Press Releases

SEMI ISS 2018: AI, IoT, Automotive to Fuel Industry Growth

SEMI ISS 2018: AI, IoT, Automotive to Fuel Industry Growth

HALF MOON BAY, Calif. — January 17, 2018 — The SEMI Industry Strategy Symposium ( SEMI ISS) opened yesterday with the theme “Smart, Intuitive & Connected: Semiconductor Devices Transforming the World.” The annual three-day conference of C-level executives gives the year’s first comprehensive outlook of the global electronics manufacturing industry. Yesterday highlighted market and t... »

Luc Van den hove to Receive SEMI Sales and Marketing Excellence Award

Luc Van den hove to Receive SEMI Sales and Marketing Excellence Award

MILPITAS, CA — January 11, 2018 — SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies at ISS 2018 on January 17 in Half Moon Bay, California. Van d... »

TechSearch International Analyzes New Automotive Packaging Trends

TechSearch International Analyzes New Automotive Packaging Trends

More than 80 companies are developing autonomous vehicles and many more are involved in providing sensors and computational systems for advanced driver assistance systems (ADAS). System design, package choices, materials, and process integration are critical to the successful implementation of the new safety features that are part of ADAS and will ultimately be a part of autonomous driving. ADAS r... »

New SEMI Japan President to Drive SEMI 2.0 in Japan

New SEMI Japan President to Drive SEMI 2.0 in Japan

SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan. Reporting to SEMI president and CEO Ajit Manocha, Hamajima assumes profit and loss (P&L) responsibility for SEMI Japan and leadership of SEMICON Japan along with all regional programs, events, and initiatives including SEMI Standards and industry advocacy. With more than 325 members, SEMI Japan plays a ... »

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ

EV Group Completes Latest Phase of Production Capacity Expansion at Corporate HQ

  EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction and opened a new building at its corporate headquarters in Austria to expand capacity for producing its industry-leading process equipment. The building, part of an investment of more than 20 million Euros th... »

EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo

EV Group Installs Low-temperature Plasma Activation System for Compound Semiconductor Research at the University of Tokyo

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order from the University of Tokyo for its EVG810LT plasma activation system for compound semiconductor research. Installed at the university’s Takagi & Takenaka Laboratory, the EVG810LT augments the laboratory’s research f... »

Trymax and AST China Partner to Distribute and Support Customers in China

Trymax and AST China Partner to Distribute and Support Customers in China

NIJMEGEN, The Netherlands and Beijing, China (Oct. 10, 2017) – Trymax Semiconductor Equipment BV and AST China announced today that they have entered into a distribution and service agreement for China focusing on the institutes. The agreement is a direct consequence of increased customer activity and business for Trymax in China. AST China will act as a sales and support office for Trymax c... »

TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential

TechSearch International Forecasts Growth for High-Density FO-WLP and Examines Panel Potential

Growth for high-density fan-out wafer level packages (FO-WLPs) continues unabated, with Apple’s continued use of TSMC’s InFO process in its smartphone application processors. Standard FO-WLP has experienced a few bumps on the road to higher volumes this year. Problems with Qualcomm’s steep ramp of FO-WLP for its PMICs and RF transceivers at the end of last year, and board-level reliability c... »

Merck develops innovative materials solutions for a variety of automotive applications

Merck Brings Material Solutions to the Automotive Industry

Munich, Germany, November 14, 2017– Merck, a leading science and technology company, is offering material solutions to the next generation automotive applications. Future automotive requires different features from current electronic devices, such as heat resistance, safety, and longlasting functionality chips. As materials play a key role in the performance and reliability of advanced IC chips,... »

Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, today announced the world’s first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron). This breakthrough also achieved copper pads as small as 500nm. The copper/oxide... »

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