IFTLE 488: Nepes Readies Commercialization of mPoP Technology
Jun 15, 2021 · By Phil Garrou · Blogs, Packaging IFTLE, Uncategorized
3D In Context View all
More Thoughts And Lessons Learned During My Career in Semiconductors
In the Spring 2020 issue of the MEPTEC Report, Herb Reiter briefly emerged from his recent retirement to pen an article and interview based on lessons learned during his 50-year-long career in semiconductors. Turns out he had a lot to say. So with Ira Feldman and Bette Cooper’s blessing, we’re...
PART 2: Lessons 7-13 Learned from Fifty Years in the Semiconductor Industry – A Memoir
In the Spring 2020 issue of the MEPTEC Report, Herb Reiter briefly emerged from his recent retirement to pen an article and interview based on lessons learned from fifty years in the semiconductor industry. Turns out he had a lot to say. So with Ira Feldman and Bette Cooper’s blessing,...
12 Lessons Learned from Fifty Years in the Semiconductor Industry – A Memoir
In the Spring 2020 issue of the MEPTEC Report, Herb Reiter briefly emerged from his recent retirement to pen an article and interview based on lessons learned from 50 years in the semiconductor industry. Turns out he had a lot to say. So with Ira Feldman and Bette Cooper’s blessing,...
Everything is Always Greener on Earth Day
In my day job in the winter, I work in the ski industry, which is working very hard on sustainability and becoming greener. On Earth Day, my inbox was filled with how companies that supply the ski industry are being sustainable, and more importantly are working to drive awareness in...
Francoise in 3D View all
ECTC 2021: Economic Outlook Focuses on the Impact of the Pandemic
For the first time in its 71-year history, the ECTC committee veered away from strictly technical topics to include a panel discussion on market trends and the economic outlook. Moderated by SemiEngineering’s Ed Sperling, much like a relay race, the session was structured to start with the big picture story,...
Introducing the 3D InCites Podcast
Over the past month, you may have noticed a new addition to the 3D InCites platform. The 3D InCites Podcast made its debut on May 5, 2020, with a conversation with Kiterocket’s Joe Cestari, about how to successfully market a semiconductor business. The second episode featured 3D InCites bloggers, Julia...
The Role DEI Plays in Achieving a Sustainable Future
I was recently invited by IMAPS UK to give a keynote at their annual conference, MicroTech 2021. The topic was Heterogeneous Integration (HI). I agreed, provided I was allowed to give the topic a new twist. I provided the following abstract, and the committee eagerly agreed to my proposal: A...
Everything’s Coming up Chiplets at the 2021 Global Business Council
Leave it to Bill Chen, ASE, to set an optimistic tone for the 2021 Global Business Council Spring Meeting. It was exactly what the packaging community needed to hear. The last time many of us met in person at an industry event was at the 2020 IMAPS Device Packaging Conference...
From Different Dimensions View all
Sustainability 101: GHG Emissions – Definitions and Scopes
Welcome to Sustainability 101. The purpose of this blog post series is to define what we mean when we mention sustainability and reach a shared understanding of common terms. The series will cover: Greenhouse gas (GHG) emissions—Definitions and scopes Sustainability reporting—standards and trends Circular economy, part I—What is zero waste?...
Developing Water Resilience Strategies for a Secure and Sustainable Future
Taiwan, an island dotted with scenic mountains and lakes, is facing its worst drought in decades. Not a single typhoon (the heavy rains replenish the reservoirs) made landfall in Taiwan last year. The lack of rain this year is exacerbating the situation even further. The use of water to eliminate...
What You Need to Know About Sustainability in Semiconductors
While the global spotlight is shining on the importance of sustainability in semiconductors, the concept itself is not new. As early as 2003, when the European Union adopted the Restriction of Hazardous Substances Directive, semiconductor manufacturing companies started to become more aware of their impact on the environment and launched...
SEMI Response to the COVID-19 Pandemic: Supporting Continuity of Members’ Business Operations
The outbreak of the COVID-19 pandemic caught most countries and companies off guard and unprepared. Specifically, companies were caught short of personal protection equipment (PPE), along with essential tools, materials, and components to keep manufacturing lines running. Many companies had a business continuity plan (BCP) ready, but all were tested...
Packaging IFTLE View all
IFTLE 487: Yole Développement Reviews the Advanced Packaging Market
Vaibhav Trivedi of Yole Développement gave an outlook for the advanced packaging market with a focus on 3DIC. The semiconductor market declined 12% YoY to reach $412B in 2019. In 2020 the market grew slightly despite the pandemic to about $439B. Yole expects 2021 to be another slight growth year (Figure...
Trends in Semiconductor Manufacturing: Wafer-Level Packaging
One of the hottest trends in semiconductor manufacturing today is wafer-level packaging (WLP). According to Allied Market Research, the global WLP market size is expected to reach $7.8 billion by 2022, registering a compound annual growth rate (CAGR) of 21.5% from 2016 to 2022. Broadly defined, WLP encompasses different integration...
IFTLE 485: TSMC, Samsung and Sony Showcase Advanced Packaging at 2021 IEEE ISSCC
Finishing up our look at the 2021 IEEE ISSCC, Forum 5 was entitled Enabling New System Architectures with 2.5D, 3D, and Chiplets. This was another clear example of a here-to-fore front-end conference now focusing on advanced packaging technologies. The session description states “The end of scaling drives innovative 2.5D, 3D...
