Electronics Packaging – From Afterthought to Product Differentiator
Nov 17, 2021 · By Steffen Kröhnert · 3D In-Depth, Processes and Technology
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Die-to-Wafer Bonding Steps into the Spotlight on a Heterogeneous Integration Stage
The semiconductor industry is currently undergoing the most radical change in its history. Many new applications such as artificial intelligence...
Novel Approaches to Wafer Handling
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3DIC Integration using 3D stacked technologies in its true definition has a long history.1 Richard P. Feynman expressed this vision...
What Does Panel-level Packaging Mean for Seed Layer Deposition?
Seed layer deposition is one of the most critical process steps in manufacturing vertical and horizontal interconnects. At the panel...
Increasing the Conductive Density of Power Packaging
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3D: The El Dorado of Heterogeneous Integration
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CEA-Leti/Intel Collaboration brings 3D Powerhouses to the Advanced 3D Packaging Table
CEA-Leti and Intel recently announced a new collaboration effort on advanced 3D packaging technologies for processors to advance chip design....
Plasma Treatment During Fan-Out Packaging Maximizes Performance and Optimizes Costs
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48V Ecosystem and Power Packaging Trends
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Carrier Wafers for Semiconductor and MEMS Manufacturing
As technology rapidly moves forward, the reduction of device and chip size is playing an important role in implementing as...
Temporary Wafer Bonding System Is Based On Electrostatics, Not Adhesives
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Temporary Bonding and Mold Process to Enable Next-Gen FOWLP
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A Look Inside The 3D Technology Toolbox For STCO
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Addressing the Challenges of Surface Preparation for Advanced Wafer Level Packaging
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CoolCube™: More than a True 3D VLSI Alternative to Scaling
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Replacing NMP: Are You Ready?
NMP is an abbreviation for N-methyl-2-pyrrolidone (other synonyms are 1-Methyl-2-pyrrolidone and 1-Methyl-2-pyrrolidinone) (Figure 1). NMP has proven itself as an...
The Fundamentals and Early History of Quantum Mechanical Tunneling
The mid-1920’s were the miracle years for quantum mechanics. The “Old Quantum Theory” originating with Niels Bohr, had reached crisis point by the...
The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage
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