The 2021 Yearbook is Going Digital! Editorial and Marketing Opportunities Now Open
Oct 21, 2020 · By Trine Pierik · Blogs, From Different Dimensions, Press Releases
Latest Posts - Page 3
NAMICS Receives Intel’s Preferred Quality Supplier Award
NAMICS Corporation has been recognized by Intel as a recipient of a 2019 Preferred Quality Supplier (PQS) Award. The PQS...
2020 IEEE International Reliability Physics Symposium Changed to Virtual Conference; New Date April 28
Due to Concerns Over Coronavirus (COVID-19) Outbreak, the 2020 IEEE International Reliability Physics Symposium Will Be Presented Online as a...
ZEISS Semiconductor Mask Solutions Receives Intel’s Preferred Quality Supplier Award
Jena, Germany, March 5, 2020 — ZEISS Semiconductor Mask Solutions has been recognized by Intel as a recipient of a...
Brewer Science Receives Intel’s Preferred Quality Supplier Award
Rolla, Missouri – March 5, 2020 – Brewer Science has been recognized by Intel as a recipient of a 2019...
Lam Research Breaks New Ground in Etch Technology and Productivity for Chipmaking Processes
FREMONT, Calif., March 03, 2020 (GLOBE NEWSWIRE) — Lam Research Corp. (Nasdaq: LRCX) today announced the launch of a completely...
EV Group Establishes Heterogeneous Integration Competence Center
New HI Competence Center to help customers accelerate new product development fueled by heterogeneous integration and advanced packaging EV Group...
StratEdge Features its High-frequency, High-power Semiconductor Packages and Assembly Services at Three Trade Shows in March
StratEdge Corporation, a leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and...
ASYMTEK Products Awarded Best New Product and Service Excellence at IPC APEX 2020
Awards Earned by ASYMTEK Products for Best New Product and Service Excellence at IPC APEX 2020 Carlsbad, CA, USA –...
Integrating Community for STEM Education
As we are in the midst of planning our 3D InCites 2020 Awards Ceremony and event to be held next...
Emerging Market for Low-Density Panel FO Analyzed
Large area fan-out (FO) remains a hot topic in the industry. There is some confusion over the term “panel” because...
ZEISS Accelerates Semiconductor Package Failure Analysis by Orders of Magnitude with Crossbeam Laser FIB-SEM
Pleasanton, Calif., and Oberkochen, Germany, February 4, 2020 — ZEISS today introduced the ZEISS Crossbeam Laser — a new family...
Xperi Enters into New Patent and Technology License Agreement with SK hynix
SAN JOSE, CA (FEBRUARY 6, 2020) – Xperi Corporation (NASDAQ: XPER) (“Xperi”) today announced that it entered into a new...
SEMI Postpones SEMICON China, Suspends SEMICON Korea in Response to Coronavirus Outbreak
SEMI Notification to SEMICON China Exhibitors and Registered Attendees – Feb. 3, 2020 Dear Exhibitors and Guests, As you are aware,...
Micross Raleigh Facility Receives DMEA Microelectronics Trusted Source Certification
Orlando, FL, January 15, 2020 – Micross is pleased to announce that its Advanced Interconnect Technology operation (Micross AIT) located...
Smoltek demonstrates CNF-growth on a 200mm silicon wafer
Last week our awesome and hardworking R&D-team managed to demonstrate CNF-growth on a 200mm silicon wafer in the Chalmers MC2...
Brewer Science Introduces its First Permanent Bonding Material at the European 3D & Systems Summit
Rolla, Missouri – January 27th, 2020 – Brewer Science, Inc., is proud to introduce our first permanent bonding material during...
Smoltek patent No. 56 now granted
Smoltek is awarded a new patent. This Korean patent is the second of a patent family in the direction of...
Smoltek presents new improved electrical data for CNF-MIM
Smoltek has presented new and improved electrical data for CNF-MIM at EDAPS in Taiwan. The focal point has been on...
Advanced Packaging is Everyone’s Business!
“Changes in the semiconductor supply chain and shifting business models, as well as uncertainty related to US-china trade, creates a...