Artificial Intelligence (AI) combines both hardware and software. TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found in datacenters require high-density packages to support logic plus high bandwidth memory (HBM). Many silicon interposer designs are in mass production and Intel’s EMIB is also used. Package-on-package (PoP) is use... »
SAN JOSE, Calif. (August 2, 2018) – Xperi Corporation (Nasdaq: XPER) (“Xperi”) is pleased to announce a partnership with leading global semiconductor foundry, UMC. This strategic partnership will enable the companies to support the growing demand for Invensas’ direct and hybrid bonding (ZiBond® and DBI®) 3D semiconductor technologies. Together, Xperi and UMC will further optimize ... »
PLAINVIEW, New York, July 9, 2018 – Veeco Instruments Inc. (Nasdaq: VECO) today announced that one of the world’s leading memory chip manufacturers has ordered multiple AP300™ lithography systems to support the fast-growing demand for DRAM with copper (Cu) pillars. The company selected the Veeco tools for their versatility in addressing advanced packaging applications, proven reliability in ... »
MILPITAS, Calif., July 10, 2018—Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products, addressing two key challenges in tool and process monitoring during silicon wafer and chip manufacturing at the leading-edge logic and memory nodes. The VoyagerTM 1015 system offers a new capability to inspect patterned wafers, including inspection in the lithography cell imm... »
SAN FRANCISCO – SEMICON West (11 July 2018) – Edwards Vacuum, a leading manufacturer of vacuum and abatement solutions, announces a milestone of 10,000 Edwards inward fired combustion abatement systems installed worldwide. Edwards calculates that its abatement systems have prevented emissions equivalent to over 14 million tons of carbon dioxide in 2017. “The safety and efficiency of our ... »
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView® NT3 aligner, which is available on the company’s industry benchmark GEMINI® FB XT integrated fusion bonding system for high-volume manufacturing (HVM) applications. Developed specifically for fusion and hybrid wafer bonding, the... »
Structured light and time of flight (ToF) are the dominant types of 3D sensing used for augmented reality, motion detection, gesture control, automotive/industrial 3D mapping, and proximity applications. These 3D sensing technologies are now appearing in smartphones. Apple’s iPhone X and its Face ID technology was not the first smartphone with a 3D sensing system, but it was the first to have si... »
While Apple remains the main customer for TSMC’s Integrated Fan-Out WLP (InFO-WLP), an increasing number of companies are adopting a large area version of FO on Substrate. HiSilicon has been in production with ASE’s FOCoS for several years and MediaTek just announced a logic device for networking applications using TSMC’s InFO on Substrate (InFO_oS). TSMC’s FO-WLP platform has been extende... »
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that customers have once again voted the company one of the 10 BEST Focused Suppliers of Chip Making Equipment and one of the BEST Suppliers of Fab Equipment in the 2018 VLSIresearch Customer Satisfaction Survey, increasing its score in both award s... »
Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts from all over the world are deeply involved in the development of innovative solutions to answer to the market demand dominated by megatrends. “Megatrend will probably be the keyword for the next 10-years within the advanced packaging industry, and more gen... »
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