VLSI 2020: 3D Continues to Dominate Advanced Semiconductor Technology
Jul 06, 2020 · By Dean Freeman · Blogs, From Different Dimensions
3D In Context View all
FCC-approved BLE and LoRa module includes Antenna in Package
In engineering school, I learned that different laws of physics apply when the widely used electricity with 50/60 Hertz gets into the Gigahertz or even Terahertz range. In the decades since, I have managed to keep a safe distance to this challenging world of radio frequencies (RF) needed for transmitting...
ECTC 2020 Online is Accessible at No Charge
When I switched my focus from single-die SoCs to multi-die ICs, I had to learn a lot about IC packaging technologies. I paid thousands of dollars to attend 3DIC conferences, tutorials, and to purchase 3DIC books. This month (June 3 to 30, 2020) you can get up-to-date info about the...
EDA and the Heterogeneous Integration Roadmap
In Austria, where I grew up, homes get passed on from generation to generation. Like many Austrians, I had a set of tools to repair plumbing, electrical, heating, and other equipment, to keep our old home comfortable. As a proud handyman, I took all my tools with me, when I...
Modeling, Simulation and Test for Multi-die IC Designs
On May 20 MEPTEC’s Executive Director, Ira Feldman, moderated another informative MEPTEC & iMAPS webinar. Two Knowledgeable speakers from Ansys and International Test Solutions (ITS) outlined their company’s technical capabilities and explained the value these tools and methodologies provide for multi-die IC design and test. Modeling and Simulation of Multi-die...
Francoise in 3D View all
3D System Integration – It Takes a Village
Actually, 3D System integration takes more than a village. It takes a global effort. As Virtual ECTC 2020 continues this month, I viewed the 3D Past, Present, and Future of 3D integration Plenary Session. The actual viewing time is just over 115 minutes. The impressive speaker line-up included 3D pioneers,...
Social Distancing Spotlight: ERS Celebrates 50 Years of Thermal Solutions
50 years of providing specialized thermal solutions to the semiconductor industry is a significant accomplishment. It means your company is nearly as old as the industry itself and has successfully evolved right alongside it. So ERS electronic GmbH, located in Germering, Germany, was ready to celebrate in a big, big...
ECTC 2020 Keynote: Moore’s Law 2.0 Brought to You by HIT
If TSMC’s Doug Yu wrote a rap song, the title would be “HIT IT!” He’s been on a roll lately, evangelizing heterogeneous integration technology (HIT) as the new path going forward for the semiconductor industry. In fact, the ECTC 2020 keynote is Yu’s third keynote presentation at key h this...
Your Guide to Getting the Most out of Virtual ECTC 2020
One silver lining to COVID 19 for the microelectronics and advanced packaging communities is the ability to attend virtual ECTC 2020 free of charge. The elimination of travel expenses and making the pre-recorded sessions available until June 30th is helping to boost registration from about 1500 to well over 5,000...
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