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The challenge of designing smaller, cost-effective systems that require additional processing and performance power led to 3D chip stacking of bare die and a new approach to packaging known as SiP (systems-in-package), also known as multi-chip modules (MCMs). The benefits of MCM/SiP package technology include the ability to achieve greater functionality in a reduced time-to-market window that cann... »
As next-generation High-Density-Advanced-Packaging (HDAP) designs become more common, PCB designers and engineers are looking to system-level co-design to tie multi-substrate visualization, planning, and optimization, into a complete multi-board design. Co-design methodology allows design teams to plan and optimize I/O and connectivity from a chip, through multiple packaging scenarios, and on to p... »
While advanced IC packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique package connectivity issues, such as missing or misplaced interposer/package bumps/pads, pin naming and text labeling issues, and the like, require new and enhanced layout vs. schematic (LVS)-like verification techniques that can move across the entire package to ensure proper co... »
Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by their host system, whether it’s a network storage device, network data switch, complex industrial equipment controller, or a critical core module of a defense system. And they are not getting any smaller or slower as silicon process nodes shrink and memory dema... »
Moore’s law is increasingly difficult to maintain and is driving the growth of innovative high-density advanced packaging (HDAP) technologies in response to system scaling demands. These innovations are increasingly in the form of fan-out wafer level packaging (FOWLP) or multi-substrate / multi-device packages like interposers and system-in-package (SiP). New challenges come with these disruptiv... »
Traditionally, MCMs (Multi-Chip-Modules) were a way of integrating several ASICs, or ASICs and memory, into a lower-cost, smaller form-factor, robust module that was an alternative to a single large SoC. Instead of integrating all or most of the systems PCBs needs onto a large and complex single SOC, you could design and fabricate smaller, high-yielding ASICs (Figure 1) and make them behave like a... »
Today’s SoCs, multi-core CPUs and GPUs with their high performance, high bandwidth interconnect interfaces put demanding challenges across the entire system signal path, requiring system-wide optimization for product success. However, although typical system substrate design discipline (chip, packaging, and PCB) have well-developed design approaches, the interaction between them largely remains ... »
Packages and boards are playing an increasing role as a way to increase speed and density while reducing power and form factor of electronic systems. This is part of a trend called sometimes “more than Moore”, to refer to factors in addition to scaling ICs. Packages and boards both represent sizeable industries, even compared to the $300 billion semiconductor industry. Packaging is estimated t... »
Three-dimensional Integrated circuits (3DIC) are generating increased interest as a way to increase speed and density while reducing power and form factor. System level integration in Package (SiP) has joined “System on Chip (SoC)” as one of the primary mechanisms to drive the electronics industry. Quotes such as “Smartphones and Tablets will increasingly owe their prowess to better chip pac... »
Fan-out wafer-level packaging (FOWLP) is an emerging type of high-density advanced packaging (HDAP) technology in the semiconductor industry that is rapidly gaining popularity in the market. But what exactly is FOWLP? Why do we need it? How do we take advantage of it? What limitations still need to be overcome? FOWLP brings single and multi-die designs together, combining multiple die from heterog... »
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