3D In Context

GSA Awards Dinner celebrates 25 years of Recognizing the Best of the Semiconductor Industry

GSA Awards Dinner celebrates 25 years of Recognizing the Best of the Semiconductor Industry

A few thousand semiconductor experts, including many high-level executives, got together on December 5, 2019, celebrate the Global Semiconductor Alliance’s (GSA) 25th Anniversary at the annual GSA Awards Dinner, which took place at the Santa Clara Convention Center. The purpose of the evening was to acknowledge and celebrate the semiconductor industry’s high achievers in about a dozen categori... »

Talking about Neural Networks and SoC Design Challenges

Talking about Neural Networks and SoC Design Challenges

Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November 13, 2019, two well-known industry experts, Anand Joshi and Tom Dillinger, addressed today’s hot topics —neural networks and System-on-Chip (SoC) design challenges — with short, but very informative presentations. Can We Build Neural Networks That Solve AI Chipset Power... »

Microtech Ventures brings a New MEMS and Sensors Summit to Town

Microtech Ventures brings a New MEMS and Sensors Summit to Town

From November 5 to 7, 2019, I had the opportunity to attend the inaugural MEMS and sensors focused Microtech Innovation Summit at the DoubleTree Hotel in San Jose. I have to admit, until recently I didn’t follow MEMS and sensors (M&S) and didn’t notice the broad and rapid market acceptance of these products (Figure 1). They capture real-world data – which is analog and multi-physics – ... »

3D VLSI Open Workshop Showcases 3D IC Supply Chain Capabilities  

3D VLSI Open Workshop Showcases 3D IC Supply Chain Capabilities  

Severine Cheramy, Director 3D Business Development, at CEA-Leti, recently brought key partners of Leti’s 3D-IC programs together at the 6th 3D VLSI Open Workshop to give an overview of their accomplishments and to demonstrate synergies between their joint efforts. The event took place in mid-October at The DoubleTree Hotel in San Jose. Leti and ST Microelectronics: Leaders in 3D VLSI Cheramy wel... »

MSEC 2019: MEMS and Sensors Have a Lot to offer for System Designers

MSEC 2019: MEMS and Sensors Have a Lot to offer for System Designers

At MSEC 2019 in San Diego, CA, MEMS and sensors experts gathered to exchange ideas about how to utilize the many strengths microelectromechanical systems (MEMS) and sensors to enhance the capabilities of electronic systems. Many focused on adding AI to their devices to provide higher-value solutions. »

keeping the world clean

Are You Keeping The World Clean for Your Children and Grandchildren?

Adjusting or repairing some of the sprinkler heads on my lot is a regular Spring duty for me. This year, when I was working on my front lawn, my 97-year old neighbor, a former doctor (MD), and the only original owner of one of the 70-year old homes on our street walked by. His 5-year old great-grandson accompanied him. It happened to be garbage day and earlier that day, I had lined up along the cu... »

Highlights from EDPS 2019

Highlights from EDPS 2019

The Electronic Design Process Symposium – EDPS 2919 – is known in the IC design community as a rather small (50 – 100 participants), but a highly interactive workshop. The 26th edition, hosted again this year by SEMI at its Milpitas headquarters, October 3-4, 2109 featured both EDPS IC design experts and a growing number of manufacturing experts, who presented and discussed the latest innova... »

Strategic Materials Conference Focuses on Complex Challenges

Strategic Materials Conference Focuses on Complex Challenges

Materials have a major impact on reliability, performance, cost and other key parameters of electronic solutions. SEMI’s recent Strategic Materials Conference (SMC 2019) brought materials suppliers and their customers together to discuss progress made in these areas. They also addressed how to solve the increasingly divergent and complex challenges current and future applications have in store f... »

Reaping the Benefits of a Design and Manufacturing Ecosystem

Reaping the Benefits of a Design and Manufacturing Ecosystem

As it does each year, TSMC recently brought 45 of its ecosystem partners together for its annual Open Innovation Platform® Forum to demonstrate to joint customers the value of a well-managed IC design and manufacturing ecosystem. TSMC and many of the partners presented recent accomplishments and explained in 33 technical papers how they support customers in today’s challenging markets for elect... »

A Look at US Investments in Heterogeneous Integration

A Look at US Investments in Heterogeneous Integration

The semiconductor industry is not only very capital-intensive, but investors experience very long payback times. Both limit the availability of private funding. If you are jealously looking at China and the billions of dollars they invest in semiconductors, I recommend you make a closer study of US investments in heterogeneous integration, and specifically DARPA. DARPA Heterogeneous Integration In... »

Page 1 of 10123»