Francoise von Trapp, Author at 3D InCites

About Francoise von Trapp

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Living the Dream at SEMI’s Industry Strategy Symposium

Living the Dream at SEMI’s Industry Strategy Symposium

As I noted in my day one coverage of SEMI’s Industry Strategy Symposium (ISS 2018), which took place last week at the Ritz-Carleton Hotel in Half Moon Bay, CA, this was the first time I’d been invited to join the industry elite as a member of the press* at this most coveted annual event. In this role, I was made privy to the inner workings of what makes the semiconductor industry tick, and the... »

Notes from SEMI’s ISS 2018, Days 2 and 3

Notes from SEMI’s ISS 2018, Days 2 and 3

The remaining two days of SEMI’s ISS 2018 dawned foggy and damp, making it a heck of a lot easier to head to the ballroom for a day and half full of inspiring talks versus ditching it all to answer the call of the pounding surf (I grew up on the ocean and now live in the desert, so trust me when I say the temptation was real.) Day Two started with a general technology session kicked off by L... »

Notes from SEMI’s ISS 2018, Day One

Notes from SEMI’s ISS 2018, Day One

SEMI’s Industry Strategy Symposium (ISS) has been on my conference bucket list for some time, so when I was offered a press pass to attend ISS 2018, there was no question about attending. One day in, and I’m not disappointed. The venue, the Ritz Carleton at Half Moon Bay, is spectacular – nothing like falling asleep to the sound of crashing waves on the beach below – and so far, the speake... »

Holiday Greetings from 3D InCites!

Holiday Greetings from 3D InCites!

Did you ever wonder how much easier Christmas Eve would be for Santa in a world enabled by heterogeneous integration? This video shows our vision. Enjoy! Warm wishes for a Merry Christmas and Happy New Year from your friends at 3D InCites! »

The Truth About Moore’s Law is Revealed at 3D ASIP 2017

The Truth About Moore’s Law is Revealed at 3D ASIP 2017

I’ve long held the belief that when it comes to reading scholarly works, very few people read the entire paper. At best, they read the title, introduction, and conclusion. At most, they skim the rest. Last week at 3D ASIP 2017, my suspicions were confirmed, when it was revealed by Dan Green, DARPA, that if the powers that be had bothered reading to the top of Page 3 of Gordon Moore’s “Crammi... »

3D InCites and IMAPS International Partner to Co-host the 2018 3DInCites Awards at the 2018 IMAPS Device Packaging Conference

3D InCites and IMAPS International Partner to Co-host the 2018 3DInCites Awards at the 2018 IMAPS Device Packaging Conference

Burlingame, California – Dec. 6, 2018 – 3D InCites, the premier content platform for heterogeneous integration technologies, today from the 2017 3D ASIP Conference, announced a collaboration with IMAPS International to co-host the 2018 3D InCites Awards, the semiconductor industry’s most prestigious award program recognizing contributions for the development of heterogeneous integration tech... »

When It Comes to Robots and AI, We Draw the Line at Beer

When It Comes to Robots and AI, We Draw the Line at Beer

As one of the current key drivers of the semiconductor industry, the development of robots with artificial intelligence has been on my mind quite a bit recently, second only to autonomous vehicles. I am curious to understand why we, as humans, are driven to develop technology that will surpass us in intelligence. While, among other things, AI is predicted to streamline manufacturing, improve medic... »

The Future of Automotive Electronics from the European Perspective

The Future of Automotive Electronics from the European Perspective

From the keynotes to the sessions to casual conversation, automotive electronics was a hot topic of discussion at SEMICON Europa 2017. That’s likely because Europe leads the world in automotive OEMs and is home to four of the top 10 semiconductor providers in the automotive industry. With over 22% growth in automotive ICs over the past year, it’s definitely something to talk about. Autonomous ... »

SEMICON Europa 2017: Connect, Collaborate, Innovate, Grow and Prosper

SEMICON Europa 2017: Connect, Collaborate, Innovate, Grow and Prosper

I remember the day I became Queen of 3D like it was yesterday: It was 2007 and I was attending my very first SEMICON Europa, which was held in Stuttgart, Germany. At the time, I was managing editor of Advanced Packaging Magazine, and the hot technology topic was through silicon vias (TSVs) as an emerging technology that would enable 3D chip stacking. Equipment suppliers like SPTS (then STS), EV Gr... »

Technical Tidbits from IWLPC and MSEC 2017

Technical Tidbits from IWLPC and MSEC 2017

It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October 24-26, 2017 at the DoubleTree in San Jose and SEMI-MSIG’s MEMS and Sensors Executive Congress, October 31-Nov. 2, at the Hayes Mansion in San Jose. In addition to taking in some great keynotes and technical sessions, I had the opportunity to meet with several companies to fi... »

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