Community Member Monthly Highlights — November
Dec 01, 2022 · By Trine Pierik · From Different Dimensions
3D In Context View all
The Semiconductor Market Roller Coaster Ride is Back
Pat Gelsinger attended the WSJ Tech event in late October and as always had some interesting things to say about the state of the semiconductor industry. In the interview with the WSJ, Gelsinger laid out his view of the current industry environment and the long-term benefits of the CHIPS Act....
Setting Goals For Net Zero
2022 is a turning point year for the semiconductor industry in more ways than one. While it is one of the biggest years ever from a capital expenditures/semiconductor equipment perspective, it is also the year when sustainability became a major focus of nearly every company in the industry. At SEMICON...
The CHIPS Act: Get on Board Because the Train is Leaving the Station
On Sept 21, SEMI hosted a webinar with BDO and mySilicon Compass titled “The CHIPs Act Passed, Now What?” The participants were Joe Stockunas, President of SEMI America; Tom Stringer, National leader of Site Selection and Business Incentives at BDO; John Stringer, VP of Global Public Policy and Advocacy at...
Employee Engagement is Key to ESG Success
TSMC has a significant challenge on its hands when the topic of Environmental Social Governance (ESG) comes up. They are growing at a rapid rate, as the chip industry continues to grow. They are currently the technology leader from a minimum pitch, and use of advanced technology such as EUV,...
Francoise in 3D View all
Making Connections at SEMICON Europa 2022
What a week! From keynotes, panel discussions, and podcast interviews, to booth parties and after-hours networking – the week at SEMICON Europa was all about making connections. For us, that meant hosting our first-ever 3D InCites member social event on Monday, November 14 at the iconic Augustiner Keller. Guests from...
Book Review: Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
I have a confession to make. Last March – we’re talking March of 2023 at IMAPS DPC – Beth Keser, IMAPS president, presented me with a signed copy of the book she co-edited with Steffen Khröhnert – Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces:...
The Power of Community at the IMAPS International Symposium
One of the things I love most about being part of the International Microelectronics and Packaging Society (IMAPS) is the spirit of community this organization has cultivated over the years. It’s one of the reasons there is so much synergy between IMAPS and 3D InCites, and why we have become...
Are You Listening? 3D InCites Summer Podcast Wrap Up
Are you listening to the 3D InCites podcast yet? We had a busy summer! Our listenership grew, and we achieved a significant milestone of over 5500 downloads since we first began our podcast journey just over a year ago. Not only that but we were excited to see we’re reaching...
From Different Dimensions View all
The Right to Repair
I host online discussions about sustainable manufacturing. During one of these events in October that included participants from the 3D InCites community, I asked what topics people wanted to read about in the blog. Someone brought up recycling and repair of smartphones. With increased emphasis on the right to repair,...
SEMICON Europa 2022 Member Preview
SEMICON Europa kicks off next week as microelectronics experts and visionaries gather for insights into advanced technologies that are driving industry growth and critical issues such as sustainability, mobility, healthcare, workforce development and supply chain management. We are excited to connect with our community members and industry friends and look...
Finding an Engineer’s Sense of Achievement at KLA
While growing up in China, I was always fascinated by machines and tools and how they benefit our daily lives. My dad worked in the automotive industry, and when our family visited factories, I always enjoyed watching the automated assembly of cars. Starting then, I knew that I wanted to...
Community Member Monthly Highlights – October
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth sharing from the month previous. If we missed you this month, be sure to add us to your distribution list, we don’t want to leave anyone out. Our community members...
Packaging IFTLE View all
IFTLE 540: IMAPS Symp 2022: Nano-porous Copper; Adaptive Formed Glass
IMAPS 2022 Continued… This year’s IMAPS Symposium in Boston drew 925 attendees and featured: 20 technical and poster sessions 11 professional development courses Keynotes from MIT, Bosch, NXP, Reliance and ADI Panel session on mm wave packaging As always it was a great atmosphere to see old friends and make...
