MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Die bonding demonstrations will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at Messe München in Munich, Germany from November 12-15, 2019. MRSI will demonstrate the industry-leading 1.5 micrometer die bonder, MRSI-H-LD for high-volume manufacturing of advanced photoni... »
PROPHESEE Joins IRT Nanoelec 3D Integration Program Will Work with CEA-Leti, STMicroelectronics, Mentor, EVG, and SET to Develop New 3D Event-Based Vision System GRENOBLE, France – Oct. 14, 2019 – PROPHESEE, the inventor of the world’s most advanced neuromorphic vision systems, joins the IRT Nanoelec consortium to help broaden the field of potential applications for 3D hybrid wafer-to-wafer ... »
We are preparing content for our 2nd annual print edition! 3D InCites is Looking for: Executive viewpoints on today’s megatrends and what’s needed to achieve them. Contributed Technology Features on topics like: Chiplet integration techniques Process improvements for panel and wafer-level fan-out Inspection technologies for heterogeneous integration (HI) Advancements in process control Advance... »
Deca Technologies is pleased to announce that it has reached an agreement with nepes Corporation (nepes) whereby nepes will expand its geographic footprint and manufacturing capabilities by taking over the operations of Deca Technologies’ Philippines manufacturing facility. The investment will permit the expansion of the WLCSP capacity already in mass production and will now offer up to 100,000 ... »
Consumer demand for mobile phones weakened in 2018, resulting in a market decline. In this context, the competition has intensified, creating an emulation to push 5G forward. Yole Développement (Yole) announces an 8% CAGR[1] between 2018 and 2025 for the RF[2] front-end market. Reaching US$15 billion in 2018, this industry should reach US$25.8 billion by 2025, confirms the RF electronics team at ... »
“Although the inflated excitement has started to plunge after few years of hype, fan-out technologies are still very well established in low-end and high-end applications”, asserts Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “It has proven benefits in terms of form factor with no IC substrates, performances with increased I/O density and reliability with die p... »
Driven by advanced packaging substrate needs, the industry has reached an inflection point in IC substrate manufacturing. Increasing I/O counts are driving substrate layer counts to more than 20. Larger die sizes and multiple die mounted on the substrate are driving the need for larger body sizes, up to 100 mm x 100 mm. Some companies use a silicon interposer with multiple redistribution layers (R... »
MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is based in Shanghai. His substantial technical experience selling semiconductor equipment along with his vast network in the Chinese market is guaranteed to even further enhance our responsiveness to our cu... »
MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show will be held at the Shenzhen Convention and Exhibition Center from September 4-7, 2019. MRSI Systems will also attend the 18th ICCSZ OC Market and Technology Seminar. This event is organized by... »
NIJMEGEN, THE NETHERLANDS- Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received an order from NanoLab@TU/e of Eindhoven University of Technology. The NEO 200A series from Trymax with microwave downstream plasma technology was selected to perform resist stripping, descum, and surface cleaning on indium phosphide (InP) wafers. This order il... »
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