Call for Abstracts for the Workshop on Advanced Packaging for Medical Microelectronics
www.imaps.org/medical
March 21-22, 2024
WeKoPa Resort | Fort McDowell, Arizona USA
General Co-Chairs:
Tim LeClair, Vitrix Labs, Inc. | Rick Elbert, Cicor
Organizing Committee:
Susan Bagen, Consultant | Josh Fribley, Honeywell | Rajiv Iyer, Medtronic |
Andy Kelly, Cirtec Medical | Kedar Shah, Google | Vern Stygar, Asahi Glass
Overview: The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in Fort McDowell, Arizona on Advanced Packaging for Medical Microelectronics on March 21-22, 2024. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage discussions involving technologies, products, strategies, current and emerging markets, and collaborations. This two-day event will draw invited experts in the fields of medicine, medical devices, biomaterials, microelectronics, semiconductor packaging, and product assembly.
DISEASE
DETECTION
Diagnostic Devices
DNA Sequencing Devices
Single-Cell Diagnostics
Injectibles & Ingestibles
MATERIALS
Si Lab-on-Chip
Glass Microfluidics
Device Miniaturization
Power & Energy Harvesting
ASSEMBLY
Implantables
Wearables
Flexible Assemblies
RF & Wireless
APPLICATIONS /
PRODUCTS
Smart Electrodes & Catheters
Brain-Computer Interface Devices
Cochlear/Retinal/
Olfactory
AI for Medical Devices
Those wishing to present a 25-minute technical talk (+5 mins Q&A) at the workshop, please submit a 100+ word abstract through the link above no later than December 1, 2023. Please contact bschieman@imaps.org if you have questions. Full papers are not required. PowerPoint format recommended; no event template required. A post-event download containing the presentations will be distributed to attendees. Speakers are required to pay a reduced registration fee.
