Press Releases

Lam Research Establishes 28nm Pitch in High-Resolution Patterning Through Dry Photoresist Technology

Lam Research Corporation announced that its innovative dry photoresist (dry resist) technology has been qualified for direct-print 28nm pitch back...

Indium Corporation to Showcase Power Electronics Products at NEPCON Japan

As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability...

Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports

The semiconductor industry is expected to start 18 new fab construction projects in 2025*, according to SEMI’s latest quarterly World Fab...

IMAPS Device Packaging Conference and Advanced Packaging for Medical Microelectronics Workshop to Co-locate

Both events to take place March 3-7, 2025 in Phoenix, Arizona Device Packaging Conference – The event with the most...

Nova Acquires Sentronics Metrology to Expand its Dimensional Metrology Portfolio

Sentronics Metrology acquisition expands applications’ reach to backend semiconductor and wafer level packaging, including advanced packaging All-cash transaction valued at approximately $60...

IEEE JETCAS Call for Papers – 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test

This is a call for papers for a special edition of the IEEE Journal on Emerging and Selected Topics in...

Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.

CHIPS Award Will Enable Domestic Advanced Packaging for the World’s Most Advanced Semiconductors While Expected to Create More than 4,000...

YES RapidCure Systems Chosen by SkyWater Technology for Fan Out Wafer Level Packaging

The YES RapidCure tool, based on an exclusive license to the process created by Deca Technologies, is a combination of...

Comet Yxlon Enables Higher Yield of Advanced Packages with Updated CA20 Inspection Solution

Through the next generation of its CA20 X-ray inspection solution, Comet Yxlon answers the semiconductor industry’s call for fast and...

Lam Research Introduces the Semiconductor Industry’s First Collaborative Robot for Fab Maintenance Optimization

Lam Research Corp. today introduced Dextro™, the semiconductor industry’s first collaborative robot (cobot) designed to optimize critical maintenance tasks on wafer...

IBM Brings the Speed of Light to the Generative AI Era with Optics Breakthrough

New co-packaged optics innovation could replace electrical interconnects in data centers to offer significant improvements in speed and energy efficiency...

YES Announces Release of VertaCure XP G3 Systems for Advanced Packaging Applications

Yield Engineering Systems (YES) is a leading manufacturer of process equipment for AI and HPC semiconductor solutions. YES announced today...

Siemens & PhysicsX Collaborate to Build AI-Based Deep Physics Simulation

AI startup’s release of its latest pre-trained deep physics model is built on high-fidelity data generated with Siemens’ Simcenter simulation...

Glass-Driven Solutions for Advanced Packaging

As the demand for advanced interconnect solutions continues to grow, PLANOPTIK has developed Advanced Connectivity Technology (ACT), a cutting-edge solution...

Indium Corporation Announces Executive Leadership Appointments

Evans appointed executive chair of board of directors, Berntson named CEO Indium Corporation®, a leading materials refiner, smelter, manufacturer, and...

SEMI Publishes Recommendations for Semiconductor Policies in the 2024-2029 European Commission Legislative Term

SEMI, the industry association serving the global electronics design and manufacturing supply chain, today published recommendations for the European Union...

Brewer Science Presenting Innovations in Hybrid and Laser Debonding at EPTC in Singapore

3D Packaging and Thin Wafer Processing Research Co-Presented by Brewer Science Brewer Science, Inc., an industry leader in advanced packaging...

Siemens’ Solido SPICE Certified for Multiple Leading-edge Samsung Foundry Processes

Siemens Digital Industries Software announced today that its continued collaboration with longtime customer Samsung Foundry has established a host of...

Indium Corporation Honored by Electronics Era with Excellence in Electronics Assembly Materials Award

Indium Corporation is proud to announce its recent achievement of the Excellence in Electronics Assembly Materials Award from Electronics Era,...