Press Releases

TechSearch International Explores Power Device Packaging and Assembly Trends

TechSearch International Explores Power Device Packaging and Assembly Trends

Power devices are experiencing growth driven by demand in a variety of areas. TechSearch International projects a 4.3% growth in overall leadframe package shipments from 2017 to 2021 for power device packaging, with stronger growth projected for Cu clip packages. Applications including energy generation and infrastructure, electric and hybrid vehicles, electric vehicle charging, data centers, indu... »

EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing

EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the all-new BONDSCALE™ automated production fusion bonding system. BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches that use la... »

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market. microLEDs are the key optical technology for nex... »

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP – Innovations for High-Performance Microelectronics (IHP), a German research institute for silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication, has purchased an EVG® ... »

UnitySC Unveils New Inspection System for the Advanced Packaging and Wafer Processing Ecosystem

UnitySC Unveils New Inspection System for the Advanced Packaging and Wafer Processing Ecosystem

Grenoble, France (November 8, 2018)— UnitySC European leader and a key player in inspection and metrology solutions, today launched the Unity_LIGHTiX ™ system for micro/macro all surface inspection and 2D/3D metrology. This new inspection and metrology system has been designed to address multiple applications including redistribution layers (RDL) down to 2/2 µm line/space, as well as µbump i... »

MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China. MRSI will be offering local demonstrations of its market-leading MRSI-HVM3 die bonder and also die bonding applications using customer’s sample materials, by arrangement. Thi... »

Trymax Turns 15 and Celebrates Success at SEMICON Europa 2018

Trymax Turns 15 and Celebrates Success at SEMICON Europa 2018

NIJMEGEN, THE NETHERLANDS – November 08, 2018. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions for semiconductor manufacturers, has reached a milestone this month celebrating 15 years of business. As a testimonial of its success, the company recently won the entrepreneurial prize from the Dutch financial institution FD Gazellen(1). “We have come a long way s... »

Rudolph Technologies Releases NovusEdge System for Edge, Notch and Backside Inspection of Unpatterned Wafers

Rudolph Technologies Releases NovusEdge System for Edge, Notch and Backside Inspection of Unpatterned Wafers

Wilmington, Mass. (November 1, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the availability of its NovusEdge™ system for edge, notch and backside inspection of unpatterned wafers. The company plans to ship multiple systems totaling more than $3M by year end to fill existing orders from two customers. The new system is the result of a multi-year collaboration with bare wafer ... »

NEO 2000 for compound semiconductors

Trymax Receives Multi-System Orders from a Leading Chinese Compound Semiconductor Company

NIJMEGEN, THE NETHERLANDS – October 17, 2018 – Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received multi-system orders for its NEO 2000 Series from a Chinese foundry. This news confirms the expansion of Trymax’s footprint in the region and reinforces the company’s leadership in compound semiconductor equipment. Shipping o... »

And the winners of the MEMS, Imaging and Sensors Summits tech showcases are…

And the winners of the MEMS, Imaging and Sensors Summits tech showcases are…

The technology showcases at the European MEMS and Sensors and Imaging Sensors Summits give start-ups and established companies alike ten minutes to pitch their latest innovation to the crowd, after which attendees vote for the best. The competition is fierce, and the prize – a free booth the following year – is much sought after. Each summit has one winner, and they were announced during the g... »

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