Press Releases

Trymax Launches New UV Curing and Charge-Erase Product Line

Trymax Launches New UV Curing and Charge-Erase Product Line

Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions for semiconductor manufacturers, announces the addition of an ultraviolet (UV) curing and charge-erase product line to its portfolio. The system called NEO 2000UV is a leading-edge dual chamber solution compliant with wafer sizes up to 200mm. UV curing and charge-erase equipment are used for a wide range of application... »

EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing

EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry’s first process technology platform for wafer-level heterogeneous integration of gallium arsenide (GaAs) on silicon for use in R... »

Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019

Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019

Rudolph Technologies, Inc. (NYSE: RTEC) today announced the immediate availability of its new JetStep® lithography systems for advanced packaging processes on wafer and panel formats. The JetStep systems incorporate an option for a new, proprietary submicron lens design, as well as up to 25% increased productivity over the previous JetStep systems. The JetStep wafer stepper will also feature a 20... »

Trymax Signs Strategic Financial Partnership with NIBC Bank

Trymax Signs Strategic Financial Partnership with NIBC Bank

Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma-based equipment and solutions for semiconductor manufacturers, is pleased to announce NIBC Bank as a new strategic financial partner. This partnership will enable Trymax to accelerate new technology developments and scale up its manufacturing capacity. The Dutch merchant bank is providing growth capital via a minority equity pos... »

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide a novel resist processing solution for plasma dicing that is developed for emerging applications, such as Internet of Things (IoT) sensors, MEMS, RFID, CMOS image sensors and thinned memories. This advanced solution, which incorporates the EVG®100 series of resist processin... »

Heterogeneous Integration Drives New Package Developments

Heterogeneous Integration Drives New Package Developments

The high cost of moving to the next semiconductor technology node is changing the role of packaging and assembly in the electronics industry. Heterogeneous integration has become the solution to achieve the economic advantages that were previously met with silicon scaling. TechSearch International’s new report describes these packaging options, including silicon interposers, fan-out-on-substrate... »

SkyWater Chooses Veeco Wet Processer for 3DSoC Collaboration with MIT

SkyWater Chooses Veeco Wet Processer for 3DSoC Collaboration with MIT

PLAINVIEW, N.Y., Feb. 28, 2019—Veeco Instruments Inc. (NASDAQ: VECO) today announced that SkyWater Technology Foundry has taken delivery of the WaferStorm® single wafer wet process system to support advanced development work for the design and fabrication of next-generation 3D monolithic System-on-a-Chip (3DSoC) technology. One of the most advanced U.S.-based semiconductor technology foundries,... »

HPC, AI and Datacenters: the 2.5D and 3D Stacking Technologies Playground

HPC, AI and Datacenters: the 2.5D and 3D Stacking Technologies Playground

“2.5D and 3D stacking technologies are the only solutions that meet the required performance of applications like artificial intelligence (AI) and datacenter as of today”, confirms Mario Ibrahim, Technology & Market Analyst from Yole Développement (Yole). Stacking technologies are used in a variety of hardware, including 3D stacked memory, graphics processor units (GPUs), field programmab... »

KLA Completes Acquisition of Orbotech Ltd.

KLA Completes Acquisition of Orbotech Ltd.

MILPITAS, Calif., Feb. 20, 2019—KLA-Tencor Corporation (NASDAQ: KLAC) today announced the completion of the acquisition of Orbotech Ltd. (NASDAQ: ORBK). “We are very pleased to have completed the acquisition of Orbotech,” said Rick Wallace, president and CEO of KLA. “This new combination extends KLA’s market reach within the electronics value chain, opens new high-growth markets for the... »

Advanced Packaging: at the Heart of Innovation

The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the keywords. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are changing our world step-by-step. Big data, artificial intelligence (A... »

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