HPC Drivers and Regionalization Means Steady Growth for Semi Capex and Capacity
Jun 09, 2025 · By Dean Freeman · 3D In Context, Blogs
Latest Posts
Artificial Intelligence is Driving Panel Level Packaging
An Intel engineer holds a test glass core substrate panel at Intel’s Assembly and Test Technology Development factories in Chandler,...
Meeting Sustainability Goals Hits Political and Technical Headwinds
Sustainability goals and efforts are starting to hit some headwinds in the world. In the United States the Trump administration...
Heterogenous Integration at ISS: A Key Part of High-Performance Compute
Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the...
Asia May Still Be the Hottest Spot for Advanced Packaging
When the United States and Europe looked to re-shore semiconductor technology, the primary focus was restoring leading-edge manufacturing and creating...
SEMI ISS 2025: Ready, Set, Ramp!
The semiconductor industry has been discussing breaching the 1 trillion-dollar mark as it was coming out of COVID-19 and amid...
3D Integration Themes Become a Reality at IEDM 2024
The Transistor Wars are back, but they look a little different this time. I’ve been attending the IEDM conference off...
Semiconductor Industry Forecast: Looking Forward to Balanced Growth in 2025
As the semiconductor industry moves into the last month of 2024, industry pundits are looking back and then looking forward...
Nuclear is Out. How Do We Solve the High Tech Sustainability Problem?
The past 2 weeks have been a whirlwind of activity in high tech sustainability. We’ve moved from using nuclear power...
The Funds Keep on Rolling for CHIPS for America R&D
The CHIPS Act continues to issue grants to help advance the United States position in semiconductor and advanced technology. Two...
My How the Pendulum Swings
Why the AI Energy Crisis is Driving Us back to Coal and Nuclear Energy When I was an undergrad in...
TSMC OIP 2024: Strong Partnerships Drive 3D Packaging
I have spent a considerable amount of time covering the technology associated with the front-, and back end of-the-line. So...
What is Causing the Semiconductor Workforce Paradox?
One of the challenges for the semiconductor industry over a significant time period has been finding workers who have the...
Now There Are Four
(2nm semiconductor manufacturing foundries) UMC started the semiconductor manufacturing foundry business in 1980, followed a few years later by TSMC....
SEMI’s Sustainability Startup Summit Round Three
If you watched the Summer Olympics in Paris, one of the challenges the Athletes faced was the temperature. With a...
SEMI Market Symposium: A Trillion Dollars is Still in Sight
Semicon West in July coincides with many analysts’ mid-year forecasts. The SEMI Market Symposium has long been a show staple,...
Sustainability and Semiconductors at SEMICON WEST 2024
SEMI has increasingly focused on sustainability and semiconductors in the past three years, growing from a few keynote talks at...
AI and VLSI
What do oxide transistors, ferroelectrics, 2-dimensional channel layers, CFETS, Advanced packaging, AI, and tradewinds have in common? They were all...
Sustainability is Busting Out all Over!
When prepping for this month’s sustainability blog, the song, June is Busting Out All Over, from Rogers and Hammerstein’s Carousel,...
Semiconductor Industry Collaboration is the Key
40 years ago in 1984, the semiconductor industry was in one of its many transitions. The USA had lost its...
