Press Releases

The Advanced Packaging Industry is on the Move

The Advanced Packaging Industry is on the Move

Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts from all over the world are deeply involved in the development of innovative solutions to answer to the market demand dominated by megatrends. “Megatrend will probably be the keyword for the next 10-years within the advanced packaging industry, and more gen... »

EV Group Secures Lithography Order from VTT Technical Research Centre for “More than Moore” Applications

EV Group Secures Lithography Order from VTT Technical Research Centre for “More than Moore” Applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received an order for its EVG®120 automated resist processing system from VTT Technical Research Centre of Finland (VTT). An existing customer of EVG’s wafer bonding and alignment systems, VTT is among the first to place an order for t... »

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets

Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary, Unity Semiconductor Limited Company (UnitySC Asia). The entity was established to deliver enhanced customer support for UnitySC’s growing installed base of inspection and metrology tools throughout the region. UnitySC Asia is headquartered at T... »

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has started construction work for the next expansion phase of its corporate headquarters. The new, state-of-the-art building will house EVG’s “Manufacturing III” facility, which will more than double the floor space for the final assemb... »

Kamel Ait-Mahiout Appointed as CEO of UnitySC

Kamel Ait-Mahiout Appointed as CEO of UnitySC

Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and related industries, today announced that its board of directors has appointed Kamel Ait-Mahiout as chief executive officer. He has also been elected to serve on UnitySC’s board. Following the company’s recent announcement of the acquisition of HSEB Dresden, Gmb... »

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control

Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a leading supplier in optical inspection, review, and metrology for high-value semiconductor applications. Following the acquisition, the new entity’s extended line of leading-edge semiconductor process control solu... »

Apple selected substrate-like PCBs for its latest iPhones. Who’s next?

Apple selected substrate-like PCBs for its latest iPhones. Who’s next?

The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are giving way to functional applications that are plotting the semiconductor industry’s future course. Internet of Things (IoT), the automotive market, 5G connectivity, augmented and virtual reality (AR/VR), and artificia... »

EV Group and IBM Sign License Agreement on Laser Debonding Technology

EV Group and IBM Sign License Agreement on Laser Debonding Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and IBM (NYSE: IBM) today announced that the companies agreed to sign a license agreement on laser debonding technology. EVG plans to integrate IBM’s patented Hybrid Laser Release process into EVG’s advanced, field-proven temporary bonding and debonding equipmen... »

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

North Billerica, MA, March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our new MRSI-HVM3 die bonder system has entered a volume production phase, using advanced Demand Flow Technology (DFT) to satisfy worldwide customer demand. Our ability to deliver the new product with short lea... »

TechSearch International Analysis Shows Packaging for Cryptocurrency Provides a Windfall

TechSearch International Analysis Shows Packaging for Cryptocurrency Provides a Windfall

Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip-chip CSPs and BGAs is expected to provide increased volumes this year to help keep foundries and OSATs busy. Few are willing to add foundry, substrate, or assembly capacity for cryptocurrency because of its unpredictability, but many are enjoying the windfall. Cryptocurr... »

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