3D In Context View all

If a Tree Falls in the Forest, Does it Produce Carbon Dioxide?

While working with a committee on evaluating multiple microelectronics companies for their efforts on sustainability an interesting question arose. Is a company being sustainable if it switches to renewables, but don’t reduce their energy footprint? In an industry where the semiconductor unit growth rate runs about 10% — TSMC builds...
Brussels, Belgium. 3rd Nov. 2018.Activists hold placards and chant slogans during a demonstration to demand immediate an action on climate change in front of European Parliament.

Sustainability: We Will Always Have Paris

On a trip home from Dresden, Germany, my plane was delayed by fog. A fellow analyst and I just missed our connection to San Francisco in Munich. Lufthansa was very accommodating and shipped us to Paris where we spent the night, and the next day caught our respective flights to...

Francoise in 3D View all

3D InCites Mural Project To Seed New DEI Fund

For the last several years, we held the 3D InCites Mural Project, in conjunction with the 3D InCites Awards, in support of STEM Education. This year, we have initiated a new fund in support of Diversity, Equity, and Inclusion (DEI).  Because DEI is critical to the UN Sustainable Development Goals,...

From Different Dimensions View all

Fan-Out Panel-Level Packaging Takes Off

Fan out (FO) packaging is one of the key growth segments in advanced packaging, with high adoption rates and strong technology advantages offering a strong pathway moving forward to support industry roadmaps. The nature of reconstituted substrates is now enabling fan-out panel-level packaging. Fan out packaging is no longer limited...

Doing Business in China: A European Company’s Perspective

China consumes more than 50% of all semiconductors annually. However, with a rapidly growing consumer market, domestic Chinese manufacturers can meet only around 30% of their own demand. A statistical report from China Electronic Production Equipment Industry Association (CEPEA) shows that the domestic market self-sufficiency rate of integrated circuit equipment...

The Big Squeeze – Why OSATs Need to Work Smarter

Analysts are projecting strong growth in advanced packaging, with a compound annual growth rate (CAGR) through 2026 approaching 7% across the segment; much higher for certain high-end technologies, including 3D stacking, embedded die, and fan-out. Outsourced assembly and test (OSAT) firms, which package finished die manufactured by independent device manufacturers...

Packaging IFTLE View all

IFTLE 481: A BRIDG to Somewhere

It was exactly two years ago that IFTLE first discussed the entity known as BRIDG and how it planned to be a “boutique microelectronics fabrication facility” that would be able to prototype 2.5/3D devices for the U. S. government and the microelectronics community. Later in the year, BRIDG announced that...

IFTLE 479: ABF Substrate Shortages; Consolidation Continues

This past fall, our packaging industry saw significant shortages of packaging substrates made from Ajinomoto Build-up Film (ABF). Let’s take a closer look. Ajinomoto is not your typical electronics materials company. Its main product lines are food seasonings, amino acids, and pharma products. The company entered the electronic materials industry...

SemiSisters View all

2021 3D InCites DEI Fundraiser a Success; Thank You Sponsors

We took our annual mural project online this year! Illustrator Ronna Encarnacion created this original watercolor to reflect the importance of Diversity, Equity, and Inclusion in creating sustainability. Proceeds from the project will be used to seed the 3D InCites DEI Fund to support technology businesses owned by women and...

Diversity, Parity, Prosperity: Perspective of an Industry Veteran

“Don’t surround yourself with yourself …” Yes, from I’ve Seen All Good People. “At Japan’s Most Elite University, Just 1 in 5 Students Is a Woman.” The New York Times, 08 December 2019 “The semiconductor industry isn’t known as a standout example of diversity and inclusion. But that’s changing.” Jane...