2020 Global Silicon Revenue Remains Stable as Wafer Area Shipments Edge Up Despite COVID-19 Disruption
Feb 02, 2021 · By SEMI · Press Releases
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Amkor Factory Intelligence Enables Industry 4.0
TEMPE, Ariz., February 23, 2021 ― Amkor Technology, Inc. (Nasdaq: AMKR), a leader in advanced packaging technologies that support high-growth...
3D PLUS Contributes to Successful Mars 2020 Mission
Launched in July 2020, NASA’s Mars 2020 mission made its final descent to the Red Planet and successfully landed on...
Mosaic Microsystems and Axus Technology Collaborate on Thin Glass Wafer Processing Solutions
Chandler, Arizona, USA, February 12th, 2020 – Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer...
SEMICON West 2021 Rescheduled to December
SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced that SEMICON West 2021 and...
Siemens and ASE Introduce Enablement Technologies for Next-generation High Density Advanced Package Designs
Siemens Digital Industries Software today announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement...
Brewer Science Earns GreenCircle Certification for Zero Waste to Landfill for Sixth Consecutive Year
Brewer Science is the Only Company in the Semiconductor Industry with GreenCircle Certification Rolla, Mo.–February 2021–Brewer Science, a global technology...
Getting a Good Signal: StratEdge’s High-Performance Power Amplifier Packages on the Red Planet
Santee, Calif. — February 4, 2021 — StratEdge Corporation, a leader in the design and production of high-performance semiconductor packages...ASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration
Joint Development Program will offer highly configurable, ultra-precision end-to-end hybrid bonding solutions to suit various applications, with optimal line balancing...
CyberOptics To Showcase High-Precision Inspection and Metrology Solutions at SEMI Technology Unites Global Summit
Minneapolis, Minnesota — January 29th, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D...
Lam Research Advances Next Generation 3D Memory Manufacturing with Revolutionary New Etch Technology
Vantex™ redefines high aspect ratio etching with new innovations in technology and Equipment Intelligence® enabling chipmakers to progress 3D NAND...
YES Adds Deca’s Rapid Cure Technology to its Product Line
Unique UV plus direct thermal exposure process brings throughput & performance advantages FREMONT, Calif. – Jan 25, 2021 YES (Yield...
Key Taiwanese Influencer Names Veeco to International Consortium Aimed at Enabling Semiconductor Technology Roadmap
National Chiao Tung University to Utilize Propel MOCVD Platform for GaN Power and 5G Device Production Plainview, N.Y., Jan. 11,...
40 Years of Innovation – Brewer Science Celebrates Its 40th Anniversary, Daring to Innovate
Rolla, Mo.–January 1, 2021– Brewer Science is celebrating 40 years of being a global leader in developing and manufacturing advanced...
Onto Innovation Announces New Inspection Platform for Leading-Edge Process Control and Device Reliability
Onto Innovation’s latest inspection advances have resulted in multiple orders from a top 3 OSAT and a top 3 image...
Onto Innovation Announces First Customer Qualification of New Aspect® IRCD System
Wilmington, Mass., December 16, 2020 – Onto Innovation Inc. (NYSE: ONTO) today announced the first customer acceptance and purchase of...
3D Packaging Pioneers Share 2020 IEEE Electronics Packaging Award
A big 3D InCites congratulations to Professor Mitsumasa Koyanagi of Tohoku University’s New Industry Creation Hatchery Center (NICHe) and Dr....
KLA Introduces Two New Systems that Take On Semiconductor Manufacturing’s Toughest Problems
PWG5™ attacks 3D NAND process issues while Surfscan® SP7XP tackles 3nm logic defectivity Today KLA Corporation (NASDAQ: KLAC) announced two new...
EV Group Unveils Hybrid Die-to-Wafer Bonding Activation Solution to Speed Up Deployment of 3D Heterogeneous Integration
EVG®320 D2W die preparation and activation system provides seamless integration with third-party die bonders; completes EVG’s equipment portfolio for end-to-end...Alex Chow Joins Yield Engineering Systems, Inc. as Asia Sales President & GM
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications,...