A Look Inside The 3D Technology Toolbox For STCO
Aug 09, 2019 · By Eric Beyne · 3D In-Depth, Processes and Technology
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Integrated Solid-state Capacitors Based on Carbon Nanostructure
The constant demand for miniaturization, added functionality and increased performance of electronic devices systematically drives higher integration by adding more... 3D Systems-on-Chip: Clever Circuit Partitioning To Extend Moore’s Law
In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is...
The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory
Data is now the world’s most valuable resource. Solid-state storage of data is driving an innovation revolution built upon 50 years...
Lam Research: SABRE 3D
SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications. This product leverages proprietary... Nordson ASYMTEK: Programmable Tilt + Rotate 5-Axis Fluid Dispenser
Nordson ASYMTEK’s programmable Tilt + Rotate 5-Axis Fluid Dispenser dispenses using 5 axes instead of 3. The X and Y... SPTS: Sigma fxP PVD with Multi-Wafer Degas
SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It... KLA-Tencor: CIRCL-AP™
CIRCL-AP™ is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced...
EV Group: GEMINI®FB XT Automated Production Fusion Bonding System
The GEMINI®FB XT fusion wafer bonding platform features up to a 3X improvement in wafer-to-wafer bond alignment accuracy as well...
Heterointegration Spoor in the 2015 Analog, MEMS and Sensor Startups to Watch, Part 3
In Parts 1 and 2 of this series, I drew your attention to what Peter Clarke, writing in EETimes on...