Press Releases

Kamel Ait-Mahiout Appointed as CEO of UnitySC

Kamel Ait-Mahiout Appointed as CEO of UnitySC

Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and related industries, today announced that its board of directors has appointed Kamel Ait-Mahiout as chief executive officer. He has also been elected to serve on UnitySC’s board. Following the company’s recent announcement of the acquisition of HSEB Dresden, Gmb... »

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control

Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a leading supplier in optical inspection, review, and metrology for high-value semiconductor applications. Following the acquisition, the new entity’s extended line of leading-edge semiconductor process control solu... »

Apple selected substrate-like PCBs for its latest iPhones. Who’s next?

Apple selected substrate-like PCBs for its latest iPhones. Who’s next?

The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are giving way to functional applications that are plotting the semiconductor industry’s future course. Internet of Things (IoT), the automotive market, 5G connectivity, augmented and virtual reality (AR/VR), and artificia... »

EV Group and IBM Sign License Agreement on Laser Debonding Technology

EV Group and IBM Sign License Agreement on Laser Debonding Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and IBM (NYSE: IBM) today announced that the companies agreed to sign a license agreement on laser debonding technology. EVG plans to integrate IBM’s patented Hybrid Laser Release process into EVG’s advanced, field-proven temporary bonding and debonding equipmen... »

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

North Billerica, MA, March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our new MRSI-HVM3 die bonder system has entered a volume production phase, using advanced Demand Flow Technology (DFT) to satisfy worldwide customer demand. Our ability to deliver the new product with short lea... »

TechSearch International Analysis Shows Packaging for Cryptocurrency Provides a Windfall

TechSearch International Analysis Shows Packaging for Cryptocurrency Provides a Windfall

Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip-chip CSPs and BGAs is expected to provide increased volumes this year to help keep foundries and OSATs busy. Few are willing to add foundry, substrate, or assembly capacity for cryptocurrency because of its unpredictability, but many are enjoying the windfall. Cryptocurr... »

Well-established Advanced Packaging Manufacturer in Taiwan selects Trymax

Well-established Advanced Packaging Manufacturer in Taiwan selects Trymax

NIJMEGEN, The Netherlands (March. 02, 2018) – Semiconductor equipment manufacturer Trymax announced today that a Taiwanese establishes advanced packaging manufacturer selects Trymax for their new advanced packaging technology. The Taiwanese manufacturer has committed a multiple tool sale with Trymax. All equipment shipments are scheduled for Q2 and Q3 this year. Trymax is selected after an ... »

Rudolph Technologies Expands Memory Customer Base with  $21 Million in System Orders

Rudolph Technologies Expands Memory Customer Base with $21 Million in System Orders

Wilmington, Mass. (January 16, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received over $21 million (USD) in orders for process control solutions for memory applications from two customers: a Korean-based manufacturer of advanced DRAM ranking in the top five of worldwide semiconductor companies and a rapidly expanding 3D NAND manufacturer in China. The orders, whic... »

aveni® S.A. Announces Breakthrough Electrical Yield Results for 12:1 Aspect Ratio TSVs

aveni® S.A. Announces Breakthrough Electrical Yield Results for 12:1 Aspect Ratio TSVs

MASSY, France – Jan. 23, 2018 – aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 3D through silicon via (TSV) packaging and 2D interconnects, today announced that CEA-Leti has successfully fabricated TSVs at an unprecedented 12:1 aspect ratio and achieved 100% electrical yield using aveni’s Rhea copper seed. This study used 12:1 aspe... »

SEMI ISS 2018: AI, IoT, Automotive to Fuel Industry Growth

SEMI ISS 2018: AI, IoT, Automotive to Fuel Industry Growth

HALF MOON BAY, Calif. — January 17, 2018 — The SEMI Industry Strategy Symposium ( SEMI ISS) opened yesterday with the theme “Smart, Intuitive & Connected: Semiconductor Devices Transforming the World.” The annual three-day conference of C-level executives gives the year’s first comprehensive outlook of the global electronics manufacturing industry. Yesterday highlighted market and t... »

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