ACM Research Ships Its First 300mm, High-Temp Single-Wafer SPM Tool for Advanced Logic, DRAM and 3D-NAND Semiconductor Manufacturing
Sep 23, 2021 · By ACM Research · Press Releases
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Onto Innovation’s Dragonfly® Inspection Platform Projecting Record Annual Growth in 2021
Dragonfly system growth accelerated by tier 1 customer adoption WILMINGTON, Mass.–(BUSINESS WIRE)– Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation”, “Onto”,...
Smoltek Extends Evaluation License for its CNF-MIM Capacitor Technology to Increase Focus on Commercial Production Aspects
Smoltek Nanotech Holding AB (“Smoltek”) announces that the license agreement, signed with a global manufacturer of electronic components for its...
World’s Best Industrial Studio Featuring SurplusGLOBAL
Collaborating with ELLE’s September edition. In September’s ELLE magazine issue, SurplusGLOBAL Semiconductor Equipment Cluster was used as the industrial studio...
ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing
Automated system for flat or notched wafers; multiple orders to ship during third quarter of 2021 Fremont, Calif. – August 25,...
Cooperation of ZKW Group with Silicon Austrian Labs, Evatec, EV Group and TDK Electronics advances light projection technology
WIESELBURG, Austria, August 25, 2021—Together with research partners Silicon Austrian Labs, Evatec, EV Group and TDK Electronics, ZKW is working...
ACM Research Enters Bevel Etch Market to Support Emerging Process Steps in 3D NAND, DRAM and Advanced Logic Manufacturing
Wet process offers edge etch and clean to improve wafer yield with high throughput and low chemical consumption; First tool...
Bioh Kim Joins YES Senior Executive Team as President of YES Korea
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications,...
QP Technologies Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets
ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly...
Amkor’s DSMBGA Advanced SiP Platform is the Preferred Packaging for 5G RF
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of...
Håkan Persson Appointed New CEO of Smoltek
Håkan Persson, with many years of experience in running and developing listed technology companies, is appointed new CEO of Smoltek....
CyberOptics to Showcase High-Precision Inspection and Metrology Solutions at the SEMI Connecting Heterogeneous Systems Summit
Minneapolis, Minnesota — August 4, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D... YES Delivers First VertaCure™ XP to Leading Chinese OSAT Customer
FREMONT, Calif. – Aug 9, 2021 – YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor...
SEMI Unveils Diversity, Equity and Inclusion Roadmap, Toolkit and Event Guidelines
MILPITAS, Calif. – August 9, 2021 – SEMI, the trade association representing the global electronics design and manufacturing supply chain, today...
Atotech’s New Generation of Zirconium-based Cleaner Coaters Provide Efficiency and Sustainability in a Single Step
UniCoat®, the ideal solution for applicators producing a wide variety of painted components with wet paint or powder paint BERLIN,...TechSearch International’s Analysis Shows Shortage of FC-BGAs Substrates Persists
Despite capacity increases this year, and additional plans through 2025, demand for FC-BGA substrates is outstripping supply. What’s driving the...
SurplusGLOBAL has moved to Semiconductor Equipment Cluster in Yongin-si
Contributing to the vitalization of the global semiconductor equipment ecosystem Expecting to attract more than 1,000 overseas customers annually as... YES EcoCoat™ HVM to Help Customer Fulfill Large NIH Contract for Rapid COVID Antibody Testing Devices
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications,... Don Foldenauer Joins YES as Vice President of Operations
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications,...
Micross Expands Capabilities with the Acquisition of Microelectronics Business Assets of Ultra CEMS
Melville, NY (July 7, 2021) – Micross Components, Inc. (“Micross”), a leading global provider of mission-critical microelectronic components and services...