Tomorrow evening (Nov. 7, 2019), Dr. Mary Jane Irwin will take the stage at a dinner being held in her honor, as she becomes the first woman to ever receive the 2019 Phil Kaufman Award for Distinguished Contributions to Electronic System Design. The award is presented annually by the Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation (CEDA) to an ... »
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out the latest supplier offerings to support technology trends, and to spread the word about our new community membership opportunities on 3D InCites. But I’ll get to that part in a bit (or if your curiosity gets the better of you, scroll to the bottom.) While we didn’t get to all the exhibitors (... »
At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which was co-moderated by PLP technology expert, Tanja Braun, Fraunhofer IZM. Panelists were John Hunt, ASE; Joseph Dang, AT&S; Keith Best, Rudolph Technologies; Tim Olson, Deca Technologies. Fan-out PLP (FO PLP) has been a hot topic on the conference circui... »
At last week's IWLPC 2019, Three keynotes by industry thought leaders provided perspective on the current climate of the semiconductor industry, and how best to weather the storm to set your company on a path for success. »
It’s official. The world is becoming more data-driven by the second and everything – I mean EVERYTHING – hinges on the success of 5G. 5G will make smart factories more efficient; bring medical care to remote places; make the autonomous vehicle infrastructure possible so you stop rear-ending the person in front of you; allow you to download all six seasons of Downton Abbey while you are waiti... »
We’ve waited a long time for this, and now it’s here. There is a 3D megatrend happening in semiconductor manufacturing, as scaling alone does not meet the sophisticated computing needs of Industry 4.0 applications like blockchain, 5G, the internet of things (IoT), autonomous transportation, telemedicine, and more. These emerging technologies call for more advanced technologies like artificial ... »
Everyone in the semiconductor industry seems so shocked by the steady stream of electronics industry publications closures and cutbacks over the past year. From where I sit as both the Founder and Editor of 3D InCites (Aka Queen of 3D), as well as Editorial Director of Kiterocket, none of what is happening surprises me. Indeed, this week’s outpouring of dismay on LinkedIn over the layoffs at Asp... »
The US-China trade war is top of mind for those who work in the semiconductor industry. How much of the current downturn is it responsible for? What impact will it have on the industry? It’s no surprise that it was a big topic of discussion recently during SEMICON West. Opinions vary, depending upon where you hang your hat. For US-based companies, for example, the impact may be significant. For ... »
What a difference a year makes. First the aesthetic: after two years of maneuvering around a construction zone at SEMICON West, the Moscone Center renovation is complete and looks fabulous. It’s also so much easier to navigate between halls, and to and from the keynote stage at the newly christened Blue Shield of California Theater. Last year at SEMICON West, the semiconductor industry was flyin... »
The recipient of the 2019 3D InCites Award for Process of the Year was Belgian research institute, imec, for its two-step wafer-level transfer mold process for 3D die-to-wafer assembly. The individual who nominated them for the award didn’t provide any more detail than that. But luckily at ECTC 2019, when I presented Eric Beyne with the award, he brought along Arnita Podpod, the research enginee... »
Site Design By
Facebook
Google Plus
Twitter
Recent Comments