We’ve waited a long time for this, and now it’s here. There is a 3D megatrend happening in semiconductor manufacturing, as scaling alone does not meet the sophisticated computing needs of Industry 4.0 applications like blockchain, 5G, the internet of things (IoT), autonomous transportation, telemedicine, and more. These emerging technologies call for more advanced technologies like artificial ... »
Everyone in the semiconductor industry seems so shocked by the steady stream of electronics industry publications closures and cutbacks over the past year. From where I sit as both the Founder and Editor of 3D InCites (Aka Queen of 3D), as well as Editorial Director of Kiterocket, none of what is happening surprises me. Indeed, this week’s outpouring of dismay on LinkedIn over the layoffs at Asp... »
The US-China trade war is top of mind for those who work in the semiconductor industry. How much of the current downturn is it responsible for? What impact will it have on the industry? It’s no surprise that it was a big topic of discussion recently during SEMICON West. Opinions vary, depending upon where you hang your hat. For US-based companies, for example, the impact may be significant. For ... »
What a difference a year makes. First the aesthetic: after two years of maneuvering around a construction zone at SEMICON West, the Moscone Center renovation is complete and looks fabulous. It’s also so much easier to navigate between halls, and to and from the keynote stage at the newly christened Blue Shield of California Theater. Last year at SEMICON West, the semiconductor industry was flyin... »
The recipient of the 2019 3D InCites Award for Process of the Year was Belgian research institute, imec, for its two-step wafer-level transfer mold process for 3D die-to-wafer assembly. The individual who nominated them for the award didn’t provide any more detail than that. But luckily at ECTC 2019, when I presented Eric Beyne with the award, he brought along Arnita Podpod, the research enginee... »
Two years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also recently acquired the 3D Architectures for Semiconductor Integration and Packaging Conference (3DASIP), originally produced by RTI Tech Venture Forum, which took place annually in December in San Francisco. The IMAPS executive committee decided to combine the two co... »
Of all the companies that have supported 3DInCites over the past 10 years, none has been more consistently involved, both as contributor and sponsor, as EV Group. In fact, without EVG’s belief in our mission and their sponsorship the first three years, I doubt 3DInCites would still exist today. Therefore, it seemed fitting to honor them with the cover story for our 10th Anniversary print edition... »
Over the years on 3D inCites, we’ve discussed the debate about the advantages and disadvantages of using glass substrates for advanced packaging applications. Thanks to ongoing research and development, a clear path has emerged for the use of glass in two key areas: as carrier substrates for high-density fan-out (FO) packages and as glass interposers for 2.5D integration. At ECTC 2019, I spoke w... »
I’ve been following the DBI story for over a decade (well before Xperi became a sponsor of 3D InCites). I’ve watched it grow from its humble, start-up beginnings as a Ziptronix process to its current rock-star status at Xperi/Invensas, as THE current hybrid bonding technology process for image sensors globally. All along the way, I’ve been a diehard fan of this elegant process (AND its entir... »
On my annual trek around the ECTC Technology Corner, I’m always on the look-out for something new to write about. This year, it quickly became clear by the number of exhibitors displaying their product samples, that one of my blogs would be an update on fan-out panel-level packaging. For the past few years, fan-out panel-level packaging (FOPLP) has been in hot debate: is it needed? Does it REALL... »
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