Recommended Reads

3D-printed Micro-scaffold Cochlear Implant May Reduce Residual Hearing Damage

Jan 22, 2020 | I-Micronews

Based on Nanoscribe’s 3D Microfabrication technology, scientists developed a 3D-microscaffold cochlear implant for steroid elution. For the first time, scientists combined a highly precise, porous 3D printed steroid reservoir with a 2D MEMS-based electrode array to fabricate a novel cochlear implant. This implant is designed to reduce the damage of residual hearing against electrode insertion […]

Dealing With ECOs In Complex Designs

Jan 22, 2020 | SemiEngineering

How corners and multiple changes to designs can slow time to market. The post Dealing With ECOs In Complex Designs appeared first on Semiconductor Engineering.

Episode 251: Here’s what people at CES said about CHIP

Jan 17, 2020 | IOT Podcast

This week’s show was dedicated to a wrap up of CES 2020. Kevin and I shared how the show has changed in the last 15 years, talked about technology for Boomers, the Withings ScanWatch and ran through several new maker boards. We covered the $2 Wemos W600-PICO board, a new Arduino board for industrial use […]

Electrification & Autonomy: Another (R)evolution for the Automotive Sector? – iMicronews

Jan 17, 2020 | I-Micronews

The automotive industry is facing a downturn in car sales – this is accepted reality. The industry’s difficulties are partly linked to the political tension between China & USA, Brexit and the severe ecological regulations in Europe. These occurrences are global drivers that the automotive industry cannot predict or control but must live through. The […]

SEMI 3D & Systems Summit Keynotes Spotlight 5G, HPC and System-in-Package Innovations – Semiconductor Digest

Jan 17, 2020 | Semiconductor Digest

Top experts in 3D integration and systems for semiconductor manufacturing applications will gather at the SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in 5G, High-Performance Computing (HPC), Heterogeneous Integration, 3D Roadmap and System-In-Package technologies. Global thought leaders from ASE Group, Huawei Technologies, TSMC and TechSearch […]

Uses And Limitations Of AI In Chip Design

Jan 15, 2020 | SemiEngineering

OneSpin’s CEO explains what’s changing in AI, where it’s being used, and what still has to be fixed. The post Uses And Limitations Of AI In Chip Design appeared first on Semiconductor Engineering.

Semiconductor Materials Growing to Nearly $50B Market in 2020 After Downturn

Jan 15, 2020 | Semiconductor Digest

TECHCET—the electronic materials advisory services firm providing business and technology information— announced that global revenues for semiconductor manufacturing and packaging materials are expected to grow 5.7% year-over-year (YoY) in 2020 to US$49.5B, of which 65% represents semiconductor fab materials. The post Semiconductor Materials Growing to Nearly $50B Market in 2020 After Downturn appeared first on […]

China in 2020: Navigating the new policy landscape

Jan 13, 2020 |

Image Removed This is the fourth of a four part series Many companies saw 2019 as a year when more and more regulations piled on to them. CEOs who were the legal representative for their company in China got increasingly nervous as legal teams updated them on their personal responsibility under new regulations. Unfortunately for… […]

2020 The Year of Live In-Car Remote Assistance

Jan 13, 2020 |

Image Removed After years of travel and computing remotely while on the road I have found that there are two magical experiences for the business traveler. One of those experiences is the hotline support I get from my preferred airline – United. The other is the live remote assistance I periodically receive from my company’s in-house… Read […]