3D In Context View all

Intel Foundry

Will the Intel Foundry Model Succeed?

The foundry world has been big news in the past few weeks. TSMC started up the Kumamoto Fab,  Japan’s leading-edge semiconductor technology center, partnering with Tenstorrent on RISC-V and chiplets to be manufactured at Rapidus. The biggest non-surprise news flash was the roll-out of Intel’s Foundry Direct Connect, which they...

Francoise in 3D View all

IMAPS DPC 3D InCites Awards

IMAPS DPC 2024 Makes Advanced Packaging Fun Again!

At last week’s International Microelectronics and Packaging Society’s Device Packaging Conference, (IMAPS DPC 2024) we didn’t need TrendForce to tell us that advanced packaging is the hottest technology in the semiconductor industry. We just needed to look at the record attendance of more than 700 advanced packaging enthusiasts who turned...

Announcing the Winners of the 2024 3D InCites Awards

It was an interesting year for the 2024 3D InCites Awards as we changed our processes, criteria, and categories to improve the program. We intended to provide more opportunities for participation across the heterogeneous integration supply chain, and we are happy with the outcome. A special thank you to the...
A conversation with SEMI's Ajit Manocha

Leading The Charge to One Trillion Dollars

A Conversation About Leadership with SEMI CEO Ajit Manocha For the past few years, we’ve heard semiconductor market analysts prognosticate that based on estimated demand, semiconductors have the potential to become a $1Trillion industry in the next 7-10 years. This number is based on analysts’ projections of driving markets including...

From Different Dimensions View all

march member highlights

March Member Highlights: Anniversaries, Events, Collaborations, New Products, and More

March buzzed with innovation and collaboration in the semiconductor industry, as key players across the globe joined forces to advance technology, foster education, and address sustainability challenges. From groundbreaking product launches to strategic partnerships and workforce development initiatives, here are the highlights of 3D InCites members’  industry news, events, and...
ESD Bags

Sustainablity 101: Build a Better ESD Bag

When I worked for Advanced Packaging magazine in the early 2000s, we sometimes got pitches from companies that made cardboard boxes or foam cushioning materials. Their spokespeople obviously had not read the magazine or looked beyond the word “packaging” in the title. We ignored those pitches. However, many levels of...
February member highlights

February Member Highlights – Acquisitions, Awards, Events, New Offerings and More

The 3D InCites community members continue to create a buzz with announcements from new acquisitions to industry awards, new product introductions, events, job openings, and more. Here’s a collection of February member highlights. Acquisitions, Partnerships and Collaborations ASE announced a strategic partnership with Infineon Technologies, to acquire two back-end manufacturing...

Packaging IFTLE View all

IFTLE 588: CHIPS NAPMP Materials & Substrates Program

The Creating Helpful Innovations in the Production of Semiconductors (CHIPS) workforce initiatives are shown in Figure 1: The CHIPS vision for success for the National Advanced Packaging Manufacturing Program (NAPMP) is to establish U.S. leadership in advanced packaging and provide the technology needed for packaging manufacturing in the U.S. Ex-IBM...
An Intel engineer holds a test glass core substrate panel at Intel's Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company's Assembly and Test Technology Development factories. (Credit: Intel Corporation)

IFTLE 587: Intel Glass Core Substrate Update

In late Feb INEMI hosted a Packaging Tech Topic Webinar: Glass Substrates for Advanced Packaging which was presented by Dr. Dilan Seneviratne and Dr. Gang Duan of Intel Corporation. Dilan Seneviratne is a Principal Engineer and Director of Dielectrics and Surface Prep Area within Intel’s Substrate Packaging Technology Development organization....

IFTLE 586: US CHIPS Act Monies Begin to Flow

US Chip Fabrication, Packaging & Assembly Industry In August 2023, one year after the U.S. CHIPs Act was signed into law, the White House announced that over 460 companies had already submitted statements of interest to receive funding. GlobalFoundries The U.S. Dept of Commerce has announced $1.5B in direct funding...

SemiSisters View all

diverse workforce

Hiring and Retaining a Diverse Workforce

The CHIPS and Science Act aims to bring semiconductor research & development and manufacturing back to U.S. soil. Not only will this make the U.S. less reliant on the international supply chain, but it is estimated that this investment in onshore semiconductor and research facilities will create over half a...