Southwest Strategies Group Acquires Kiterocket
Jul 02, 2025 · By Kiterocket · Press Releases
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Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at IPC Workshop
Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive...
EV Group Tops Customer Rankings in TechInsights 2025 Global Semiconductor Industry Customer Satisfaction Survey
EVG achieves five star rating across all participating award categories, including first-place finishes in “Global Semiconductor Supplier” segments, lithography equipment,...
SEMI Acquires Linx Consulting’s Market Reports and Conferences to Boost Industry Insights
Deal Amplifies SEMI’s Market Intelligence Capabilities in Semiconductor Materials and Specialty Chemicals SEMI, the global industry association representing the electronics manufacturing...
NHanced Semiconductors VP Charles Woychik to Deliver Keynote at SMTA’s Symposium on Counterfeit Parts & Materials in College Park, Maryland
Woychik’s address will highlight the critical role of advanced packaging technologies in the evolution of the U.S. OSAT industry to...
University of Michigan Research Study Demonstrates Novel Synthesis of High-Quality 2D Molybdenum Disulfide Using Veeco’s Fiji ALD System
Findings show the use of di-tert-butyl disulfide (TBDS) provides comparable film characteristics to traditional hydrogen sulfide-based growth, while enabling a much...
Phoenix to Host SEMICON West 2025 for the First Time, Showcasing Arizona’s Critical Role as a Semiconductor Manufacturing Hub
Event registration now open, with expanded programming and support from key Arizona partners SEMI, the industry association serving the global...
StratEdge Marks 40 Years of Innovation at IMS 2025 Booth 336
Celebrating a legacy of high-reliability packaging—from powering Mars rovers to advancing today’s telecom, defense, and 5G systems StratEdge Corporation, leader...
Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30%...
SurplusGLOBAL to Launch Beta of Semiconductor Equipment and Parts Platform ‘SemiMarket’
Grand Opening Planned for December SurplusGLOBAL, a leading provider specializing in legacy semiconductor equipment and parts, has fired the starting...
SEMI 3D & Systems Summit to Highlight Heterogeneous Integration as Key to Europe’s Semiconductor Resilience
The SEMI 3D & Systems Summit, taking place June 25-27, 2025 in Dresden, will showcase the forefront of technological advancement in...
SEMI Reports: AI Demand, Fab Growth Drive 21% Increase in Q1 Semiconductor Equipment Billings
Growth driven by AI demand and fab expansion SEMI, the industry association serving the global semiconductor and electronics design and...
Brewer Science Presents Materials Innovation for Additive Electronics at TechBlick 2025
Building Circuits from the Ground Up: Domestic Advanced Packaging Relies on Additive Manufacturing Brewer Science, Inc., a global leader in...
IMAPS CHIPcon Planned for July 7-10, 2025 in San Jose, California
The leading event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology addressing the challenges and opportunities for enabling broader adoption...
Indium Corporation Joins Virginia Tech Center for Power Electronics Systems (CPES) Industry Consortium
Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, has...
SEMI Selects Kiterocket as Agency of Record
Kiterocket to support the global association’s communications strategy, amplify industry leadership, and advance cross-sector initiatives from advocacy to workforce development...
ASE Announces FOCoS-Bridge with TSV; Latest Package Technology Reduces Power Loss by 3x for Next-Generation AI and HPC Applications
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., announced Fan-Out Chip-on-Substrate-Bridge (FOCoS-Bridge) with Through Silicon...
Indium Corporation to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
Indium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G...
Kuehne+Nagel Launches Air Freight Carrier Engagement Sustainability Programme
To lead the way to a more sustainable future, Kuehne+Nagel announces the launch of its carrier engagement sustainability programme. As...
Indium Corporation to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability...
