IFTLE 614: What’s in Store for Intel’s Future? Update on NAPMP Proposers Day
Dec 11, 2024 · By Phil Garrou · Blogs, Packaging IFTLE
3D In Context View all
Nuclear is Out. How Do We Solve the High Tech Sustainability Problem?
The past 2 weeks have been a whirlwind of activity in high tech sustainability. We’ve moved from using nuclear power for data centers to only some nuclear power for data centers. A change of administration where support for renewables and sustainability will not be as strong as under the previous...
The Funds Keep on Rolling for CHIPS for America R&D
The CHIPS Act continues to issue grants to help advance the United States position in semiconductor and advanced technology. Two CHIPS for America R&D facilities were announced in late October and early November. First announced was an $825 million dollar grant to Albany Nanotech in upstate New York to develop...
My How the Pendulum Swings
Why the AI Energy Crisis is Driving Us back to Coal and Nuclear Energy When I was an undergrad in Eastern Washington, my Physics professor and Geology professor, both had strong links to energy companies. With a strong coal industry in the region and the Hanford Nuclear facilities within field-trip...
TSMC OIP 2024: Strong Partnerships Drive 3D Packaging
I have spent a considerable amount of time covering the technology associated with the front-, and back end of-the-line. So for me, it is remarkable to see the growth in advanced packaging and how the interest in packaging technology seems to be overshadowing the FEOL transition to gate all around...
Francoise in 3D View all
Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the industry needs to catch up to those who have been following the course of these technologies while they were in development. The Advanced Packaging Conference (APC) at SEMICON Europa 2024...
Making Connections at SEMICON Europa 2024
Let’s be honest. When we get home from a trade show like SEMICON Europa 2024, it’s not all the presentations that we remember. It’s the connections we’ve made – new and old – with industry colleagues around the globe that stand out. You can go to any SEMICON Event around...
Picking up the Pace of Panel-level Advanced Packaging at Onto Innovation
How A Collaborative Partnership Is Accelerating PLP Innovation Panel-level advanced packaging technologies have been in development for more than a decade. They began as a way to reduce costs and improve yields for fan-out wafer-level applications. Smartphone applications – particularly fingerprint sensors – promised the volumes that would make the...
Leaning Into Interconnectology – Musings from IMAPS Symposium 2024
Call me crazy, but after spending three days at the 2024 International Microelectronics and Packaging Society (IMAPS) Symposium in Boston learning about the latest industry trends and technology advancements, I think it’s time for the entire advanced packaging world to fully adopt the concepts of “Interconnectology” and “Interconnectologist”. The inspiration...
From Different Dimensions View all
November 3D InCites Member News: Advancements and Milestones
This month has been full of exciting advancements and milestones for our members. From cutting-edge technological breakthroughs and prestigious award recognitions to innovative partnerships, impactful collaborations, and significant company developments, our members continue to make remarkable strides in their fields. Here’s a closer look at the highlights and achievements they’ve...
Sustainability 101: Let’s Talk Supply Chain
My blog post for November is about supply chains and sustainability. I’ll get to that, but first, I want to get a bit personal. I opened LinkedIn at 6 am Pacific time on November 6 and saw multiple posts from contacts around the world saying, “America, what have you done?”...
The Evolution of Interconnects in Microelectronics Packaging
Semiconductor packaging is a complex and evolving field, involving multiple disciplines. As a microelectronics packaging engineer, I focus on the “interconnect thread” from the chip to the system (Figure 1). To me, packaging is about interconnectivity (essentially). The primary function of packaging is to provide the interconnection from the IC...
From Words to a World of Chips: My Experience with IMAPS and The International Symposium
Recently, I worked on a grant proposal for the International Microelectronics and Packaging Society (IMAPS) Academy, as part of the Department of Commerce’s National Semiconductor Technology Center’s (NIST) workforce development initiative. Through this project, I experienced the semiconductor industry on a personal, first-hand level, working closely with IMAPS staff and...
Interconnectology 101 View all
What to Know Before Buying an IMAPS Academy Course
If you’re new to the advanced packaging industry, it may have crossed your mind to invest in a professional development course. IMAPS, or the International Microelectronics Assembly and Packaging Society, offers exactly that. Their packaging-specific, IMAPS Academy courses are aimed at promoting a stronger understanding of key parts of the...
What Are Glass Core Substrates?
You may be familiar with organic substrates, but as of recently, glass core substrates have been gaining traction in the world of semiconductor manufacturing. Glass core substrates are emerging as a possible solution for achieving the interconnect density needed to power applications like artificial intelligence (AI) and high-performance computing (HPC)....
The Basics of Chiplet Integration and Importance of Adhesive Solutions
What You Need to Know as an Industry Newcomer If you’re a regular reader of 3D InCites, you’ve probably seen the word “chiplets” before, but you may not know what they are. To put it simply, chiplets are small “chips” that perform singular functions really well, but they can’t perform...