IFTLE 539: IMAPS On-Shore Packaging & Assembly Workshop; TSMC 3DFabric Alliance
As we mentioned in IFTLE 537, IMAPS held the Onshoring: Packaging and Assembly Workshop prior to the traditional IMAPS fall symposium. Let’s take a look at what we learned from some of those key presentations. And then we’ll look at an important announcement by TSMC about its 3DFabric Alliance. Intel...
IFTLE 538: Kyocera Details HDBU and HDI Processing and Looks at US On-shoring
As we noted in IFTLE 537, prior to the 2022 IMAPS conference in Boston earlier this month, IMAPS hosted a one-day workshop on “On-Shore Packaging and Assembly Capabilities” to engage the community and identify solutions to address US government and defense requirements that are critical to the onshoring of the microelectronic assembly...
IFTLE 537: 2022 IMAPS Society Awards Go to Advanced Packaging Superstars
IMAPS held its 55th International Symposium on Microelectronics in Boston, October 4-6 2022. The conference drew some 900+ attendees hungry for some post-pandemic social contact. It was somewhat of a homecoming for me since my career started in the Boston suburbs where I worked for 12 years (1975 – 1986) at Dow...
SemiSisters View all
Is Diversity and Inclusion the Secret to Your Company’s Success?
Until recently, many companies considered diversity a “nice to have.” Companies supported diversity and inclusion because they wanted to be good citizens because it was the right thing to do, and – for some, cynically – because it was good PR. But now research is proving the business case for...
Smartphone Addiction is Not a Gender-Specific Problem
An open letter to David Benjamin, EE Times Dear David, You really don’t get it. Why? Why, when more women are joining the microelectronics industry in technical and non-technical roles, would you resort to female stereotypes from the 1950s as a vehicle to discuss such an important topic as global...
2021 3D InCites DEI Fundraiser a Success; Thank You Sponsors
We took our annual mural project online this year! Illustrator Ronna Encarnacion created this original watercolor to reflect the importance of Diversity, Equity, and Inclusion in creating sustainability. Proceeds from the project will be used to seed the 3D InCites DEI Fund to support technology businesses owned by women and...
How is COVID 19 Impacting the Semiconductor Industry’s Diversity and Inclusion Efforts?
A headline on CNN Business caught my eye last night: Working mothers are quitting to take care of their kids, and the US job market may never be the same. I started reading and went down a rabbit hole of related articles that revealed a few things: Unlike the recession...
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Community Member Monthly Highlights – September
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IFTLE 535: The Resurgence of U.S. Semiconductor Fabs
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Infrastructure and R&D Leads Supreme in Semiconductor Projects Initiated in China
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IFTLE 534: A Look at DARPA’s Next Generation Microelectronics Manufacturing (NGMM) Program
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IFTLE 533: Fan-out, Chips-Last High-Density Packaging at Unimicron
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Back To Work: How Will the CHIPS and Science Act Impact the Semiconductor Industry?
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IFTLE 532: Fraunhofer IZM Examines Panel Level Processing Technology Limits
Continuing our look at presentations at the 2022 ECTC, who better to examine the question “Panel Level Packaging – Where...
The Road Towards Climate Neutrality from the Perspective of a German SME
This year in Germany, we experienced a record-setting summer, and not in a good way. Unprecedented heatwaves were recorded, and...
IFTLE 531: CHIPS and Science Act; TSMC Phoenix; Details on Apple M1
CHIPS and Science Act The CHIPS and Science Act will provide $54.2B in funding for the semiconductor and wireless industry,...
R&D and Smart Technology Leading the Way in China
Despite China reacting to the United States CHIPS and Science Act, the country continues to move forward with R&D and...
IFTLE 530: Do Chiplets Increase Security Risks? Sony and Samsung Battle for Leadership in CIS
For those of you that haven’t seen it yet, a recent July 7th post by Ed Sperling is must read...
3D InCites Members Attend Signing of the CHIPS and Science Act
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