IFTLE 484: Massively Parallel Pick-and-Place Assembly from the X-Men
I think it was Shakespeare who reportedly penned, “Would a rose by any other name still smell as sweet?” or something close to that. Why am I quoting Shakespeare? Well, we have a technology, massively parrallel pick-and-place assembly, that’s been around for more than a decade that I think still...
SemiSisters View all
2021 3D InCites DEI Fundraiser a Success; Thank You Sponsors
We took our annual mural project online this year! Illustrator Ronna Encarnacion created this original watercolor to reflect the importance of Diversity, Equity, and Inclusion in creating sustainability. Proceeds from the project will be used to seed the 3D InCites DEI Fund to support technology businesses owned by women and...
How is COVID 19 Impacting the Semiconductor Industry’s Diversity and Inclusion Efforts?
A headline on CNN Business caught my eye last night: Working mothers are quitting to take care of their kids, and the US job market may never be the same. I started reading and went down a rabbit hole of related articles that revealed a few things: Unlike the recession...
SemiSister Success Story: A Woman on the Edge of 3D Technology
Severine Cheramy has devoted her career to developing 3D integration technologies and bringing them to market. She was the first person to show me what a TSV wafer looked like when I visited CEA-Leti’s cleanroom in 2009 during my Tour de France in 3D. At the time, she was a...
Diversity, Parity, Prosperity: Perspective of an Industry Veteran
“Don’t surround yourself with yourself …” Yes, from I’ve Seen All Good People. “At Japan’s Most Elite University, Just 1 in 5 Students Is a Woman.” The New York Times, 08 December 2019 “The semiconductor industry isn’t known as a standout example of diversity and inclusion. But that’s changing.” Jane...
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A History and Analysis of Offshoring and Reshoring the US Semiconductor Industry
Since TSMC made its announcement late in 2020 that they were potentially building a semiconductor fab in Arizona, the reshoring...
Rare Earth Mining: The Dark Underside of Sustainability
Electric Vehicles (EVs) are increasing demand for Cobalt and Lithium: Two of the world’s rare earth minerals that come with...
IFTLE 483: Advanced Packaging Requirements for 5G and 6G Telecom
iNEMI recently presented a webinar by Prof. Madhavan Swaminathan who has taken over Georgia Tech’s Packaging Research Center, after Rao...
A Semiconductor Shortage, a Capex Boom, and Onshoring
The semiconductor shortage written about last month seems to have expanded, or at least the panic behind it has...
IFTLE 482: The Latest from TSMC‘s Mark Liu at IEEE ISSCC 2021
The IEEE International Solid-State Circuits Conference, – ISSCC 2021 – took place in late February. As we have suspected for...
The People Who Make DBI Possible
A Conversation with the Xperi Hybrid Bonding Team In the world of heterogeneous integration, hybrid bonding — and in particular,...
Trends and Development in Heterogeneous Integration: Advancing the Smart Digital Age with System-in-Package and Chiplet Technologies
Heterogeneous integration (HI) is fast becoming a key driver of semiconductor development due to its ability to scale the number...
IFTLE 481: A BRIDG to Somewhere
It was exactly two years ago that IFTLE first discussed the entity known as BRIDG and how it planned to...
Drum Roll Please! The Winners of the 2021 3D InCites Awards are…
Like every other awards event in the past year, the 2021 3D InCites Awards Program had to make some adjustments...
If a Tree Falls in the Forest, Does it Produce Carbon Dioxide?
While working with a committee on evaluating multiple microelectronics companies for their efforts on sustainability an interesting question arose. Is...
IFTLE 480 : Wafer Thinning and Nano TSVs; Making Money on the Leading Edge
Wafer Thinning and Nano TSVs In the last few years, Ann Jourdain of IMEC and co-workers have described silicon device...
3D InCites Mural Project To Seed New DEI Fund
For the last several years, we held the 3D InCites Mural Project, in conjunction with the 3D InCites Awards, in...
Fan-Out Panel-Level Packaging Takes Off
Fan out (FO) packaging is one of the key growth segments in advanced packaging, with high adoption rates and strong... Announcing the Finalists of the 2021 3D InCItes Sustainability Award and SemiSister Award
As part of our annual 3D InCites Awards program, we decided this year to turn the spotlight on two areas...
IFTLE 479: ABF Substrate Shortages; Consolidation Continues
This past fall, our packaging industry saw significant shortages of packaging substrates made from Ajinomoto Build-up Film (ABF). Let’s take...
Another Microelectronics Crisis? The Automotive Chip Shortage and Supply Chains
My, what a fix the microelectronics industry has gotten itself into! Three crises happening all at the same time: One...
The Digital Transformation is Here, and Semiconductors are Its Lifeblood
After a year living in the shadow of COVID 19, the speakers at the Technology Unites Global Summit Executive Forum...
IFTLE 478: Chiplet Nomenclature; EV Group/ASM Support D2W Hybrid Bonding
On Definitions and Buzzwords Long-time readers of IFTLE know that I’m sensitive about nomenclature and buzzwords. For instance: “nanotechnology” and...
Holy San Francisco Batman, SEMICON West 2021 will be held in December!
This past week SEMI announced that SEMICON West 2o21 will be a hybrid affair with both a live conference and...