Optimizing Your SoC or ASIC to Design PCBs More Cost Effectively
Jan 14, 2019 · By MentorPCB · Resource Library, White Papers
Latest Posts
Designing and Integrating MCM/SIP Packages into Systems PCBs
Traditionally, MCMs (Multi-Chip-Modules) were a way of integrating several ASICs, or ASICs and memory, into a lower-cost, smaller form-factor, robust... Using Co-Design to Ensure Multi-Fabric System-Design Success
Today’s SoCs, multi-core CPUs and GPUs with their high performance, high bandwidth interconnect interfaces put demanding challenges across the entire... Electromagnetic Simulation for Electronic Systems
Packages and boards are playing an increasing role as a way to increase speed and density while reducing power and... Electromagnetic Modeling of Three-dimensional Integrated Circuits
Three-dimensional Integrated circuits (3DIC) are generating increased interest as a way to increase speed and density while reducing power and... Implementing Fan-Out Wafer-Level Packaging (FOWLP) with an HDAP Flow
Fan-out wafer-level packaging (FOWLP) is an emerging type of high-density advanced packaging (HDAP) technology in the semiconductor industry that is... Solving the Design and Verification Challenges of High Density Advanced Packaging
Today’s electronic products present new challenges to product development teams. As a result, there is a constant push to improve...
High Productivity UBM/RDL Deposition by PVD for FOWLP Applications
Fan-out wafer level packaging (FOWLP) technology is an increasingly popular solution for obtaining high levels of device integration with a...
Advancements in Carbon Nanostructures for Advanced Packaging Applications
Moore’s law has guided the continuing miniaturization and performance enhancements of silicon chips for the semiconductor industry by scaling the... Start Your 2.5D HBM Design Today
High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect...