Sustainability 101: The Circular Economy, Part II–Improving E-waste
Dec 07, 2021 · By Julia Goldstein · Blogs, From Different Dimensions
3D In Context View all
Semiconductor Sustainability Efforts Need Collaboration
During the recent Applied Materials/SEMI Sustainability Forum, panelists touched on the fact that the big drivers of electronics — Apple, Amazon, Alphabet, Microsoft, and Facebook — are looking to cut carbon emissions across their supply chains. From a semiconductor perspective, this would include the energy and greenhouse gases used in...
The World of Logic as We Know It
October is a busy month as conferences go. ARM and Intel each held their virtual developer events focusing on the future of compute. IMAPS addressed packaging technology, and TSMC held its Open Innovation Platform (OIP) forum, also in late October. AMD followed up with an accelerated data center event in...
CEA-Leti Looks to Move the Semiconductor Sustainability Needle
Sustainability is rapidly taking center stage in most industries; the electronics and semiconductors space included. The major players in the electronics’ space — Alphabet, Apple, Amazon, Microsoft, and Facebook — have set aggressive carbon reduction goals for both themselves and their supply chain. These goals include having both themselves and...
Semiconductor Sustainability From the Venture Capital Perspective
The sustainability wave in the tech space is gaining momentum. Alphabet, Amazon, Apple, Facebook, and Microsoft have all set very aggressive sustainability targets (Figure 1). Most of these companies are shooting for net-zero emissions by 2030, or at least have Scope 1 and 2 emissions at zero at that time....
Francoise in 3D View all
IMAPS International Symposium 2021 – It’s Great to be Back!
Oh, how I missed those hallway conversations! And last week’s IMAPS International Symposium 2021 did not disappoint. It was so energizing to reconnect face-to-face with those industry colleagues who were able to make the trip. While the keynotes and sessions provided great insight on technology trends impacting the microelectronics industry,...
Panel Level Packaging Consortium 2.0 Gains Ground
Sometimes, in the face of adversity, great things can be accomplished. In this case, the adversity was the COVID-19 crisis, and the great things accomplished were the goals of the Panel Level Packaging Consortium 2.0. In a recent article published by Fraunhofer IZM, Dr. Tanya Braun, group leader of the...
Understanding the Nuances of Chiplet Design
Chiplets are the new “It” heterogeneous integration technology. In fact, the big news in Taiwan this week is that Apple is entertaining the idea of using TSMC’s 3D interconnect fabric – which is based on the company’s approach to chiplet integration. According to Taiwan News, other companies considering the technology...
How Europe Should Navigate Its Semiconductor Supply Chain Challenges
Over the last 18 months, the European semiconductor industry has felt the repercussions of supply chain interruptions due COVID 19 and trade wars, combined with exploding global demand for chips driven by the digital transformation. There are also questions about regional sovereignty and the need to strengthen the local supply...
From Different Dimensions View all
What’s It Like to Intern at A Top Workplace Award Winner
This past summer has been one of the most interesting and educational summers of my life. I finished my junior year studying electrical engineering at Missouri University of Science and Technology when I received an email about an internship opportunity at Brewer Science. Brewer Science is an international company based...
From Cubes to Chips: One Engineering Student’s Journey
It all started with a Rubik’s Cube… When I was in middle school, I liked to struggle with new concepts and would look for ways to challenge myself. It was during this time that I found what became my ongoing project (and some might say obsession), the Rubik’s Cube. I...
From Macro to Micro: Learning Microelectronics Firsthand at StratEdge
I was fortunate enough to join StratEdge Corporation in May 2021 as an Engineering Technician working in the semiconductor packaging industry. I am currently an aerospace engineering student at Southwestern College and transferring to San Diego State next fall. In my time at StratEdge, I have had the opportunity to...
How My Internship at Mosaic Microsystems Helped Me Grow
My name is Devan Mederios, and I recently had an eight-month-long internship at Mosaic Microsystems. I had an incredible experience working with this organization and have learned so much. I am a chemical engineering major at RIT, and at Mosaic, I was able to able to apply a lot of...
Packaging IFTLE View all
IFTLE 503: SIA reports on the State of the Semiconductor Industry
In early October the Semiconductor Industry Association (SIA) released its fiscal year-end report on the State of the Semiconductor Industry for 2021. I will skip the detailed focus on how the industry helped pull us out of the pandemic and stick to technical and economic data. In 2020, sales into...
