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TechSearch International’s Analysis Examines Impact of World Events and Material Shortages on BGA and CSP Market Growth

May 12, 2022 · By TechSearch International, Inc.

TechSearch International’s Analysis Examines Impact of World Events and Material Shortages on BGA and CSP Market Growth 2021 was a...

UPVfab Adds Micro-Transfer Printing Technology for Hybrid Photonic Integration

May 11, 2022 · By X-Celeprint

Massively parallel pick-and-place of large arrays of III-V semiconductors bring new heterogeneous integration capabilities for silicon photonics Valencia, Spain, and...

Henkel Opens New Technical Application Center in Silicon Valley to Foster Next-Generation Electronics Development

May 10, 2022 · By Henkel

Irvine, CA – Henkel today announced the opening of its Application Center in Santa Clara, CA designed to support product...

Xperi and LAPIS, a ROHM Group Company, Enter into Hybrid Bonding License Agreement

May 09, 2022 · By Xperi

Technology transfer includes DBI® Ultra die-to-wafer hybrid bonding know-how SAN JOSE, Calif. & YOKOHAMA, Japan, May 04, 2022–(BUSINESS WIRE)–Adeia, the newly...

Smoltek Updates on the Company’s Strategic Objectives

May 05, 2022 · By Smoltek

Smoltek Nanotech Holding AB (publ) (”Smoltek”) today announces an update and a clearer definition of the company’s strategic objectives, with...

Nordson Electronics Solutions Introduces New Helios® System for Dispensing Single-component Thermal Interface Materials

May 05, 2022 · By Nordson ASYMTEK

Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste Carlsbad, CA, USA...

SEMI Veteran Paul Trio Takes Reins of SEMI Standards Program

May 04, 2022 · By SEMI

MILPITAS, Calif. — May 4, 2022 — SEMI today announced the promotion of 20-year SEMI veteran Paul Trio to Director...

StratEdge High-Power Semiconductor Packages will be Featured at CS MANTECH in Monterey, California

May 04, 2022 · By StratEdge

Santee, Calif. — 4 May 2022 — StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for...

Atotech and Schweitzer Engineering Laboratories Announce Business Partnership

May 04, 2022 · By Atotech

SEL to utilize Atotech’s Uniplate® equipment at SEL’s new PCB manufacturing facility in Idaho, USA Atotech products help SEL to...

YES (Yield Engineering Systems, Inc) Joins Forces with Korea’s H&iruja for Manufacturing and Distribution

May 02, 2022 · By Yield Engineering Systems

YES has executed a manufacturing and distribution agreement with H&iruja to address Korea’s advanced packaging market opportunities. YES (Yield Engineering...

Smoltek Extends Evaluation Agreement and Initiates MoU Negotiations with Global Manufacturer for Joint Development of Ultra-thin CNF-MIM Capacitors

May 02, 2022 · By Smoltek

This press release is an English version of the previously published Swedish version, which has interpretive precedence. Smoltek Nanotech Holding...

Increased U.S. Manufacturing of Microelectronics Enabled Through Mercury Systems’ Phoenix Facility Expansion

Apr 22, 2022 · By Mercury Systems

Customizable RF SiP solution redefines edge processing for radar, electronic warfare and 5G communications ANDOVER, Mass., March 22, 2022 —...

ERS electronic Announces the AC3 Fusion Thermal Chuck System

Apr 22, 2022 · By ERS electronic GmbH

AC3 Fusion is a versatile and more sustainable solution for temperature test in wafer probing MUNICH, APRIL 22nd, 2022 –...

Mercury Systems Selected to Provide Secure Packaging for DoD SHIP program

Apr 20, 2022 · By Mercury Systems

ANDOVER, Mass., April 19, 2022 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical...

CyberOptics Highlights Best Practices for Detecting Particles in Semiconductor Environments at SPIE Advanced Lithography and Patterning

Apr 19, 2022 · By CyberOptics

Minneapolis, Minnesota — April 2022 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing...

Nordson Electronics Solutions Offers Latest Dispensing, Conformal Coating, and Selective Soldering Technologies at SMTConnect 2022

Apr 13, 2022 · By Nordson ASYMTEK

Electronics manufacturing equipment to be demonstrated in the SmartTec stand 4-210 and in the Fraunhofer Future Packaging line, stand 5-434...

Raxium Selects ClassOne Solstice S4 Electroplating System to Develop Advanced microLED Displays for Augmented/Virtual Reality Applications

Apr 12, 2022 · By ClassOne Technology

Four-chamber, single-wafer ClassOne Solstice tool to be deployed for R&D and volume manufacture of Raxium’s ultra-high-density monolithic RGB microLED displays ...