3D In Context View all

Doing Business in China: A European Company’s Perspective

China consumes more than 50% of all semiconductors annually. However, with a rapidly growing consumer market, domestic Chinese manufacturers can meet only around 30% of their own demand. A statistical report from China Electronic Production Equipment Industry Association (CEPEA) shows that the domestic market self-sufficiency rate of integrated circuit equipment...
Feature Photo of Pat Gilsinger Credit: Patrick T. Fallon/Bloomberg News 

News Analysis: What’s Really Going on Inside Intel?

Intel has been in the news for the first weeks of 2021. While this is not unusual due to CES and the associated announcements of new processors for the latest and greatest consumer products, this year has been a bit different. There have been multiple storylines throughout 2020 rolling over...

Francoise in 3D View all

Looking Back on 2020 and Moving Forward into 2021

COVID-19 hit the world in early 2020 with very little warning. The semiconductor industry was poised for recovery, and all market indicators pointed to solid growth. For many of us, reality hit with the announcement that SEMICON Korea was canceled the day before it was set to start. Soon after,...

Closing Out 2020 at the MEPTEC Holiday Hangout

After nine months of Zooming into all the virtual events, I can’t wait for things to go live again. In the meantime, I took the opportunity last week to pop into the MEPTEC Holiday Hangout. As my last blog post of 2020, I thought I’d share some tidbits of the...

From Different Dimensions View all

The Big Squeeze – Why OSATs Need to Work Smarter

Analysts are projecting strong growth in advanced packaging, with a compound annual growth rate (CAGR) through 2026 approaching 7% across the segment; much higher for certain high-end technologies, including 3D stacking, embedded die, and fan-out. Outsourced assembly and test (OSAT) firms, which package finished die manufactured by independent device manufacturers...

The Future is Heterogeneous Integration

2020 proved to us that our world is wholly unpredictable. As the year began with optimism for a new decade and excitement for what the new decade might bring, the last thing expected was the arrival of COVID-19. Within a short time, the pandemic created unprecedented disruption while shattering lives...

A Start-up Grows Stronger In Spite of COVID-19

As an early-stage start-up company, Mosaic Microsystems worked hard to navigate the Covid-19 pandemic. Our #1 goal was to keep our employees safe. Fortunately, we had recently closed a $2.25M seed investment from BlueSky Capital and Corning Incorporated, received a Phase II Small Business Innovative Research (SBIR) grant from the...

What the Pandemic Brought to Me

In the middle of December 2020, Germany went into its second lockdown. It seemed that people were more careless compared to March and April, when COVID-19 pandemic started, and we had to go into the first lockdown. Numbers are much worse now and reaching sad records every day. Too many...

Packaging IFTLE View all

IFTLE 475: EPTC 2020: IME on Hybrid Bonding Challenges; Latest on Intel

IME – Hybrid Bonding Studies Singapore’s Institute of Microelectronics – IME / AStar – was certainly the most prolific presenter at the conference. In their presentation, “Wafer Level Fine-Pitch Hybrid Bonding: Challenges and Remedies”, they review in great detail processing issues prevalent in hybrid bonding. Wafer-level fine-pitch hybrid bonding, first...

SemiSisters View all

Diversity, Parity, Prosperity: Perspective of an Industry Veteran

“Don’t surround yourself with yourself …” Yes, from I’ve Seen All Good People. “At Japan’s Most Elite University, Just 1 in 5 Students Is a Woman.” The New York Times, 08 December 2019 “The semiconductor industry isn’t known as a standout example of diversity and inclusion. But that’s changing.” Jane...