Technology innovations don’t reach customers right away. It takes careful collaboration with the right partners to transform a new and innovative technology into high-value, customer-specific solutions. »
Because memory represents typically about half the silicon content of a system, and multi-die packages typically combine many memory devices with one or more logic dice, I made it a point to attend both Yole Développement’s Executive Memory Breakfast and The Flash Summit on August 6th. I, along with about 100 other industry executives, had to get up very early to make the 7 am breakfast meeti... »
Earlier this summer, 175 system-in-package (SiP) experts from all over the world met at the Marriott Hotel in Monterey’s Old Town at the IMAPS Advanced SiPs Conference. This conference focused exclusively on innovative SiP technology developments and trends, demonstrating that a significant part of the value creation is moving from the silicon to the package. Nozad Karim, VP: SiP/System Integrat... »
SEMICON West and the Electronic System (ES) Design West were, for the first time, co-located at the Moscone Center in San Francisco, from July 9 to 11, 2019. In addition to most keynotes, I reported about here, This blog talks about some in-depth technical presentations on test and the progress many companies made in support of “More than Moore” technology. The Test Vision Symposium The most i... »
Reporting from the SEMICON West keynote talks, Herb Reiter relays the perspectives of industry experts on everything from More than Moore, to hot topics and future technologies. »
Would you buy your next hotdog in parts, from un-coordinated suppliers? For example: Get the bun from a baker, the sausage from a butcher, mustard and/or ketchup and veggies from the nearest supermarket…? If yes, you may find the sausage being too small, the veggies too big for the bun, and, when you finally finished adding mustard/ketchup and start eating, you may “enjoy” a cold sausage o... »
Key advanced packaging technology influencers came out in force to discuss the status of EDA tools for 2.5D/3D IC package design at the recent User to User (U2U 2019) Conference, organized by Mentor, A Siemens’ Business and hosted at the Santa Clara Marriott. Presenters from Wave Computing, ARM, Amkor, TechSearch International Inc., and Qualcomm lent their voices to the cause. Technology T... »
In 1994 TSMC, a small wafer foundry from Taiwan held its first Technology Symposium. Since 1999 I have had the privilege to work with TSMC and closely follow their success in building a powerful and cost-effective ecosystem for the fabless IC vendors and foundry business model. To measure their success in hard numbers, please check IC Insights’ 2018 revenue estimates here and see that TSMC has a... »
The Microelectronics Packaging & Test Engineering Council (MEPTEC) held its monthly meeting at SEMI in Milpitas on April 10. Two speakers outlined their companies’ capabilities and demonstrated their own expertise in solving specific industry challenges. Tom Gregorich presented why and how Zeiss supports IC package inspection with 3D X-ray machines, then Sitaram Arkalgud conveyed the benef... »
From February 18 to 21, 2019, Monterey, CA, was again the venue for SEMI’s Flexible Hybrid Electronics (FLEX) and MEMS & Sensors Technical Congress (MSTC), conference. As in previous years, the joint keynotes, 2-track technical sessions, and more than 50 exhibitors demonstrated the synergies between these two industry segments and their fast pace of innovation. The entire conference focused ... »
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