𝐀𝐝𝐯𝐚𝐧𝐜𝐞𝐝 𝐩𝐫𝐨𝐜𝐞𝐬𝐬 𝐧𝐨𝐝𝐞𝐬 𝐚𝐫𝐞 𝐩𝐮𝐬𝐡𝐢𝐧𝐠 𝐩𝐡𝐨𝐭𝐨𝐫𝐞𝐬𝐢𝐬𝐭 𝐬𝐭𝐫𝐢𝐩 𝐩𝐫𝐨𝐜𝐞𝐬𝐬𝐞𝐬 𝐭𝐨 𝐭𝐡𝐞 𝐥𝐢𝐦𝐢𝐭.
More masking steps, tighter tolerances, and fragile materials are increasing sensitivity to wafer damage and contamination, driving the need for a better solution.
𝐖𝐡𝐚𝐭 𝐢𝐟 𝐲𝐨𝐮 𝐜𝐨𝐮𝐥𝐝 𝐢𝐧𝐜𝐫𝐞𝐚𝐬𝐞 𝐬𝐭𝐫𝐢𝐩 𝐫𝐚𝐭𝐞𝐬 𝐰𝐢𝐭𝐡𝐨𝐮𝐭 𝐢𝐧𝐝𝐮𝐜𝐢𝐧𝐠 𝐩𝐥𝐚𝐬𝐦𝐚 𝐝𝐚𝐦𝐚𝐠𝐞?
