Press Releases

Advanced Packaging: at the Heart of Innovation

The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the keywords. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are changing our world step-by-step. Big data, artificial intelligence (A... »

Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio

Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-out Wafer-level Packaging Portfolio

 Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer solvent, wet process tool and its AP300™  lithography system to support the growth of its outsourced assembly and test (OSAT) business. One of the first independent wafer bumping service providers in Malaysia, UAT will leverage these tools for... »

MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will be working alongside our existing sales team and representatives in the region. Dr. Zhou’s deep knowledge of the photonics market and his extensive network in the Chinese market will help drive MRSI’... »

Megatrends are Changing the Future of the Lithography Equipment Market

The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding and lithography equipment market for the more than Moore (MtM)  industry is a small niche representing millions of dollars. However, megatrend markets push MtM devices to new levels of complexity, resulting in big investments. Consequently, the tot... »

Fan-Out Packaging is Becoming Imperative to Stay Competitive in Advanced Packaging

“Fan-out packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with fan-out panel level packaging (FOPLP) technology. Both companies have invested and developed FOPLP for production successfully in 20... »

ERS electronic GmbH Takes the Lead in Fan-Out Panel Level Packaging Equipment Manufacturing

ERS electronic GmbH Takes the Lead in Fan-Out Panel Level Packaging Equipment Manufacturing

ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is taking the first ever step towards developing the new generation of thermal debonding and warpage adjustment tools for fan-out panel level packaging (FOPLP). The new ERS MPDM700 supports the increasing demand for fast prototyping and new product introduction of FOPLP. It offe... »

Packaging: Consumer Solutions Adapted for Automotive Applications

Packaging: Consumer Solutions Adapted for Automotive Applications

“Automotive applications are the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy, and comfort are the keywords of today’s automotive industry. Under this dynamic context, the market ... »

Rudolph Technologies Receives Orders for Over $15 Million from Major Memory Manufacturer

Wilmington, Mass. (January 15, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for over $15 million of legacy and new process control systems from a memory manufacturer based in Asia. The systems will be used by a top-tier memory chip maker as they rapidly transition high-end DRAM (DDR4, DDR5) and HBM DRAM packaging from wire bonding to advanced packagi... »

Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection

Rudolph Technologies Announces Rapid Adoption of the Dragonfly G2 System for Advanced Packaging Inspection

 Wilmington, Mass. (January 8, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for 12 of its Dragonfly™ G2 system, just months after releasing the product. Several systems were delivered in the fourth quarter to the largest OSAT where the Dragonfly G2 systems displaced incumbent 3D technology and retained the Company’s market leadership in 2D ma... »

Fan-out Panel Production Becomes a Reality

Fan-out Panel Production Becomes a Reality

Fan-out panel level production is underway at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone applications.  The Samsung Galaxy watch uses the fan-out panel level process (FOPLP) developed by Samsung Electro-Mechanics (SEMCO) to package the application processor and PMIC.  Future applications under consideration for panel production in... »

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