| Date/Time | Event |
|---|---|
| 12/01/2021 | Environmental Sustainability and Flexible & Printed Electronics Master Class |
| 12/01/2021 - 12/03/2021 | IEEE EPTC 2021 |
| 12/02/2021 - 12/03/2021 | WEBINAR: Bonding Solutions for Next-Generation Advanced Packaging |
| 12/07/2021 - 12/09/2021 | SEMICON West 2021 Hybrid |
| 12/11/2021 - 12/15/2021 | 2021 IEEE International Electron Devices Meeting |
| 02/15/2022 - 02/17/2022 | Wafer Level Packaging Symposium DoubleTree by Hilton Hotel, San Jose CA |
| 03/18/2022 | Call-for-Paper : DATE 2022 Friday Workshop on “3D Integration: Heterogeneous 3D Architectures and Sensors” |
