Press Releases

INFIERI Summer School Program Features NHanced Semiconductors President Robert Patti Presenting Advanced Semiconductor Architectures for Future Memory Systems, AI, & HPC

The 8th Edition of the Intelligent Signal Processing for Frontier Research & Industry (INFIERI) Summer School was held September 1...

Indium Corporation President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India

Indium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at...

PDF Solutions’ CEO John Kibarian Keynotes 2025 Advanced Process Control and Smart Manufacturing Conference September 23

PDF Solutions Serves as Keynote Sponsor; John Kibarian Keynotes CEO Summit with “Revolutionizing Semiconductor Collaboration: The Emergence of AI-Driven Industry...

Deca and Silicon Storage Technology (SST) Announce Strategic Collaboration to Enable NVM Chiplet Solutions

The collaboration provides customers with a modular, memory-centric foundation for advanced multi-die architectures As traditional monolithic chip designs grow in complexity...

Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar

Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to...

SEMI Showcases New Conductor™ Intelligence Platform for Enhanced Global Supply Chain Collaboration

Co-developed with SEMI Supply Chain Management Initiative companies and partners to improve visibility and accelerate decision making across industries SEMI,...

Indium Corporation to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal...

AMD’s Lisa Su to Receive Inaugural SEMI Silicon Medal at SEMICON West 2025

Award to Honor Outstanding Semiconductor Industry Leaders and Innovators  SEMI, the industry association serving the global semiconductor and electronics design...

EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration

New EVG®40 D2W overlay metrology system provides 100 percent overlay measurement on every die at up to 15X higher throughput...

ACM Research Delivered Its First High-Throughput Ultra Lith KrF Track System to a Leading Chinese Logic Wafer Fab Customer

New Ultra Lith KrF Track System Delivers High-Throughput Performance with Proprietary Platform Design, Driving Advanced Process Control for Mature-node Lithography Applications ACM Research,...

Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will...

Brewer Science Joined the Next-Generation Semiconductor Packaging Consortium “JOINT3”

JOINT3 is a co-creation evaluation platform established by Resonac Corporation with the aim of accelerating the development of materials, equipment,...

MacDermid Alpha Showcases Breakthrough Materials for Advanced Packaging and Power Semiconductors at SEMICON Taiwan

MacDermid Alpha presents advanced packaging and power semiconductor materials at SEMICON Taiwan, highlighting reliability, sustainability, and expert insights at the...

MRSI Mycronic to Showcase High-Speed Assembly Solutions at CIOE 2025

MRSI Mycronic, part of the Mycronic Group, will present advanced assembly solutions at the 26th China International Optoelectronic Exposition (CIOE)...

Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON West

Koh Young Technology, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements...

EV Group Promotes Cindy Lee to General Manager of EVG Taiwan Subsidiary

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...

Koh Young Highlights the Market Driven Nova Series and Smart Factory Solutions at Productronica India 2025

Koh Young, the global leader in True 3D measurement‑based inspection and smart factory platforms, is poised to highlight its cutting‑edge technologies...

Koh Young Hosts First Technical Review Meeting at New Taiwan Office to Showcase Advanced Metrology and Inspection Solutions

Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is inviting semiconductor and SMT professionals...

Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility

Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the...

Koh Young Expands Global Footprint with Grand Opening of Taiwan Office to Serve Semiconductor and Advanced Packaging Market

Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the grand opening of...