EDPS 2020: An Inside Look at the Manufacturing-centric Presentations
Oct 12, 2020 · By Herb Reiter · 3D In Context, Blogs, Design
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ISES 2020 Highlights Asia’s Advanced IC Packaging and HI Capabilities
Several decades ago, Asia began its quest to be a reliable and cost-effective IC packaging, assembly, and test partner for...
DAC 2020 Addresses Chiplet Design and Integration
In the early days of ASIC technology, only logic library elements and basic I/Os with up to 10s of transistors...
TechSearch Presentation Highlights Key Developments in Advanced Packaging
In a recent MEPTEC / iMAPS webinar, Jan Vardaman, President, and Founder of TechSearch International presented growth drivers for advanced packaging...
3D ICs Tear Down the Dreaded Memory Wall and Save Power
About 50 years ago, I started my career as a system-level designer, focused on an interface card for the Siemens...
FCC-approved BLE and LoRa module includes Antenna in Package
In engineering school, I learned that different laws of physics apply when the widely used electricity with 50/60 Hertz gets...
An EDA Perspective on Today’s Advanced Packaging
In my alliance management roles at electronic design automation (EDA) companies, I arranged many presentations to convey the benefits of...
ECTC 2020 Online is Accessible at No Charge
When I switched my focus from single-die SoCs to multi-die ICs, I had to learn a lot about IC packaging...
EDA and the Heterogeneous Integration Roadmap
In Austria, where I grew up, homes get passed on from generation to generation. Like many Austrians, I had a...
Modeling, Simulation and Test for Multi-die IC Designs
On May 20 MEPTEC’s Executive Director, Ira Feldman, moderated another informative MEPTEC & iMAPS webinar. Two Knowledgeable speakers from Ansys...
Practical Advice for Working Remotely in the 21st Century
This is a brief summary of SEMI’s third webinar in the “Work & Life in the 21st Century” series, broadcast...
Covid-19: The Way Forward for Semiconductor Success
In 2002, the first consulting client for my newly founded eda2asic consulting company was Synplicity, located in Sunnyvale. They focused...
Handel Jones: The Road to Recovery from Covid-19
Covid-19 has created unprecedented problems for health and economies worldwide. Executives must make now important and often very difficult decisions...
Dr. Wally Rhines Talks About the Semiconductor Industry’s Future
As long as the “social distancing” requirement is in force, you won’t see me in person at conferences or any...
Geopolitics and Manufacturing: A Changing Landscape
At the March 11 MEPTEC Luncheon at SEMI, Paul Pickering, Managing Director at Microtech Ventures, braved, together with a rather...
FLEX/MSTC 2020: Change has Never Been So Fast…
SEMI, together with FlexTech, the MEMS & Sensors Industry Group, the Nano-Bio Materials Consortium (NBMC) and NextFlex, held FLEX/MSTC 2020...
Is The HIR the Best Path to Increased Revenues?
The 3rd Annual Heterogeneous Integration Roadmap (HIR) Symposium confirms it: Heterogeneous Integration is the best way for the semiconductor industry...
Has Google Discovered the Advantages of Advanced IC Packaging Technologies?
At the latest MEPTEC Luncheon, held February 5, 2020, and hosted by SEMI at its Milpitas HQ, Google’s Dr. Preeti...
Big Data, Speed and Security Dominate DesignCon 2020
About 5000 attendees, as well as more than 200 exhibitors, took over the entire Santa Clara Convention Center from January...
ISS 2020: How to Win in Our Data-driven World – Part 2
In Part 1 of my ISS 2020 blog, I described Monday’s opening keynote by LAM’s CTO, Richard Gottscho. He explained...