3D In Context View all

Francoise in 3D View all

Virtual IWLPC Focuses on Panel Level Packaging

The 2020 International Wafer Level Packaging Conference (Virtual IWLPC) brought up the caboose of several weeks of virtual conferences that for me started with SEMICON Taiwan and included IMAPS International Symposium. The content featured one keynote, a panel discussion, 40 technical presentations, and 23 virtual exhibits where you can access...

The Softer Side of the IMAPS Symposium

Because IMAPS is a society, there is a strong community aspect to its events. It was good to see that captured at this year’s symposium. I really enjoyed attending the live versions of the Society Awards presentation and the Diversity and Inclusion Roundtable. I also popped into the Student-Industry Roundtable...

From Different Dimensions View all

Jack McCauley Augments Reality with MEMS Sensors

Jack McCauley understands the interplay between video game hardware and human interaction like few others in the industry. He designed the guitar and drums for Red Octane’s (later Activision’s) Guitar Hero video game series. As co-founder and chief engineer of Oculus VR, he designed the Oculus DK1 and DK2 virtual...

Virtual SEMICON WEST: A Kiterocket Perspective

The current pandemic is wreaking havoc across the globe and forcing organizations, employees, and volunteers to either cancel events or find ways to do things differently. And wouldn’t you know it; leading up to the 50th Anniversary of SEMICON West, the SEMI organization had to make a call. It decided...

What A Difference a Quarter Makes!

At the end of the 1st quarter and into early June, the thinking was that the semiconductor and packaging industry would have a rough 2020, or at least back-to-back down years. The impact of Covid-19, supply chain interruptions, and uncertainty surrounding Huawei all were creating fear, uncertainty, and doubt about...

Packaging IFTLE View all

IFTLE 465: AMD’s Bryan Black Opines on Chiplets

In the second great keynote presentation of the Annual IMAPS Symposium a few weeks ago [see IFTLE 465 “ Intel Reviews Leading Edge Packaging Technology”] AMD’s Bryan Black, the Godfather of chiplet technology, opined on “Chiplets: How to Utilize Them,  Some of Their Challenges and What They Can Do” Back in...

IFTLE 465: Intel Reviews Leading-Edge Packaging Technology

In recent blogs, we have discussed the damage done to Intel’s leading-edge technology reputation by major delays in both their 10nm and 7nm product introductions [ see IFTLE 458]. We have also seen them try to put a positive spin on the fact that they may have to go external...

IFTLE 463: DoD Focuses on “Reshoring” Electronics to the US

The Defense Advanced Research Projects Agency (DARPA) launched its Electronic Resurgence Initiative (ERI) in 2017 with the intention of reshoring a domestic chip industry that has been moving steadily offshore for decades. Microelectronics are a foundational building block of most of our defense systems. At this year’s virtual ERI conference...

IFTLE 462: If Not a Node then What?

In the August issue of IEEE Spectrum magazine, Samuel Moore published an article entitled “The Node is Nonsense”. (Note: Samuel Moore not Gordon Moore) Let’s take a closer look at what Moore is trying to tell us and see how advanced packaging fits in. Where the Node Came From Back...

SemiSisters View all

Diversity, Parity, Prosperity: Perspective of an Industry Veteran

“Don’t surround yourself with yourself …” Yes, from I’ve Seen All Good People. “At Japan’s Most Elite University, Just 1 in 5 Students Is a Woman.” The New York Times, 08 December 2019 “The semiconductor industry isn’t known as a standout example of diversity and inclusion. But that’s changing.” Jane...