Interconnectology 101: Before Switching to PVD, Consider Liquid Metal Ink
You may have heard of the company, Averatek. Founded in 2009 out of the Stanford Research Institute, it developed and licensed chemistries and advanced interconnect technologies for electronics. Although the company specialized in printed circuit boards (PCBs), Averatek’s new leadership saw an opportunity to apply its technology to advanced packaging....
Packaging IFTLE View all
IFTLE 613: Solder Joint Reliability of Glass Core Substrate Assemblies
We have seen considerable global activity focused on developing glass core substrate assemblies and interposers, yet, as some of us have often mentioned, we have seen little in the way of reliability data for any modules built from these substrates. IFTLE considers the work of Absolics (the US division of...
IFTLE 612: Congratulations to the IMAPS 2024 Society Award Winners
Figure 1 shows a listing of the 2024 IMAPS Society Award winners and the feature photo above are some of the winners who attended the the gala event at IMAPS Symposium 2024. They are, from left to right: Brandon Hamilton, BAE Systems; Casey Kraweic, StratEdge; Gary Hemphill, Retired; Phil Garrou,...
IFTLE 611: Amkor Clarifies Arizona Facility Activity
Wolfspeed & Hemlock Semiconductor Get Their CHIPS Act Share Arizona Facility to Focus on High Performance Computing In IFTLE 577 we reported that Amkor had announced plans to build an advanced packaging and test facility in Peoria, Arizona. In IFTLE 603 we reported that Amkor Technology had signed a preliminary...
IFTLE 610: Looking for Silicon Interposers? Try GlobalFoundries!
If you have been looking for reliable, dependable sources of silicon interposers in anything beyond prototype quantities – like I have the past few years working with DoD programs – then you know that in the U.S there just aren’t any such sources. Those of you that have been around...
Latest Posts
October 2024 Member News
October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance...
IFTLE 609: TSMC/Amkor U.S. Advanced Packaging Partnership; Reshoring at IMAPS 2024
TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor...
Sustainability 101: Materials, AI, and Sustainability
If you read my blog posts or follow me on LinkedIn, you probably know that I’m passionate about the intersection...
IFTLE 608: Is Chip Packaging the New Front on the US-China CHIP WARS?
US-China CHIP WARS Now Encompass Advanced Packaging In the Aug 21st issue of Asia Times, Scott Foster wrote an interesting...
IFTLE 607: Why Nvidia’s Blackwell is Having Issues with TSMC CoWoS-L Technology
Plus: UCIe 2.0 for 3D stacking; Samsung slows down Texas expansion Nvidia’s Blackwell Experiences...
Community Member Highlights for September 2024
As summer holidays came to a close, September found our member companies ramping up new products and opening new facilities....
What is Causing the Semiconductor Workforce Paradox?
One of the challenges for the semiconductor industry over a significant time period has been finding workers who have the...
IFTLE 606: Is Intel CHIPS Act Money Being Delayed?
Also: hynix Advanced Packaging in Indiana; Fraunhofer Chiplet Center; Call to Unify Advanced Packaging Standards Is the U.S. Government Becoming...
ASU’s SWAP Hub and National Collaborations Shape U.S. Microelectronics Leadership
In August of 2023, I attended the inaugural meeting of the Southwest Advanced Prototyping (SWAP) Hub, spearheaded by the Ira...
Sustainability 101: The Green Guides
What do you know about the Federal Trade Commission’s “Guide for the Use of Environmental Marketing Claims,” also known as...
IFTLE 605: Helping Lead the Way for Chip Packaging in India
India is a rapidly growing consumer of semiconductors. Its market was $22 billion in 2019 and is expected to nearly...
Now There Are Four
(2nm semiconductor manufacturing foundries) UMC started the semiconductor manufacturing foundry business in 1980, followed a few years later by TSMC....
IFTLE 604: Aspencore’s Virtual Chiplet Conference
In July, Aspencore held a two-day virtual chiplet conference through its publications EE Times and embedded, Chiplets: Building a Future...
Community Member Monthly News – August 2024
August has been a thrilling month for the semiconductor industry, marked by notable achievements from our community members. From innovative...
IFTLE 603: Amkor’s Slice of the CHIPS Pie for its HVM OSAT; Samsung Texas Update
HVM OSAT In Peoria, AZ Commerce Secretary Gina M. Raimondo has identified advanced packaging as a major area of focus...
IFTLE 602: Dr. Dev Palmer in at NAPMP; A New Player in Glass Core Substrates
Dr. Dev Palmer Takes over the Reins CHIPS NAPMP The Department of Commerce has announced that Dr. Dev Palmer has...
SEMI’s Sustainability Startup Summit Round Three
If you watched the Summer Olympics in Paris, one of the challenges the Athletes faced was the temperature. With a...
Sustainability 101: Critical Minerals and Collaboration
We need governments, companies, and communities worldwide to cooperate if we want to build a more circular and more equitable...
Witnessing Foundry 2.0 in Action
One of the ways I learn about advanced packaging technology and what it entails is by visiting our community member...
