Paul Werbaneth is a long-time Contributing Editor at 3D InCites. Since entering the semiconductor industry in 1980, Paul has worked in engineering and business management roles at Intel, Hitachi High Technologies, Tegal Corporation, EV Group, Intevac, Inc., and Nor-Cal Products, Inc. He received the B.S. degree in chemical engineering from Cornell University, and recently completed studies in spoken Japanese, and in marketing strategy, through Cornell. Paul is a member of the SEMI Advanced Semiconductor Manufacturing Conference steering committee and is active in the Northern California Chapter of the American Vacuum Society, most recently serving as program chair for the NCCAVS Technical Symposium 2019, and as NCCAVS chapter chair for 2019. Paul is also a Guest Editor of IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, wrote the contributed chapter on TSV etching in the book “3D Integration for VLSI Systems,” and has written or co-written an extensive number of articles, papers, and blogs regarding the semiconductor capital equipment business, advanced packaging, and various aspects of semiconductor manufacturing.