Tackling the Memory Wall at the IMAPS Memory Summit
Jul 28, 2026 · By Isabel Volpe · 3D Event Coverage, 3D In-Depth, Blogs, From Different Dimensions, R&D and Collaboration
3D In Context View all
Memories, IEDM, and Looking Forward
How to start what is potentially my final blog for 3D InCites: Memories, So Long, Farewell, (that one might get me in trouble), or Back to the Future? I started this venture at SEMICON West in 2019, where I helped Françoise cover the show and wrote my first 3D InCites...
SEMICON West Navigates Semiconductor Industry Changes
As Benjimen Franklin said, shortly after the US Constitution was written, “In this world, nothing can be said to be certain, except death and taxes.” I’ll add one comment to that: Change. Change is constant. Over the past year, there has been a significant amount of change in the semiconductor...
Advanced Packaging: A Community Coming Together
In the past 16 years, 3D InCites has watched the 3D packaging industry grow. The philosophy of 3D InCites was to create an advanced packaging community. At SEMICON West in Phoenix, the community was out in force, from ribbon-cutting ceremonies for new facilities, to new packaging equipment companies showing for...
The 3DICAMA and Other Efforts to Develop the 3D IC Ecosystem
This Fall has been a busy time for semiconductor events. Starting with SEMICON Taiwan at the start of the month, IMAPS in Late September into early October, followed closely by SEMICON West last week. Fortunately, there is a month off to catch your breath before heading to Semicon Europa. There...
Francoise in 3D View all
3D InCites Grows Up: Passing the Torch
While raising my daughters, I ascribed to the philosophy: “A parent’s charge – give them roots and give them wings.” I believe this also applies to brainchildren. At some point, your work is done, and rather than clinging to them and holding them back, you let them go, so they...
Passing the Torch: Reflections from SEMICON Europa 2025
While announcing my retirement after 20 years in the industry at IMAPS Symposium brought my career in advanced packaging full circle, wrapping up my 3D InCites career at SEMICON Europa brought closure. It was at SEMICON Europa 2007, held in Stuttgart, where my fascination with 3D integration and packaging first...
Francoise Unfiltered: Thoughts from IMAPS Symposium and SEMICON West
Maybe it’s my impending retirement, but I’m feeling a little salty these days. This my fifth draft about the highlights, low-lights and Aha moments of both IMAPS Symposium and SEMICON West. And I can’t get it right. All that comes up is my annoyance with carefully crafted messaging because nobody...
Changes at 3D InCites: Here’s What You Need to Know
I recently realized that IMAPS Symposium 2025 marks my 20th anniversary in the microelectronics industry. It was the first industry event I attended, as the Associate Editor of Advanced Packaging Magazine. My first SEMICON West was in 2006, and my first SEMICON Europa was in 2007. That was when I was first...
From Different Dimensions View all
IMAPS Announces Purchase of the 3D InCites Platform
The International Microelectronics Assembly and Packaging Society (IMAPS) is pleased to announce a major milestone for the Society, with IMAPS taking over the “stewardship” of the trusted 3D InCites platform which was owned by Françoise von Trapp and her partner Martijn Pierik. Following Françoise’s retirement, IMAPS purchased the 3D InCites...
Beyond Transport Modes: Balancing Cost and Speed in Semiconductor Logistics
Before a chip becomes a CPU or GPU, it undergoes a complex journey through fabrication, assembly, testing, and packaging, often spanning continents. With major OSAT facilities still offshore, the packaging process adds cost, delays, and emissions, while every hand-off increases the risk. For businesses managing key semiconductor materials and components...
December Monthly News: That’s a Wrap on 2025
December 2025 was an action-packed month for the 3D InCites community and the semiconductor industry. Major leadership appointments, innovative technology launches, and global collaborations highlighted the month. Advances ranged from AI-powered process optimization and hybrid bonding production to new materials and solder solutions. Industry events showcased cutting-edge manufacturing experiences and...
Sustainability 101: Farewell From Julia
It’s bittersweet to be writing my last blog post for 3D InCites after 50+posts over four and a half years. My professional relationship with Francoise goes back much further to when we were both at Advanced Packaging Magazine 20 years ago. In Dec of 2015, Francoise approached me about writing...
Interconnectology 101 View all
My Message for the Advanced Packaging Industry
Since 2009, when Francoise started 3D InCites, she’s been sharing her insights on advanced packaging – an industry, she told me, that people used to dismiss. “Back then, advanced packaging was still seen as a cost-adder, versus adding value through enhanced performance.” she said. So much has changed since then....
The EU’s Semiconductor Strategy: CHIPS Act 2.0, Investments, and More
I recently attended SEMICON Europa in Germany to learn how the EU is approaching the next phase of its semiconductor development. From what I learned, the EU is moving its industry forward by planning for its CHIPS Act 2.0 legislation, attracting new investments, and funding competitive R&D pilot programs. In...
Co-Packaged Optics: Today’s Biggest Packaging Push
Co-packaged optics is one of the most talked about innovations in advanced packaging right now, and it’s for good reason. It promises higher bandwidth density, lower power consumption, and reduced latency over other packaging approaches – all of which are essential for enabling smarter AI solutions. To learn more about...
Will AI Ever Become Profitable?
Last year, I wrote a blog on the growth of AI, where I broke down the public hype around the technology and the barriers preventing it from scaling further. Earlier this year, Gartner projected that worldwide AI spending will reach $1.5 trillion by the end of 2025, up $490 billion...
Packaging IFTLE View all
IFTLE 652: The End……….