IFTLE 502: Are Samsung and Intel challenging TSMC Dominance? AMAT Positions Itself in Advanced Packaging
Major Foundry Investments in the US Samsung, Intel, and TSMC are all making large foundry investments in the US. First reported in May, Samsung Electronics is reportedly now close to finalizing the site selection for its new $17B foundry in the United States. The investment would create a second foundry,...
IFTLE 501: A Look at the Semiconductor Supply Chain and More from the HI Summit
Back from our IFTLE #500 trip down memory lane, let’s continue our look at the SEMI Heterogeneous Integration Summit. We’ll focus on the semiconductor supply chain, the advanced packaging market, and advancements in image sensor technology. Semiconductor Supply Chain Research at BCG Martin Schrems, senior advisor at Boston Consulting Group,...
IFTLE 500: We’ve Come a Long Way, Baby!
IFTLE (Insights From the Leading Edge), believe it or not, has reached #500! I hope this message reaches all of you free of COVID and ready to move on in this exciting period for Advanced Microelectronic Packaging. For those of you that have not been on board for the full...
SemiSisters View all
Smartphone Addiction is Not a Gender-Specific Problem
An open letter to David Benjamin, EE Times Dear David, You really don’t get it. Why? Why, when more women are joining the microelectronics industry in technical and non-technical roles, would you resort to female stereotypes from the 1950s as a vehicle to discuss such an important topic as global...
2021 3D InCites DEI Fundraiser a Success; Thank You Sponsors
We took our annual mural project online this year! Illustrator Ronna Encarnacion created this original watercolor to reflect the importance of Diversity, Equity, and Inclusion in creating sustainability. Proceeds from the project will be used to seed the 3D InCites DEI Fund to support technology businesses owned by women and...
How is COVID 19 Impacting the Semiconductor Industry’s Diversity and Inclusion Efforts?
A headline on CNN Business caught my eye last night: Working mothers are quitting to take care of their kids, and the US job market may never be the same. I started reading and went down a rabbit hole of related articles that revealed a few things: Unlike the recession...
SemiSister Success Story: A Woman on the Edge of 3D Technology
Severine Cheramy has devoted her career to developing 3D integration technologies and bringing them to market. She was the first person to show me what a TSV wafer looked like when I visited CEA-Leti’s cleanroom in 2009 during my Tour de France in 3D. At the time, she was a...
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IFTLE 499: SEMI Heterogeneous Integration Summit Part 1
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IFTLE 498: Sapphire Rapids – Intel Chiplet Architecture Begins
X-FAB – First Foundry to Offer Micro Transfer Printing Before we take a look at Intel’s Sapphire Rapids, a quick...
IFTLE 497: Ajinomoto Expands Materials Offerings; BESI readies for Chiplet Era
Continuing our look at presentations from the IMAPS SiP Conference. Ajinomoto Habib Hichri of Ajinomoto discussed the use of novel...
Sustainability 101: Chemicals of Concern – Beyond RoHS
Semiconductor manufacturing involves many “chemicals of concern,” or compounds that are hazardous to human health and the environment. The hazardous...
IFTLE 496: Intel discusses US Mega-FAB; Google To Build Own ARM-based Processor Chips
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A Look at Semiconductor Equipment Supplier Sustainability Efforts
Most semiconductor equipment companies have been focused on sustainability programs longer than most other industries. In part, some of the...
IFTLE 495: Siemens – Chiplets are the New Generation of SiP
The virtual IMAPS SiP conference recently took place under the Chairmanship of Mark Gerber of ASE. Siemens EDA Keith Felton...
You’ve Been Through an M&A – Maybe It’s Time to Rebrand?
Much consolidation has happened in the semiconductor industry over the last decade or so. And it’s not over yet if...
Golden Era or Short-Term Cycle?
Day 2 of SEMI’s Innovation for a Transforming World featured the outlook on semiconductor market growth over the next 2-3...
Total Cost of Ownership Success Begins (or Ends) with Your Equipment
Lower cost. Everyone wants it. There are many ways to reach it. On the surface, a low initial purchase price...
Is Humpty Dumpty Really Broken?
Can the USA wrestle back Front- and Back-end Semiconductor Manufacturing? Humpty Dumpty Humpty Dumpty sat on a wall Humpty Dumpty...
How Can We Tap into $52 Billion to Reshore Advanced Packaging?
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