Recommended Reads

Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification – SemiWiki

May 15, 2024 |

2.5D and 3D ICs present special challenges since these designs contain multiple chiplets of different materials integrated in all three dimensions. This complexity demands full assembly verification of the entire stack, considering all the subtle electrical and physical interactions of the complete system. Identifying… Read More The post Siemens EDA Makes 3D IC Design More […]

ICYMI: The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law

May 10, 2024 | 3D InCites Podcast

This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging. Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company,  IBM and Hemanth Dhavaleswarapu of AMD, about […]

SEMI ISS Europe Panel: Empowering Semiconductor Excellence in Europe

May 03, 2024 | 3D InCites Podcast

In this episode, recorded live at SEMI ISS Europe, Françoise von Trapp hands over the mic to SEMI Europe President, Laith Altimime, who leads a discussion on the European chip industry’s growth and challenges, and whether the European Chips Act will strengthen Europe towards its 20% vision goal.   Panelists include: Manfred Horstmann, GM and […]

Enabling Imagination: Siemens’ Integrated Approach to System Design – SemiWiki

May 01, 2024 |

In today’s rapidly advancing technological landscape, semiconductors are at the heart of innovation across diverse industries such as automotive, healthcare, telecommunications, and consumer electronics. As a leader in technology and engineering, Siemens plays a pivotal role in empowering the next generation … Read More The post Enabling Imagination: Siemens’ Integrated Approach to System Design appeared […]

Anirudh Keynote at CadenceLIVE 2024. Big Advances, Big Goals – SemiWiki

May 01, 2024 |

The great things about CEO keynotes, at least from larger companies, is that you not only learn about recent advances but you also get a sense of the underlying algorithm for growth. Particularly reinforced when followed by discussions with high profile partner CEOs on their directions and areas of common interest. I saw this recently… […]

IMAPS Global Business Council: Repatriating the U.S. Semiconductor Ecosystem

Apr 26, 2024 | 3D InCites Podcast

This episode was recorded live at IMAPS DPC, where the Spring version of the Global Business Council focused on Geopolitics Fueling the Repatriation of the Semiconductor Ecosystem. To get the complete picture of the collaboration happening, Françoise von Trapp speaks with representatives of the government, industry, and academia. Dan Berger,  National Advanced Packaging Manufacturing Program […]

Conversations with the Winners of the 2024 3D InCites Awards

Apr 21, 2024 | 3D InCites Podcast

This episode features the winners of this year’s 3D InCites Awards. These included five technology enablement awards, one sustainability award, the Adele Hars Award for DEI, and an award for Best Place to Work. Nils Anspach, of LPKF & Laser Electronics, explains the company’s laser-based deep etching technology for glass substrates in heterogeneous integration, and […]

Member Spotlight: IMAPS Devices Packaging Conference Celebrates 20 Years

Apr 12, 2024 | 3D InCites Podcast

This episode was recorded live at the IMAPS Device Packaging Conference – helping celebrate the event’s 20th year. The record turnout included many of our 3D InCites Community members. Françoise von Trapp spoke with several of them who were exhibiting and presenting, and in some cases, simply attending. Alex Ospina of ACM Research discussed the […]