3D In Context View all

FLEX/MSTC 2020: Change has Never Been So Fast…

SEMI, together with FlexTech, the MEMS & Sensors Industry Group, the Nano-Bio Materials Consortium (NBMC) and NextFlex, held FLEX/MSTC 2020 at the DoubleTree in San Jose from February 24 to 27. Executives from above industry organizations and their member companies presented current capabilities of flexible hybrid electronics (FHE), MEMS and...

Is The HIR the Best Path to Increased Revenues?

The 3rd Annual Heterogeneous Integration Roadmap (HIR) Symposium confirms it: Heterogeneous Integration is the best way for the semiconductor industry to achieve $ 1 Trillion in revenues. SEMI hosted the event at its headquarters in Milpitas. Almost 200 IC design and manufacturing experts joined, to celebrate the release of the 2019...

Big Data, Speed and Security Dominate DesignCon 2020

About 5000 attendees, as well as more than 200 exhibitors, took over the entire Santa Clara Convention Center from January 28 to 30, to hear the latest about IC, package and board innovations and to celebrate the 25th Anniversary of DesignCon. About 200 presenters conveyed very useful information in 14...

Francoise in 3D View all

Coronavirus Gives Rubbing Elbows a New Meaning at IMAPS DPC 2020

 As the domino effect of electronics industry event cancellations continued in response to the global threat of a potential Coronavirus pandemic, one industry association, the International Microelectronics, and Packaging Society is committed to carrying on this year’s event agenda, at least in the United States. The IMAPS International Device Packaging...

Ensuring Device Reliability in Automotive Electronics

More than 90% of all traffic deaths are caused by human error.1 I’m sure you’ve all heard this statistic repeatedly over the past few years. After all, this 2016 finding by the US National Highway Traffic Safety Administration (NHTSA) is fueling the semiconductor industry’s mission to develop the automotive electronics...

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