Sikama Develops Next-Generation Reflow Platform for Advanced Panel-Level Packaging
Nov 12, 2026 · By Sikama · Press Releases
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Brewer Science Joins Washington University in St. Louis Center for Water Innovation as Corporate Partner
Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials for the microelectronics and optoelectronics industries, has joined...
KOKI Solder America, SHEA Engineering Services and PARMI USA to Examine Solder Paste Printing Challenges in UHDI Assembly Live Webinar
KOKI Solder America will host a technical webinar, “Printing for UHDI: Selecting the Right Solder Powder Size for Ultra-Fine Feature...
Finetech expands its portfolio for volume production, André Thiemann appointed Co-CEO alongside Carlotta Baumann
Finetech, a supplier of high-precision die bonding systems for advanced packaging and heterogeneous integration, is expanding its management team: André...
Applied Materials to Increase its Strategic Investment in BE Semiconductor Industries
Applied enters into agreement to increase its investment to approximately 20 percent of outstanding shares, reinforcing the companies’ long-term strategic...
Cadence Joins the Genesis Mission Consortium to Advance AI-Driven Scientific Discovery and Microelectronics Innovation
Cadence will bring AI-enabled electronic design automation, system design and analysis, and digital twin expertise to the DOE’s AI-driven science...
Forge Nano Begins Next Chapter as Publicly Traded Company
Forge Nano has reached a significant milestone, officially beginning its next chapter as a publicly traded company on the Nasdaq...
EMD Electronics Opens New R&D Facility in Wisconsin to Accelerate Advanced Semiconductor Materials Innovation
Part of $200 million multi-year investment strengthening the company’s U.S. Electronics footprint, enabling further growth for the industry New 38,000-square-foot...
Rapidus and HCLTech announce partnership for next-generation semiconductor technologies
TOKYO and NOIDA, India, Oct. 26, 2026: HCLTech, a leading global technology company, and Rapidus Corporation, a Japanese company developing...
Indium Corporation Strengthens U.S. Critical Materials Supply Chain Through Strategic Partnership With Micron
Original headline: Micron Invests in New York Critical Minerals Processing With Indium Corporation Latest investment under Micron’s up to $3...
Promex CEO Dick Otte Receives 2026 IMAPS Founder’s Award for Contributions to Microelectronics Packaging Industry
Recognition honors Otte’s decades of innovation and leadership as Promex marks more than 50 years of advancing microelectronics manufacturing and...
Evatec delivers first CLUSTERLINE® 310 for Advanced Packaging on small panel formats
Evatec has delivered its first dedicated CLUSTERLINE® 310 for panel level packaging on 310×310mm panelformats to a leading global IDM....
Heraeus Electronics Webinar: What materials perform when failure is not an option?
Link to Register As automotive, aerospace and defense, industrial, and advanced electronics continue to advance, the demands placed on applications...
Rapidus Unveils “Rapidus CORE”, New Global Ecosystem Framework Supporting the Development and Mass Production of Cutting-Edge Semiconductors
As part of its first phase, Rapidus is announcing the formation of Design Solution Associates to help customers support early-stage...Applied Materials and KIOXIA Partner at the EPIC Center to Advance Next-Generation Memory Technology
Companies will collaborate to develop advanced memory structures, chip stacking technologies and materials engineering innovations to increase AI memory performance...Toray Develops Industry-First Technology to Recover PPS from Waste Materials
Toray Industries, Inc., announced today that it has developed what it believes is, as of the publication of this release,...Indium Corporation Experts to Present Advanced Packaging, AI, and High-Performance Computing Materials Solutions at IMAPS Symposium
As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on...Brewer Science to Present High-Temperature-Stable Laser-Release Material and Join AI-Era Supply Chain Panel at IMAPS 2026
Brewer Science, a global leader in advanced materials for the semiconductor and microelectronics industries, will take part in two sessions...