3D Incites News
NHanced Semiconductors Leads the Semiconductor Industry in Heterogeneous Hybrid Bonding Production
The company’s recently delivered Besi Datacon 8800 CHAMEOultra plus system is the world’s first operational advanced bonder of its kind to...
SurplusGLOBAL to Showcase Legacy Semiconductor Equipment & Parts Marketplace “SemiMarket” at SEMICON JAPAN 2025
SemiMarket Offers Exclusive On-Site Seller Onboarding Program SurplusGLOBAL announced its participation in SEMICON JAPAN 2025, taking place from December 17...
imec and Brewer Science to Co-Present Breakthroughs in Thin Interposer Assembly and Flash-Lamp Debonding at EPTC 2025
Brewer Science, Inc., a global leader in advanced packaging materials and processes, will co‑present two technical papers with imec at...
SurplusGLOBAL Holds Topping-Out Ceremony for Yongin Cluster Building B, Laying Groundwork for the SemiMarket Parts Mall
SurplusGLOBAL (CEO: Bruce Kim) announced that it has successfully held a topping-out ceremony for Building B of its Yongin Namsa...
Circuits Integrated Expands to the UK to Develop Next-generation Satellite Chipsets
Greek Semiconductor Specialist Joins Space South Central to Advance 3D Compound–silicon Integration for Satellite and Defence Communications Greek semiconductor design...
SEMI Applauds Introduction of New Bill to Extend U.S. Tax Credit for Semiconductor Manufacturing Suppliers through 2031
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced support for the...
Kuehne+Nagel Expands Facility in El Paso, Texas, to Meet Growing Market Demand for Cross-border Logistics
Increasing capacity by 60% with new 20,252 m2 facility Meeting continued logistics demand at the U.S./Mexico border in light of sustained...
Brewer Science Showcases Advanced-Node and Wafer-Thinning Materials for Energy-Efficient Semiconductor Manufacturing
Visit Booth #B1465 at SEMICON Europa to explore PFAS-free, high-performance materials enabling next-gen AI packaging Brewer Science, Inc., a global...
Nordson Electronics Solutions to Demonstrate Automated Fluid Dispensing and Selective Soldering Systems for Electronics Manufacturing at Productronica 2025
See equipment demonstrations, including the SELECT Synchro selective soldering system for electronics manufacturing Nordson Electronics Solutions, a global leader in...
Product-Proven Green Alternative to Solvent and Piranha Wafer Processing using Ozone
The use of ozone in semiconductor wet processing surface preparation has gained new momentum as fabs pursue advanced cleans and...
NNME Debuts ChipPath as the Central Gateway for U.S. Semiconductor Careers, Featuring 90,000 Live Job Openings
AI-enabled Platform Provides Resources for Resume Building, Career Mapping and Exploration, Training and Development, and More To help meet the...
SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation
Registration is Open for Exhibition Dec.17-19 in Tokyo SEMICON Japan 2025, the largest gathering of leaders from the microelectronics manufacturing...
Leaders Recognized for Significant Contributions to Standards Advancing Semiconductor Manufacturing
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced the recipients of the...
Nova Announces the Release of Nova WMC: A Next-Generation Modular Optical Metrology Platform for Advanced Packaging
Nova announced the release of its latest optical metrology solution, the Nova WMC. This next-generation modular platform has been specifically designed...
The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits Announces Call for Papers on the Theme “Advancing the AI Frontier through VLSI Innovation”
Delivering a unique convergence of technology and circuits that maximizes the synergy across both domains in the microelectronics industry for...
SEMI Foundation, in Partnership with NSF, Opens National RFP for Regional Nodes to Advance Microelectronics Workforce Development
Informational Webinar Scheduled for October 16 at 3 p.m. ET to Support Interested Applicants The SEMI Foundation today announced the...
The SMTAI Conference to Feature a Presentation by NHanced Semiconductors VP Charles Woychik on Hybrid Bonding in Chiplet Architectures
Woychik’s presentation will highlight the role of hybrid bonding in supporting die-to-wafer and wafer-to-wafer in delivering high-density, low-latency interconnection technology...
SEMI Honors EV Group’s Erich Thallner with Inaugural SEMI Americas Catalyst Award
Thallner Recognized for Leadership and Innovation in Semiconductor Equipment and MEMS Manufacturing SEMI, the industry association serving the global semiconductor...
