The Most Wonderful Time of Year for A Semiconductor Technologist
Dec 08, 2020 · By Dean Freeman · 3D Event Coverage
Latest Posts
A Glimpse of IEDM 2020
The IEDM conference always has a great display of leading-edge technology in the papers, but I always find a great...
Executive Insight Panel Tackles Geopolitics, Trade Tensions, and The Future of the Semiconductor Industry
SEMI’s 2020 ITPC, which was held virtually instead of its usual Hawaiian location, offered such robust panel discussions, that it seemed a...
What’s Driving the Next 10 Years of MEMS?
MEMS sensors have come a long way over the past few decades. The late 1990s brought us the mass production...
3D InCites Community Members iMAPS Preview
iMAPS: Enabling a Connected World: Always On! 3D InCites will be participating in the iMAPS 2020 virtual symposium, October 5-8,...
SEMICON Taiwan 2020 Takes the Hybrid Road
It is my pleasure to inform you that SEMICON Taiwan Hybrid will open next week from Sep. 23 (Wed.) –...
The Global Packaging Community Shows up for Virtual ECTC!
The pandemic made this a unique year for ECTC. To my knowledge, it is the first time that the in-person...
Before SEMICON West 2020, There was IMEC ITF USA 2020
Each year as SEMICON West approaches, I look forward to the IMEC ITF USA event. For the past several years...
Virtual SEMICON West 2020: The Soft Launch
Whew! That was a busy two hours! Here’s a short blog post about my initial impressions of Virtual SEMICON West...
Virtual DAC 2020 Addresses Chiplets and Advanced Packaging
Why is attending Design Automation Conference (DAC 2020) important for 3D InCites readers? Two of my previous employers – National...
Zooming Into SEMICON West
This year, 3D InCites is zooming into SEMICON West, talking with our community to see how our members are handling...
What to Expect at Virtual SEMICON West 2020
This feels weird, folks. For the first time in 15 years, I didn’t board a flight bound for SEMICON West...
ECTC 2020 Online is Accessible at No Charge
When I switched my focus from single-die SoCs to multi-die ICs, I had to learn a lot about IC packaging...
Your Guide to Getting the Most out of Virtual ECTC 2020
One silver lining to COVID 19 for the microelectronics and advanced packaging communities is the ability to attend virtual ECTC...
3D & Systems Summit Explores an Expanding Application Space
Back in 2013, when 3D through silicon via (3D TSV) technology was a hot topic, SEMI Europe created the European...
2020 IEEE International Reliability Physics Symposium Changed to Virtual Conference; New Date April 28
Due to Concerns Over Coronavirus (COVID-19) Outbreak, the 2020 IEEE International Reliability Physics Symposium Will Be Presented Online as a...
3D InCites Community Members to Play Key Role at IMAPS DPC
What’s on the agenda for the 2020 IMAPS Device Packaging Conference (DPC)? So much, and too much to share it...
ISS 2020: How to Win in Our Data-driven World – Part 2
In Part 1 of my ISS 2020 blog, I described Monday’s opening keynote by LAM’s CTO, Richard Gottscho. He explained...
ISS 2020: How to Win in Our Data-driven World
From January 14 to 16, 2020 SEMI welcomed about 300 high-level executives to the Industry Strategy Symposium (ISS 2020) at...
IEDM 2019: Making Electronic Systems Smarter, Safer, and More Reliable
The San Francisco Hilton on O’Farrell Street welcomed IEDM 2019 and it’s 1800 attendees in early December. While the conference...