3D ICs Tear Down the Dreaded Memory Wall and Save Power
Jul 15, 2020 · By Herb Reiter · 3D In Context, Blogs
Latest Posts
TechSearch Presentation Highlights Key Developments in Advanced Packaging
In a recent MEPTEC / iMAPS webinar, Jan Vardaman, President, and Founder of TechSearch International presented growth drivers for advanced packaging...
FCC-approved BLE and LoRa module includes Antenna in Package
In engineering school, I learned that different laws of physics apply when the widely used electricity with 50/60 Hertz gets...
EDA and the Heterogeneous Integration Roadmap
In Austria, where I grew up, homes get passed on from generation to generation. Like many Austrians, I had a...
Modeling, Simulation and Test for Multi-die IC Designs
On May 20 MEPTEC’s Executive Director, Ira Feldman, moderated another informative MEPTEC & iMAPS webinar. Two Knowledgeable speakers from Ansys...
Covid-19: The Way Forward for Semiconductor Success
In 2002, the first consulting client for my newly founded eda2asic consulting company was Synplicity, located in Sunnyvale. They focused...
Handel Jones: The Road to Recovery from Covid-19
Covid-19 has created unprecedented problems for health and economies worldwide. Executives must make now important and often very difficult decisions...
Dr. Wally Rhines Talks About the Semiconductor Industry’s Future
As long as the “social distancing” requirement is in force, you won’t see me in person at conferences or any...
Geopolitics and Manufacturing: A Changing Landscape
At the March 11 MEPTEC Luncheon at SEMI, Paul Pickering, Managing Director at Microtech Ventures, braved, together with a rather...
FLEX/MSTC 2020: Change has Never Been So Fast…
SEMI, together with FlexTech, the MEMS & Sensors Industry Group, the Nano-Bio Materials Consortium (NBMC) and NextFlex, held FLEX/MSTC 2020...
Is The HIR the Best Path to Increased Revenues?
The 3rd Annual Heterogeneous Integration Roadmap (HIR) Symposium confirms it: Heterogeneous Integration is the best way for the semiconductor industry...
Has Google Discovered the Advantages of Advanced IC Packaging Technologies?
At the latest MEPTEC Luncheon, held February 5, 2020, and hosted by SEMI at its Milpitas HQ, Google’s Dr. Preeti...
Big Data, Speed and Security Dominate DesignCon 2020
About 5000 attendees, as well as more than 200 exhibitors, took over the entire Santa Clara Convention Center from January...
ISS 2020: How to Win in Our Data-driven World – Part 2
In Part 1 of my ISS 2020 blog, I described Monday’s opening keynote by LAM’s CTO, Richard Gottscho. He explained...
ISS 2020: How to Win in Our Data-driven World
From January 14 to 16, 2020 SEMI welcomed about 300 high-level executives to the Industry Strategy Symposium (ISS 2020) at...
Novel Multi-die Integration Concept Offers Big Benefits
The monthly MEPTEC Luncheons at SEMI in Milpitas focus on microelectronics packaging and test topics. Javier DeLaCruz, Xperi’s VP of...
IEDM 2019: Making Electronic Systems Smarter, Safer, and More Reliable
The San Francisco Hilton on O’Farrell Street welcomed IEDM 2019 and it’s 1800 attendees in early December. While the conference...
MEPTEC’s Annual IC Packaging Industry Update
Ira Feldman welcomed about 100 attendees to MEPTEC’s December luncheon at SEMI Headquarters to hear Jan Vardaman, Founder and President...
GSA Awards Dinner celebrates 25 years of Recognizing the Best of the Semiconductor Industry
A few thousand semiconductor experts, including many high-level executives, got together on December 5, 2019, celebrate the Global Semiconductor Alliance’s...
Talking about Neural Networks and SoC Design Challenges
Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November...