up interest in 3D integration. Now in its 13th year, 3D InCites has broadened its scope stir up interest in heterogeneous integration. As such, 3D InCites is about much more than just through-silicon vias and subsequent stacking technologies. Rather, 3D InCites has become part of the whole advanced packaging conversation as it relates to heterogeneous integration, the internet of things, and other applications these technologies enable. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.
As a community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. As the interests and concerns of our community expand, so do our areas of coverage. That’s why in 2021, we added efforts to build awareness around the importance of sustainable semiconductor manufacturing, and diversity equity and inclusion in the workplace. Our goal is to support the efforts of our community members.
Featuring Francoise in 3D
3DInCites was designed by the creative team at Kiterocket, a global creative and marketing communications agency specializing in building brands across a diverse set of industries, including the semiconductor industry.
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