Press Releases

EV Group Invests 30 Million Euros for Capacity Expansion at Corporate HQ in Austria

EV Group Invests 30 Million Euros for Capacity Expansion at Corporate HQ in Austria

EV Group (EVG) today announced that it has begun construction on another extensive capacity expansion building project at its corporate headquarters in St. Florian am Inn, Austria. With an investment of 30 million Euros, the new Cleanroom V building will create additional capacity for product and process development, equipment demonstrations for existing and potential customers, feasibility studie... »

TechSearch International Analysis Predicts Growth for Fan-in WLP and FO-WLP

TechSearch International Analysis Predicts Growth for Fan-in WLP and FO-WLP

TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan-out WLPs (FO-WLPs).  Despite lower growth for smartphones, growth continues as the number of WLPs per handset increase. WLPs are increasingly adopted in tablets, and wearable devices such as smartwatches, fitness bands, and virtual reality headsets. Fan-in WLPs are projected to grow at an 8.5% CA... »

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced wafer bonding solutions will be highlighted in several papers being presented at the 2019 IEEE 69th Electronic Components and Technology Conference (... »

Trymax Receives Multi-System Orders from a Top Ten OSAT

Trymax Receives Multi-System Orders from a Top Ten OSAT

NIJMEGEN, THE NETHERLANDS – May 15, 2019. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received multi-system orders for its NEO 2000 and NEO 3000 series from a top ten OSAT based in Taiwan. This order will expand the existing NEO install base at the customer in Taiwan and allows Trymax to break into the customer’s fab in China. Shi... »

Trymax Launches New UV Curing and Charge-Erase Product Line

Trymax Launches New UV Curing and Charge-Erase Product Line

Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions for semiconductor manufacturers, announces the addition of an ultraviolet (UV) curing and charge-erase product line to its portfolio. The system called NEO 2000UV is a leading-edge dual chamber solution compliant with wafer sizes up to 200mm. UV curing and charge-erase equipment are used for a wide range of application... »

EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing

EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry’s first process technology platform for wafer-level heterogeneous integration of gallium arsenide (GaAs) on silicon for use in R... »

Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019

Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019

Rudolph Technologies, Inc. (NYSE: RTEC) today announced the immediate availability of its new JetStep® lithography systems for advanced packaging processes on wafer and panel formats. The JetStep systems incorporate an option for a new, proprietary submicron lens design, as well as up to 25% increased productivity over the previous JetStep systems. The JetStep wafer stepper will also feature a 20... »

Trymax Signs Strategic Financial Partnership with NIBC Bank

Trymax Signs Strategic Financial Partnership with NIBC Bank

Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma-based equipment and solutions for semiconductor manufacturers, is pleased to announce NIBC Bank as a new strategic financial partner. This partnership will enable Trymax to accelerate new technology developments and scale up its manufacturing capacity. The Dutch merchant bank is providing growth capital via a minority equity pos... »

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide a novel resist processing solution for plasma dicing that is developed for emerging applications, such as Internet of Things (IoT) sensors, MEMS, RFID, CMOS image sensors and thinned memories. This advanced solution, which incorporates the EVG®100 series of resist processin... »

Heterogeneous Integration Drives New Package Developments

Heterogeneous Integration Drives New Package Developments

The high cost of moving to the next semiconductor technology node is changing the role of packaging and assembly in the electronics industry. Heterogeneous integration has become the solution to achieve the economic advantages that were previously met with silicon scaling. TechSearch International’s new report describes these packaging options, including silicon interposers, fan-out-on-substrate... »

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