There’s no doubt about it. This is a good time to be in the microelectronics and packaging sector of the semiconductor industry. With exciting markets like artificial intelligence (AI), 5G, and the internet of things (IoT) technologies moving from ideas to implementation, this previously tired segment of the semiconductor industry is poised for action and faces abundant opportunities. “The s... »
Creating smart cities while also protecting the personal data of its citizens is no easy task these days, particularly with growing public awareness and concern about how their data is being used and shared. It’s become a challenge particularly in Europe, where urban designs lend themselves well to smart city concepts, yet the region’s dedication to protecting citizen data is of paramount impo... »
Yes. You read that right. It is my great pleasure to announce that Dr. Phil Garrou is joining 3D InCites as contributing editor and as a member of our esteemed technical advisory board. Like me, you may have noticed a pause in Phil’s missives on all things advanced packaging. While it’s only been a month or so since he penned his last post for Solid State Technology, it has already left a void... »
“Driven” doesn’t even begin to describe Romanian-born Rozalia Beica, global director, strategic marketing, DowDupont. Neither rain, nor sleet, nor whizzing bullets overhead can keep this SemiSister from achieving her goals. Her journey to success in the semiconductor industry spanned countries and continents and survived communist dictatorship, mandatory military service, a revolution, and a... »
3D very large system integration (3D VLSI) has many aliases. This high-density approach to 3D system integration first appeared on the scene as monolithic 3D (M3D), or as Leti dubbed it: sequential 3D. In 2014, the French research institute officially introduced it as CoolCube™ because this version of the technology addressed the thermal issues that plagued early versions of M3D. This paved th... »
At the 2018 European MEMS, Imaging and Sensors Summits, I detected a shift in sentiment around the likelihood (and the feasibility) that fully-autonomous vehicles are poised to take to the roads in the next two years. In reality, fully-autonomous vehicles won’t be rolling off the assembly lines any time soon, if ever. The readiness of sensor systems and the high cost of manufacturing these cars ... »
Last week, at the co-located 2018 European MEMS and Sensors/Imaging and Sensors Summits, held in Grenoble, France, I had the pleasure of gathering with 380 attendees from 21 companies from around the world to discuss the latest trends and technologies in MEMS, imaging, and sensors. Topics of discussion included the latest MEMS, imaging, and sensor market trends; application spaces such as automoti... »
It’s almost ironic. As CMOS scaling (aka: Moore’s Law) has slowed due to the increased complexity and cost of achieving smaller nodes, the focus has shifted to advanced packaging and heterogeneous integration to meet demands for microelectronics devices targeting the internet of things (IoT) market. These devices perform a variety of functions (sensing, processing, remembering, transmitting) i... »
It used to be that people thought about metrology for front-end process control and inspection for advanced packaging. As wafer level packaging (WLP) and heterogeneous integration (HI) approaches became more advanced, metrology processes began creeping into back-end process control, where measurement becomes trickier and more diversified. As part of the 3D InCites Award Winners series, I spoke wit... »
The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of electrical/electronics engineers in the US are women. For racial diversity, the situation is even worse. These grave statistics came to light during a recent panel discussion during SEMICON West, in its Workforce Pavilion. Here, Jessica Gomez, co-founder and CEO of Rogue Valley Mic... »
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