Hesse GmbH wins OWL Innovation Award 2025/26 in the “Market Visions” Category
Jun 12, 2026 · By Hesse Mechatronics, Inc · Press Releases
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Siemens Accelerates Integrated Circuit Design and Verification with Agentic AI in Questa One
Siemens announces the Questa One Agentic Toolkit, which brings domain-scoped agentic AI workflows to its Questa™ One smart verification software...
Big changes taking shape at IBM Bromont
What does it take to stand up 30,000 sq.ft. of chips‑last fan‑out wafer‑level packaging capacity at scale? This photo shows...
New AI Hardware and Advanced Packaging Innovations from Adeia at IMAPS DPC 2026
Adeia Inc. (Nasdaq: ADEA), the technology company known for developing foundational innovations that enable next-generation solutions for the semiconductor and...
Siemens wins Best of Show Award for “Packaging: Design” at 2026 Chiplet Summit
Siemens’ Innovator3D IC software recognized for advancing 2.5D and 3D chiplet integration Siemens has won in the “Packaging: Design” category...
Indium Corporation to Feature High-Performance Management Solutions at TestConX 2026
As one of the leading providers of high-performance thermal management solutions, Indium Corporation® will feature its lineup of metal thermal...
Rapidus to produce 600mm × 600mm large-format RDL panels
At Semicon Japan, Rapidus underscored its bold decision to take on the challenge of producing 600mm × 600mm large-format RDL...
MacDermid Alpha to Highlight Advanced Interconnect Solutions for Complex Semiconductor Architectures at IMAPS DPC 2026
Enabling defect-free copper via fill, ultra-fine line and space, and scalable pathways for AI and HPC packaging (Waterbury, CT USA)...
KYZEN to Showcase MICRONOX Power Electronics Cleaning Chemistries at IMAPS Device Packaging Conference 2026
NASHVILLE — February 2026 — KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International...
Applied Materials Announces Samsung Electronics Will Join the New, Multibillion-Dollar EPIC Center in Silicon Valley
EPIC will provide joint R&D programs to focus on co-development of materials engineering innovations that accelerate advanced node scaling, future...
NHanced Semiconductors Leads the Semiconductor Industry in Heterogeneous Hybrid Bonding Production
The company’s recently delivered Besi Datacon 8800 CHAMEOultra plus system is the world’s first operational advanced bonder of its kind to...
Toshiba to Accelerate Semiconductor Design Innovation with Siemens’ EDA Software
Japanese company to leverage a range of Siemens’ EDA technologies to speed design, enhance power integrity and boost overall reliability...
Indium Corporation Launches New Solder Paste for High Print Consistency and Easy Cleanability
Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, announced the global availability of SiPaste® C312HF, a halogen-free, cleanable...
SurplusGLOBAL to Showcase Legacy Semiconductor Equipment & Parts Marketplace “SemiMarket” at SEMICON JAPAN 2025
SemiMarket Offers Exclusive On-Site Seller Onboarding Program SurplusGLOBAL announced its participation in SEMICON JAPAN 2025, taking place from December 17...
Indium Corporation’s Hongwen Zhang to Present on Advancements in Bi-free In-containing Lower-Temperature Solder at ICEE 2025
Indium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse® Technology...
Koh Young Recognized with Productronica Innovation Award for its AI-powered Process Optimization Solution
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, has been recognized with a Productronica Innovation Award...
Industry Leaders Koh Young, Fuji America, and Creative Electron Unite to Launch The SMT Future Experience
Three of electronics manufacturing’s most innovative companies announced the formation of THE SMT FUTURE EXPERIENCE, an independent collaborative venue designed...
Accelerating Quantum Computing Innovation: Veeco Expands Global Footprint with MBE Wins
Veeco Instruments Inc., a global leader in advanced semiconductor and compound semiconductor process equipment, announced wins with Sparrow Quantum (Denmark)...
Indium Corporation Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
Indium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC... imec and Brewer Science to Co-Present Breakthroughs in Thin Interposer Assembly and Flash-Lamp Debonding at EPTC 2025
Brewer Science, Inc., a global leader in advanced packaging materials and processes, will co‑present two technical papers with imec at...