A stellar lineup is the foundation of a great panel discussion ~ and we have the perfect group for the “Addressing Barriers to Co-Packaged Optics” panel session on March 3 at Device Packaging Conference in Phoenix.
Continuing the tradition, Jan Vardaman will serve as moderator for the 6:45pm evening panel. The panel’s topic carries forward a discussion started in October 2025 (at the IMAPS Symposium in San Diego), with ongoing insights into the challenges and solutions each quarter. Esteemed experts will join the conversation, promising an engaging exchange of ideas.
Sandeep Razdan, NVIDIA
Hiren Thacker, Cisco
Suresh Pothukuchi, Marvell
Dave Armstrong, ISE-Labs
The Co-Packaged Optics panel session and refreshments are sponsored by TechSearch International, Inc.
Device Packaging Conference runs March 2-5 at the Sheraton Grand at Wild Horse Pass in Phoenix, Arizona.
