3D In Context View all

ECTC 2020 Online is Accessible at No Charge

When I switched my focus from single-die SoCs to multi-die ICs, I had to learn a lot about IC packaging technologies. I paid thousands of dollars to attend 3DIC conferences, tutorials, and to purchase 3DIC books. This month (June 3 to 30, 2020) you can get up-to-date info about the...

EDA and the Heterogeneous Integration Roadmap

In Austria, where I grew up, homes get passed on from generation to generation. Like many Austrians, I had a set of tools to repair plumbing, electrical, heating, and other equipment, to keep our old home comfortable. As a proud handyman, I took all my tools with me, when I...

Modeling, Simulation and Test for Multi-die IC Designs

On May 20 MEPTEC’s Executive Director, Ira Feldman, moderated another informative MEPTEC & iMAPS webinar. Two Knowledgeable speakers from Ansys and International Test Solutions (ITS) outlined their company’s technical capabilities and explained the value these tools and methodologies provide for multi-die IC design and test. Modeling and Simulation of Multi-die...

Francoise in 3D View all

3D System Integration – It Takes a Village

Actually, 3D System integration takes more than a village. It takes a global effort. As Virtual ECTC 2020 continues this month, I viewed the 3D Past, Present, and Future of 3D integration Plenary Session. The actual viewing time is just over 115 minutes. The impressive speaker line-up included 3D pioneers,...

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SEMICON China 2020 at a Glance

SEMICON China 2020, collocated with FPD China, was successfully held June 27-29, 2020. SEMICON China was the first big semiconductor...