3D In Context View all

Semiconductor Sustainability Efforts Need Collaboration

During the recent Applied Materials/SEMI Sustainability Forum, panelists touched on the fact that the big drivers of electronics — Apple, Amazon, Alphabet, Microsoft, and Facebook — are looking to cut carbon emissions across their supply chains. From a semiconductor perspective, this would include the energy and greenhouse gases used in...

The World of Logic as We Know It

October is a busy month as conferences go. ARM and Intel each held their virtual developer events focusing on the future of compute. IMAPS addressed packaging technology, and TSMC held its Open Innovation Platform (OIP) forum, also in late October. AMD followed up with an accelerated data center event in...

CEA-Leti Looks to Move the Semiconductor Sustainability Needle

Sustainability is rapidly taking center stage in most industries; the electronics and semiconductors space included. The major players in the electronics’ space — Alphabet, Apple, Amazon, Microsoft, and Facebook — have set aggressive carbon reduction goals for both themselves and their supply chain. These goals include having both themselves and...

Francoise in 3D View all

IMAPS International Symposium 2021 – It’s Great to be Back!

Oh, how I missed those hallway conversations! And last week’s IMAPS International Symposium 2021 did not disappoint. It was so energizing to reconnect face-to-face with those industry colleagues who were able to make the trip. While the keynotes and sessions provided great insight on technology trends impacting the microelectronics industry,...

Panel Level Packaging Consortium 2.0 Gains Ground

Sometimes, in the face of adversity, great things can be accomplished. In this case, the adversity was the COVID-19 crisis, and the great things accomplished were the goals of the Panel Level Packaging Consortium 2.0. In a recent article published by Fraunhofer IZM, Dr. Tanya Braun, group leader of the...

Understanding the Nuances of Chiplet Design

Chiplets are the new “It” heterogeneous integration technology. In fact, the big news in Taiwan this week is that Apple is entertaining the idea of using TSMC’s 3D interconnect fabric – which is based on the company’s approach to chiplet integration. According to Taiwan News, other companies considering the technology...

From Different Dimensions View all

What’s It Like to Intern at A Top Workplace Award Winner

This past summer has been one of the most interesting and educational summers of my life. I finished my junior year studying electrical engineering at Missouri University of Science and Technology when I received an email about an internship opportunity at Brewer Science. Brewer Science is an international company based...

How My Internship at Mosaic Microsystems Helped Me Grow

My name is Devan Mederios, and I recently had an eight-month-long internship at Mosaic Microsystems. I had an incredible experience working with this organization and have learned so much. I am a chemical engineering major at RIT, and at Mosaic, I was able to able to apply a lot of...

Packaging IFTLE View all

IFTLE 500: We’ve Come a Long Way, Baby!

IFTLE (Insights From the Leading Edge), believe it or not, has reached #500! I hope this message reaches all of you free of COVID and ready to move on in this exciting period for Advanced Microelectronic Packaging. For those of you that have not been on board for the full...

SemiSisters View all

Smartphone Addiction is Not a Gender-Specific Problem

An open letter to David Benjamin, EE Times Dear David, You really don’t get it. Why? Why, when more women are joining the microelectronics industry in technical and non-technical roles, would you resort to female stereotypes from the 1950s as a vehicle to discuss such an important topic as global...

2021 3D InCites DEI Fundraiser a Success; Thank You Sponsors

We took our annual mural project online this year! Illustrator Ronna Encarnacion created this original watercolor to reflect the importance of Diversity, Equity, and Inclusion in creating sustainability. Proceeds from the project will be used to seed the 3D InCites DEI Fund to support technology businesses owned by women and...