Press Releases Archives

SUSS MicroTec and BRIDG Join Forces to Establish a Production-Level Applications Center in North America

admin December 3, 2019 Press Releases 0

SUSS MicroTec, leading supplier of equipment and process solutions for the semiconductor industry, announced today a far-reaching collaboration agreement with BRIDG, a not-for-profit, public-private partnership focused on production process technologies, advanced system integration, and 200mm microelectronics fabrication advancing next-generation nanoscale technology. This partnership puts an unpr... »

Lam Research Offers New Capabilities in its Edge Yield Product Portfolio

admin December 3, 2019 Press Releases 0

Lam Research Corp. (Nasdaq: LRCX) is offering new capabilities in its semiconductor manufacturing systems portfolio to further improve device yield at the edge of the wafer, which is essential to delivering greater productivity for customers. During the semiconductor production process, device manufacturers want to build integrated circuits on the entire surface of the wafer. On the edge of the wa... »

MRSI receives Laser Focus World Innovators Award for HVM Die Bonder

MRSI Systems November 26, 2019 Press Releases 0

MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for the Laser Focus World Innovators Award in the Manufacturing Equipment for Photonic Components category. The MRSI-HVM was recognized for a very good innovation that resulted in marked improvement over previ... »

Chiplets: Key Enablers for the Next 10-20 Years

TechSearch International, Inc. November 26, 2019 Press Releases 0

Continued monolithic integration is expensive and can suffer from the defect density yield loss associated with large die. As a result, an increasing number of companies are turning to new architectures using chiplets to achieve the economic advantages lost with expensive monolithic scaling. TechSearch International’s new Advanced Packaging Update (APU) details many advantages of chiplets and pr... »

Siemens and Qualcomm Set Up First Private Standalone 5G Network in Industrial Environment

admin November 26, 2019 Postings, Press Releases 0

· Sustainable technological cooperation for the future of industrial wireless communication · Joint Proof of Concept in a real industrial environment using the 3.7-3.8 GHz band · Researching the capabilities of 5G standalone networks for industrial applications Siemens and Qualcomm Technologies, Inc. have implemented the first private 5G standalone (SA) network in a real industrial environment ... »

Cu-Interposer Drives Connectivity to the Next Level

admin November 22, 2019 Postings, Press Releases 0

Elsoff. Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019. The progressive miniaturization, increasing integration density and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have been developed... »

SEMI, Partners Launch Largest Microelectronics Education Initiative

SEMI November 21, 2019 Postings, Press Releases 0

SEMI and 19 partners from 14 countries today launched a microelectronics education initiative to fill the skills gap and boost workforce diversity by tightening collaboration between the microelectronics industry and education providers. The project, dubbed METIS – Microelectronics Training, Industry and Skills – will focus on the skills and related training needed to support emerging vertical... »

Power Module Packaging: Innovation is Reshaping the Supply Chain

YOLE DEVELOPPEMENT November 4, 2019 Press Releases 0

Yole Développement (Yole) power electronics team’s presents this year an optimistic analysis of the power electronics industry. The power device market is showing a comfortable 13.9% growth between 2018, compared to 2017. The market research & strategy consulting company points out a second consecutive high-growth year in this industry, after a couple of flat years… Without doubt, both ma... »

MRSI to offer Die bonding Demonstrations at Productronica

MRSI Systems October 22, 2019 Press Releases 0

MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Die bonding demonstrations will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at Messe München in Munich, Germany from November 12-15, 2019. MRSI will demonstrate the industry-leading 1.5 micrometer die bonder, MRSI-H-LD for high-volume manufacturing of advanced photoni... »

PROPHESEE Joins IRT Nanoelec 3D Integration Program

Sarah-LyleDampoux October 14, 2019 Press Releases 0

PROPHESEE Joins IRT Nanoelec 3D Integration Program Will Work with CEA-Leti, STMicroelectronics, Mentor, EVG, and SET to Develop New 3D Event-Based Vision System GRENOBLE, France – Oct. 14, 2019 – PROPHESEE, the inventor of the world’s most advanced neuromorphic vision systems, joins the IRT Nanoelec consortium to help broaden the field of potential applications for 3D hybrid wafer-to-wafer ... »

3D Integration 101: Explore, Learn, Share

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