Francoise von Trapp, Author at 3D InCites

About Francoise von Trapp

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bitcoin

Bitcoin and Beanie Babies: Why Cryptocurrency Volatility Matters to the Semiconductor Industry

Bitcoin, a cryptocurrency built on blockchain, has become one of the hottest topics to hit the semiconductor news feeds and the conference circuit since the iPhone. Why? Because this code-based technology requires so much compute power to run complex mathematical equations that it gobbles up more energy than is required to fuel the entire country of Denmark. In fact, a recent article in the Washin... »

Beyond the Smartphone: How Digital Imaging is Becoming Ubiquitous 


Beyond the Smartphone: How Digital Imaging is Becoming Ubiquitous 


Digital imaging has come a long way since its first consumer implementation in digital cameras to replaced film cameras in the early 21st century. In fact, digital imaging technologies have become so varied and advanced thanks to CMOS image sensor technology, integrated circuits (ICs), and advanced packaging that almost anything can have camera capabilities integrated into it. As part of our 3D In... »

There’s a Fan-out for That

There’s a Fan-out for That

Long gone are the days of the “killer app” and the notion that a single device market like personal computers (PCs) or smartphones alone can make or break the semiconductor industry. In fact, while both those markets have softened, a multitude of emerging technologies including 5G, artificial intelligence (AI), internet of things (IoT) platforms, deep learning, autonomous vehicles, blockchain ... »

Getting IC Package Design Right the First Time

Getting IC Package Design Right the First Time

Once considered to be one of the simpler tasks in semiconductor device manufacturing, IC package design has become more complicated as it becomes more critical to the performance of the end-devices.  Market drivers are more varied than ever. Time-to-market is more critical than ever.  And advanced packaging options are more numerous than ever. In this exclusive interview with Keith Felton of Me... »

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More

Did you get your ECTC Advanced Program and Registration in the mail yet? Mine arrived yesterday, and I was pleased to see that this year’s Electronics Components and Technologies Conference (ECTC 2018), which takes place May 29-June 1, will be all about the new technology darlings driving development in heterogeneous integration: artificial intelligence, the human-machine interface, wearables, B... »

Hybrid Bonding: From Concept to Commercialization

Hybrid Bonding: From Concept to Commercialization

Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications, from 2DS enhanced, to 3D stacking with or without through silicon vias (TSVs), as well as MEMS and III-V applications. In this exclusive interview with Gill Fountain, Xperi, winner of the 2018 3D InCites Engineer of the Year award f... »

Let’s Face It, The Business of Self-driving Cars is About Profit, Not Saving Lives

Let’s Face It, The Business of Self-driving Cars is About Profit, Not Saving Lives

How does the innovation of self-driving cars affect the business world we live in? This was the topic the iMAPS Global Business Council (GBC) chose to explore during its spring meeting two weeks ago, held in conjunction with the IMAPS Device Packaging Conference, March 6-8, 2018 in Fountain Hills, AZ. In traditional GBC fashion, the morning’s session started with a big-picture keynote presented ... »

Taking Stock and Redefining the Heterogeneous Integration Roadmap at IMAPS DPC 2018

Taking Stock and Redefining the Heterogeneous Integration Roadmap at IMAPS DPC 2018

As it has for the past 14 years, the global microelectronics industry gathered at Wekopa Resort and Conference Center in Fountain Hills, AZ, March 6-8, 2018, for the 2018 IMAPS Device Packaging Conference (DPC) to share knowledge, discuss strategies for growth, learn about the latest heterogeneous integration from fan-out wafer level packaging (FOWLP) to 3D ICs. We also managed to get in some golf... »

2018 3D InCites Awards Ceremony Raises $5500 for Children’s Health and STEM Education

2018 3D InCites Awards Ceremony Raises $5500 for Children’s Health and STEM Education

March 7, 2018, the day of the 2018 3D InCites Awards Ceremony, dawned chillier than normal for this time of year in Fountain Hills, AZ. As they enjoyed their breakfast on the terrace outside the conference center, attendees of the 14th Annual iMAPS Device Packaging Conference (iMAPS DPC), may have noticed an artist hard at work creating an original mural that would later provide a backdrop to comm... »

Announcing the Winners of the 2018 3D InCites Awards

Announcing the Winners of the 2018 3D InCites Awards

We are pleased to announce the winners of the 2018 3D InCites Awards, sponsored by KLA-Tencor and EV Group and hosted by iMAPS. This may have been the most exciting awards year yet, with 40 nominees from 26 companies and four research institutes competing for awards in 9 categories. The competition was fierce! We logged in over 40,619 online votes, more than twice the number of last years event. T... »

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