I first met Lena Nicolaides on a tour of KLA’s manufacturing area in 2015, just before the launch of the CIRCL™-AP. She had recently been promoted to vice president and general manager of the company’s LS-SWIFT Division. We spent some time picking each other’s brains about the industry and where advanced packaging was going, and I immediately felt a kinship. I knew she was a SemiSister. Th... »
In light of recent rumors, could ON Semiconductor’s acquisition of GlobalFoundries’ East Fishkill fab save the company from being carved up further? The Basics Phoenix, AZ-based ON Semiconductor (ON Semi) announced its second big acquisition in the past month: the purchase of GlobalFoundries’ (GF) East Fishkill 300mm semiconductor fab. The first was the acquisition of WiFi technology... »
Why are sensors not on the same growth trajectory as CMOS? In the face of a shaky global economy, where are the opportunities coming from? How will doctors practice medicine five years from now and how will MEMS and sensors be involved? What are some of the cool, upcoming sensor-enabled devices that will change how we interact with the world? These questions and more were the topics of discussion ... »
Picking up where we left off, Part two of this series celebrating advanced packaging innovation takes us from 2009-2019, beginning with the establishment of 3D InCites in 2009. The first conference I covered was the IMAPS Device Packaging Conference in 2009. We officially launched the first website in time for SEMICON West 2009. Remember the logo? Things could only improve from here. In 2012, now... »
After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS DPC) March5-7,2019, in Fountain Hills, Arizona, I am once again reminded why I chose to focus 3D InCites on the advanced packaging segment of the semiconductor industry. The technology is fascinating and varied, the conversation is inspiring, and the people know how to have a... »
Remember when device node scaling was the semiconductor superstar, and advanced packaging was the back-up singer? At the 15th Annual IMAPS Device Packaging Conference, held March 5-7, 2019, in Fountain Hills, AZ, it became clear how rapidly that hierarchy has shifted. From the keynotes to the panel discussion, to the Global Business Council session, speakers portrayed heterogenous integration (HI)... »
Has it already been 10 years since my first business partner, Leo Archer, and I started 3D InCites? When we first conceived of the idea in 2009, I had no idea what I was getting myself into or that 10 years later, 3D InCItes would be so well recognized in the industry, and that I would be known as the Queen of 3D. Leo and I parted ways in 2011, and after a year of going it alone and seriously thin... »
The 2019 3D InCites Awards vote was a nail-biter right up until the end. While some categories seemed almost predictable from start, others were neck-and-neck, with the front runner changing on a daily basis. What was most exciting to me, however, was how many new participants we had, and how well they did. So, from almost-to-close-call to we-never-saw-that-one-coming, here’s my analysis of th... »
If what is expressed during ongoing discussions on gender diversity and inclusion at semiconductor and packaging industry events is true, then the overarching belief is that women are drawn to careers that help people. In science, they want to be doctors or researchers to find cures for cancer. It’s also been noted that the younger generation, in general, is interested in the societal benefits o... »
From the semiconductor industry panels on gender diversity and inclusion and networking receptions to casual lunches and one-on-one interviews, I’ve been listening to women of all levels of experience talk about what brought them to pursue careers in microelectronics and semiconductors. The stories are as varied as the women telling them. In this two-part series, we hear from three women in lead... »
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