Press Releases

NEO 2000 for compound semiconductors

Trymax Receives Multi-System Orders from a Leading Chinese Compound Semiconductor Company

NIJMEGEN, THE NETHERLANDS – October 17, 2018 – Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received multi-system orders for its NEO 2000 Series from a Chinese foundry. This news confirms the expansion of Trymax’s footprint in the region and reinforces the company’s leadership in compound semiconductor equipment. Shipping o... »

And the winners of the MEMS, Imaging and Sensors Summits tech showcases are…

And the winners of the MEMS, Imaging and Sensors Summits tech showcases are…

The technology showcases at the European MEMS and Sensors and Imaging Sensors Summits give start-ups and established companies alike ten minutes to pitch their latest innovation to the crowd, after which attendees vote for the best. The competition is fierce, and the prize – a free booth the following year – is much sought after. Each summit has one winner, and they were announced during the g... »

Veeco Announces Changes to Executive Leadership Team

Veeco Announces Changes to Executive Leadership Team

PLAINVIEW, N.Y., September 4, 2018 —Veeco Instruments Inc. (NASDAQ: VECO) today announced that John Peeler, Chairman, and Chief Executive Officer, will transition to the role of Executive Chairman, effective October 1, 2018.  William J. Miller, currently President, will become Chief Executive Officer and will join the Company’s board of directors bringing the size of the board to eight.  Add... »

Brewer Science Unveils Dual-Layer Temporary Bonding System and Material for RDL-first Fan-Out Packaging

Brewer Science Unveils Dual-Layer Temporary Bonding System and Material for RDL-first Fan-Out Packaging

Rolla, Missouri – Sept. 4, 2018 – Brewer Science, Inc. today from SEMICON Taiwan introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address manufacturers’ evolving wafer-level packaging cha... »

Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging

Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging

Wilmington, Mass. (August 29, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced its new Dragonfly™ G2 platform, which incorporates many of the benefits of the Firefly™ system onto the Dragonfly platform, including higher sensitivity and throughput and the proprietary Clearfind™ Technology. The new system increases the options for advanced packaging customers to meet their wafe... »

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MRSI’s MRSI-H3TO Die Bonding Product Family Supports the 5G Wireless Network Supply Chain

MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3μm high speed die bonder which will be the first of its kind to address the multi-die and multi-process requirements, delivering industry-leading throughput, superior flexibility, and future-proven 3μm placement accuracy. The MRSI-H3TO is tailored for WDM/EML-TO or other multi-die multi-processing TO-can photonic devices to support... »

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MRSI Targets MRSI-H3LD Die Bonder For The High Power Diode Laser Market

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3μm high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced photonics such as industrial lasers, optical fiber amplification, lighting, and sensors. High power diode lasers are critical components for multiple markets and have seen a significant, continual rise in adoption with ... »

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MRSI Systems’ MRSI-HVM3P Extends The MRS-HVM3 Die Bonder Family to New Applications

BILLERICA, Massachusetts, USA, August 20, 2018 – MRSI Systems (Mycronic Group), is expanding its leading high-speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC). This expansion is in response to our customer’s request to take advantage of t... »

TechSearch International Analyzes Trends in Packages for AI Applications

TechSearch International Analyzes Trends in Packages for AI Applications

Artificial Intelligence (AI) combines both hardware and software.  TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found in datacenters require high-density packages to support logic plus high bandwidth memory (HBM). Many silicon interposer designs are in mass production and Intel’s EMIB is also used.  Package-on-package (PoP) is use... »

Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies

Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies

SAN JOSE, Calif. (August 2, 2018) – Xperi Corporation (Nasdaq: XPER) (“Xperi”) is pleased to announce a partnership with leading global semiconductor foundry, UMC. This strategic partnership will enable the companies to support the growing demand for Invensas’ direct and hybrid bonding (ZiBond® and  DBI®) 3D semiconductor technologies. Together, Xperi and UMC will further optimize ... »

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