ISS 2020: How to Win in Our Data-driven World
Jan 23, 2020 · By Herb Reiter · 3D Event Coverage, 3D In Context, 3D In-Depth, Blogs
3D In Context View all
IEDM 2019: Making Electronic Systems Smarter, Safer, and More Reliable
The San Francisco Hilton on O’Farrell Street welcomed IEDM 2019 and it’s 1800 attendees in early December. While the conference name implies its focus to be the International Electronic DEVICES Meeting, I was glad to see that IEDM looked again way beyond devices into application-specific topics and system-level challenges of...
MEPTEC’s Annual IC Packaging Industry Update
Ira Feldman welcomed about 100 attendees to MEPTEC’s December luncheon at SEMI Headquarters to hear Jan Vardaman, Founder and President of TechSearch International deliver her annual “State of the IC Packaging Industry” address titled, “Market Drivers for Advanced Packaging: 2020 and Beyond.” In her opening statement, Vardaman emphasized that our...
GSA Awards Dinner celebrates 25 years of Recognizing the Best of the Semiconductor Industry
A few thousand semiconductor experts, including many high-level executives, got together on December 5, 2019, celebrate the Global Semiconductor Alliance’s (GSA) 25th Anniversary at the annual GSA Awards Dinner, which took place at the Santa Clara Convention Center. The purpose of the evening was to acknowledge and celebrate the semiconductor...
Talking about Neural Networks and SoC Design Challenges
Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November 13, 2019, two well-known industry experts, Anand Joshi and Tom Dillinger, addressed today’s hot topics —neural networks and System-on-Chip (SoC) design challenges — with short, but very informative presentations. Can...
Francoise in 3D View all
SEMICON Europa and Productronica 2019 Exhibitor Showcase
The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused our visits on the SEMICON Europa exhibitor floor, but as the lines fade between front-end processes, advanced packaging, and board assembly, getting the whole story called for visits to the...
Uniting the World Through Technology Innovation
What a week we just had at the Munich Messe in Germany! If you’ve never had the chance to attend SEMICON Europa and Productronica simultaneously, I highly recommend you put it on your must-do list. Not only will you reach your daily step goal, but you’ll also learn about the...
Products on Parade in the Exhibits at IWLPC 2019
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out the latest supplier offerings to support technology trends, and to spread the word about our new community membership opportunities on 3D InCites. But I’ll get to that part in a...
The IWLPC Fan-out PLP Smack Down
At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which was co-moderated by PLP technology expert, Tanja Braun, Fraunhofer IZM. Panelists were John Hunt, ASE; Joseph Dang, AT&S; Keith Best, Rudolph Technologies; Tim Olson, Deca Technologies. Fan-out PLP (FO PLP)...
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Successful Growth in 2020 Calls for a Sustainable Approach
On the whole, 2019 was a very interesting year for the global semiconductor industry. After a record-setting 2018, the market...
IFTLE 437: Packaging Trends for Artificial Intelligence
As it has in recent years, SEMICON Europa 2019 featured a dedicated Advanced Packaging Conference. In this and my next...
2020 Outlook: Optimism Ahead! The Opportunities are There
I am writing this viewpoint while 2019 will close in a couple of days. If I try to summarize what...
IEDM 2019: Innovative Devices for an Era of Connected Intelligence
The IEEE International Electronic Devices Meeting (IEDM) been one of my favorite conferences for many years. Early in my career,...
IFTLE 434: Process Optimization for a Reliable NXP FOWLP Microcontroller
There are several different fan-out wafer-level packaging (FOWLP) technologies that are currently in high-volume production. The traditional fan-out (FO) technology...
IFTLE 433: AMD Chiplets go Commercial Amidst a Need for Chiplet Standardization
In 2017, AMD used chiplets in their “Zen 2” architecture to develop the Epyc server processor “Naples” (Figure 1). AMD...IFTLE 432: Ferric and TSMC Partner on Voltage Regulators; High TC Die Attach for TIM?
The IMAPS International Symposium took place this year in Boston. Let’s take a look at a few of the more...
Microtech Ventures brings a New MEMS and Sensors Summit to Town
From November 5 to 7, 2019, I had the opportunity to attend the inaugural MEMS and sensors focused Microtech Innovation...
IFTLE 431: Samsung Qualifies EDA Tools for Multi-die Integration
Samsung reports that they have seen increasing interest in multi-die integration (what they call MDI) for markets such as artificial...