Wire bonding, while one of the oldest interconnect technologies, remains a dominant solution in high-volume semiconductor packaging. When VIEW learned the International Microelectronics Assembly and Packaging Society (IMAPS) was hosting an Advanced Technical Workshop and Tabletop Exhibition focused on wire bonding, we jumped at the chance to attend.
The event, held May 12–13 in Woburn, Massachusetts, was co-located with the IMAPS New England Chapter Symposium, facilitated by a community of highly-engaged professionals we were very excited to meet!
We were especially pleased to participate alongside our valued authorized representative, D. Beck Company, who supports customers across the New England region. Together, we connected with a steady flow of attendees in our well-trafficked booth.
The two-day program featured keynote presentations from Heraeus Materials, Hesse Mechatronics, Kulicke & Soffa Industries, and IBM Research, alongside technical sessions delivered by industry leaders and academic experts. Attendees participated in a robust agenda that included technical presentations, panel discussions, and interactive dialogue sessions, complemented by valuable networking opportunities. Key discussion topics included additive technologies, advanced packaging, emerging materials, and photonics and optoelectronics packaging. The event also featured a well-attended poster session and networking reception, making for good camaraderie amongst the group.
The Wire Bonding Technical Workshop held on Wednesday showcased recent innovations in wire alloys, high-density vertical wire bonding, new solder column technologies, and ultrasonic pin welding. The presentations provided valuable insight into the level of innovation and engineering progress being driven by leading companies in this space, highlighting the continued evolution of wire bonding technologies. But they also revealed common challenges attendees are having with bond formations and adhesion, substrate cratering, thermal deformations, and high-accuracy inspection.
VIEW Micro Metrology was invited to present its latest wire bonding application study. The presentation demonstrated Z-height measurement on an asymmetric variable loop wire-bonded workpiece, along with detailed analysis of loop heights and lead/pad geometries using Area Multi-Focus (AMF) 3D modeling software.
Key points highlighted in the talk addressed industry challenges surrounding reflective glare on loop and solder bumps, inspection limitations of simple AOI routines, measurement traceability to industry standards, and uses for detailed forensic metrology data.
| VIEW’s presentation was based on an article published in the 2026 Wire Bonding issue of iMAPS’ Advancing Microelectronics magazine (Volume 53, Number 2). |
Overall, wire bonding as an interconnect technology is alive and well. Wire bonding system manufacturers are still innovating, and companies still have great need for reliable inspection programs. Once again, the organizing committee, the IMAPS New England chapter, and the IMAPS leadership team from Pittsburgh delivered an outstanding event. The meeting was exceptionally well coordinated, hosted at a wonderful venue with excellent food, and featured highly informative and relevant technical presentations. A sincere thank you to the event sponsors, including MRSI–Mycronic, Hesse Mechatronics, TopLine, and the many other companies showcased throughout the event. The full list of sponsors is available here.