By now you know that Francoise von Trapp is retiring from 3D InCites. That has led me to also pull the curtain down on “Insights from the Leading Edge” or IFTLE as it has become known. As I told you all in IFTLE 500, IFTLE’s predecessor PFTLE (Perspectives from the...
IFTLE 651: Intel and Amkor Join Forces for EMIB
Amkor and Intel report that they are teaming up for Amkor high volume manufacturing (HVM) of EMIB due to “interest from the AI Industry.” Through this agreement, Amkor will implement EMIB assembly processes at its Korea, Portugal and upcoming Arizona manufacturing facilities, creating an alternative source for this advanced packaging...
IFTLE 650: Tax Credits for Materials Suppliers; Amkor Automotive
SEMI Investment Act Tax Credit to Include Materials Suppliers SEMI, the industry association, has announced support for the introduction of the Strengthening Essential Manufacturing and Industrial Investment Act (the SEMI Investment Act) which would extend the Advanced Manufacturing Investment Tax Credit established under the U.S. CHIPS and Science Act through...
IFTLE 649: Let the Hybrid Bonding Wars Begin! Also: Samsung Locks in Glass Interposer Source
Adeia vs AMD Hybrid bonding is a semiconductor packaging technique that enables direct Cu-Cu and oxide-to-oxide connections, eliminating the connection using microbumps. This approach improves interconnect density, electrical performance, and thermal efficiency, making it an important advanced packaging technology for next-generation semiconductor devices. Adeia Semiconductor Solutions, a wholly owned subsidiary...
Latest Posts
Reflections on My Year as the 3D InCites Editorial Intern
Over the past year, my role as the 3D InCites editorial intern has given me a front-row seat to one...
November Member News: Shaping the Future of Semiconductors
November was a dynamic month for the 3D InCites community and the broader semiconductor industry, with companies showcasing innovative technologies, celebrating...
IFTLE 648: Unimicron Glass Core Substrates and Hybrid Bonding
With all the hype surrounding the potential use of glass interposer substrates and hybrid bonding, I thought taking a deep...
IFTLE 647: Micross AIT on Track to Deliver 300mm Bumping Onshore
Continuing our look at program information deemed “OK for public release” at the recent IMAPS Onshoring conference, let’s examine what...
IFTLE 646: TSMC 3Dblox 2.0 Helps Advanced Packaging Designs
The 3Dblox Open Standard Continues to Evolve Introduced in 2022, the 3Dblox open standard has provided EDA vendors with a...
From Reactive to Proactive: Semiconductor Shipment Visibility in 2025 and Beyond
In 2024, electronics cargo theft, including semiconductors, servers, and high-end computing equipment, surged dramatically, exposing a critical vulnerability in supply...
Jessica Yang: My Summer Internship at Saras Micro Devices
By Jessica Yang, HR Intern, Saras Micro Devices Hi, I’m Jessica Yang, a rising junior at Washington University in St....
IFTLE 645: ASE Packaging in Koahsiung; Amkor Advanced Packaging in AZ; US-SMC?
ASE to build new packaging facility in Kaohsiung Taipei Times reports that ASE, the world’s biggest chip assembly and testing...
Henrik Ng: My Summer Internship at Saras Micro Devices
My name is Henrik Ng and I am an Electrical Engineering student entering my junior year at Georgia Tech. I...
October Member News: Shaping a Smarter, More Connected Semiconductor Future
October proved to be a dynamic month across the semiconductor and advanced packaging ecosystem, marked by innovation, expansion, and global...
IFTLE 644: IBM’s Scott Sikorski details their Onshore Advanced Packaging for AI, HPC and Defense Applications
The recent IMAPS Onshoring workshop included Scott Sikorski, IBM Global Business Development Leader, reviewing details of their onshore advanced packaging...
Sustainability 101: Startups with Innovative Materials
Finalists for SEMI’s Startups for Sustainable Semiconductors (S3) program pitched their solutions at SEMICON West. As in previous years, most...
IFTLE 643: GlobalFoundries New York Advanced Packaging and Photonics Center
At the recent IMAPS Onshoring Workshop, Greg Kleese, Director of Aero & Defense Business Development, GlobalFoundries, made the presentation “GlobalFoundries...
Geopolitical Changes, Sustainability Progress, and Collaboration Efforts at SEMICON West 2025
This year’s SEMICON West was its largest exhibition in over 18 years. With a 60% boost in registrations over 2024,...
IFTLE 642: TSMC Advanced Co-packaged Optics Integrated CoWoS and COUPE
At the Open Compute Project (OCP) / APAC Summit in Taiwan, S.Y Hou (Director of Advanced Packaging Integration, gave a...
How My Internship at Brewer Science Shows Me the Power of Teamwork and Innovation
By Wyatt Harris, Marketing Intern at Brewer Science This past summer, I was given the opportunity for a marketing internship...
IMAPS Executive Summit: Advanced Packaging Comes to Silicon Valley
To celebrate the re-boot of Silicon Valley’s IMAPS Chapter, Chair Rozalia Beica, Rapidus, conceptualized and launched – with the help...
September Member News: Innovation and Collaboration
The month of September saw continued momentum in the semiconductor industry, highlighted by exciting industry events, innovative technology launches, and...
IFTLE 641: Is the CHIPS Act Becoming the CHIPS Investment Act?
Plus: TSMC Packaging in AZ; Deca/Microchip/SST Non-volatile Memory Packaging Taiwans Minister of Economic Affairs reports that he received information about...