IFTLE 444: Chip on Interposer on Substrate vs High Density Chips-Last Package Cost Modeling
Mar 26, 2020 · By Phil Garrou · Blogs, Packaging IFTLE
3D In Context View all
FLEX/MSTC 2020: Change has Never Been So Fast…
SEMI, together with FlexTech, the MEMS & Sensors Industry Group, the Nano-Bio Materials Consortium (NBMC) and NextFlex, held FLEX/MSTC 2020 at the DoubleTree in San Jose from February 24 to 27. Executives from above industry organizations and their member companies presented current capabilities of flexible hybrid electronics (FHE), MEMS and...
Is The HIR the Best Path to Increased Revenues?
The 3rd Annual Heterogeneous Integration Roadmap (HIR) Symposium confirms it: Heterogeneous Integration is the best way for the semiconductor industry to achieve $ 1 Trillion in revenues. SEMI hosted the event at its headquarters in Milpitas. Almost 200 IC design and manufacturing experts joined, to celebrate the release of the 2019...
Has Google Discovered the Advantages of Advanced IC Packaging Technologies?
At the latest MEPTEC Luncheon, held February 5, 2020, and hosted by SEMI at its Milpitas HQ, Google’s Dr. Preeti S. Chauhan, Technical Program Manager for Data Center Quality, presented her perspectives on the benefits and challenges of advanced IC packaging technologies. Considering that Alphabet, Google’s parent company, controls about...
Big Data, Speed and Security Dominate DesignCon 2020
About 5000 attendees, as well as more than 200 exhibitors, took over the entire Santa Clara Convention Center from January 28 to 30, to hear the latest about IC, package and board innovations and to celebrate the 25th Anniversary of DesignCon. About 200 presenters conveyed very useful information in 14...
Francoise in 3D View all
Coronavirus Gives Rubbing Elbows a New Meaning at IMAPS DPC 2020
As the domino effect of electronics industry event cancellations continued in response to the global threat of a potential Coronavirus pandemic, one industry association, the International Microelectronics, and Packaging Society is committed to carrying on this year’s event agenda, at least in the United States. The IMAPS International Device Packaging...
Heterogeneous Integration Technology Gets its Own Competence Center
The team at EV Group has done it again. They looked around at where the microelectronics industry is headed, identified a gap and set out to fill it. This time, the gap fell in between research and development (R&D) and the ramp to manufacturing for customer products built using heterogeneous...
And the Winners of the 2020 3D InCites Awards Are…
The 2020 3D InCites Awards program has been a bit of a nail biter for us all, as we waited for the judges’ votes to see how they aligned with the online votes. Remember: the online votes serve as one judge. So, it was possible to win the online vote...
Ensuring Device Reliability in Automotive Electronics
More than 90% of all traffic deaths are caused by human error.1 I’m sure you’ve all heard this statistic repeatedly over the past few years. After all, this 2016 finding by the US National Highway Traffic Safety Administration (NHTSA) is fueling the semiconductor industry’s mission to develop the automotive electronics...
Latest Posts
Industry Standards Activity Report November 2019
The SEMI North American standards meetings for the Information and Control Committee were held recently and the following is a...
GEM: Meeting Future Needs by Building on the Stability of the Past
As a young boy, I liked to work on the family car with my dad. He taught me how to change...
Why implement a SECS GEM driver?
A SECS GEM driver can be looked at from a factory or equipment supplier perspective. I will discuss both of...
Software Testing for Factory Automation
When it is time to deploy equipment in a factory it is very apparent if proper software testing has been...
Heterogeneous Integration Technologies for Moore’s Law 2.0 and Beyond
Despite travel restrictions due to the Coronavirus, Dr. Douglas Yu, Vice President of R&D for TSMC gave a keynote via...
IFTLE 442: Intel Joins CHIPS Alliance; 3D Stack Testing Standardized
Everyone by now should know that Intel has been a lead member of the DARPA “CHIPS” program fostering and developing...
IFTLE 441: Will TSMC Ever Put a Chip or Packaging Facility in the USA?
While we are all conjuring visions of what advanced packaging and in fact transistors themselves will look like in the...
IFTLE 440: Copper Pillar Bump Development for 7nm Node Devices
In the latest issue of IMAPS “Advancing Microelectronics” magazine (Nov/Dec 2019) Lei Fu and his colleagues at AMD published an...
Big Data and Beyond: PTC Summit Examines AI and ML for Smart City Applications
The problem at its most succinct: “A piece of equipment will deteriorate much more predictably than a human body does.”...