Recommended Reads

SEMICON Europa Member Spotlight: Conversations about the EU & US Chips Act and What’s New

Dec 01, 2022 | 3D InCites Podcast

In this episode, recorded live at SEMICON Europa in Munich the week of November 14-18, 2022, Françoise von Trapp speaks with 3D InCites member companies that either exhibited, presented, or in some cases, both, at the event. Conversations range from discussions about this year’s event compared with the 2021 show, the impact of the respective […]

Chip Sandwich: Electronics Chip & Photonics Chip Co-Optimized To Work Together (CalTech/Univ. of Southampton) – SemiEngineering

Dec 01, 2022 | SemiEngineering

A technical paper titled “A 100-Gb/s PAM4 Optical Transmitter in a 3-D-Integrated SiPh-CMOS Platform Using Segmented MOSCAP Modulators” was published by researchers at CalTech and University of Southampton. “The resulting… » read more The post Chip Sandwich: Electronics Chip & Photonics Chip Co-Optimized To Work Together (CalTech/Univ. of Southampton) appeared first on Semiconductor Engineering.

Is UCIe Really Universal? – SemiEngineering

Nov 23, 2022 | SemiEngineering

Why developing a multi-vendor standard for plug-and-play chiplets is so difficult. The post Is UCIe Really Universal? appeared first on Semiconductor Engineering.

Plasma-Therm’s Grenoble Site Made EMEA HQ – Semiconductor Today

Nov 18, 2022 | Semiconductor Today

Plasma-Therm LLC of St Petersburg, FL, USA (which makes plasma-process equipment for the semiconductor and compound semiconductor markets) says that its site in Grenoble, France will serve as regional headquarters to support customers in central Europe, Middle East and North Africa (EMEA) markets focused on developing power, wireless, memory, sensor and MEMS, and other advanced […]

Wall Street View Of EDA Industry – SemiEngineering

Nov 18, 2022 | SemiEngineering

The impact of hardware-assisted verification and the growth of semiconductor R&D spending on EDA fortunes. The post Wall Street View Of EDA Industry appeared first on Semiconductor Engineering.

EDA 2.0: Catalyzing the Human – EE Times

Nov 10, 2022 | EE Times

Chips are getting more complex; that’s a given. Whether it’s for enabling more computing performance in less space or embedding more intelligence into sensors and endpoint devices, designs are becoming more sophisticated; require more design expertise to optimize for power, performance, and area (PPA); and take longer for the whole design cycle, which includes verification […]

A Conversation with Beth Keser About Writing A Book on Advanced Fanout Wafer Level Packaging

Nov 10, 2022 | 3D InCites Podcast

In this episode, Françoise speaks with Beth Keser, Ph.D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging […]

A Conversation about Addressing Material Challenges for Electric Mobility Technology

Nov 03, 2022 | 3D InCites Podcast

According to the International Energy Agency, road transportation accounts for 16% of global emissions. Electric vehicles are the key technology to decarbonize this. The EIA estimates that EVs will account for 13% of new cars sold in 2022. Many countries are setting goals to eliminate combustion engine cars to reach Net Zero emissions by 2050. […]

The IMAPS DEI Panel Discusses the Difference between Equality and Equity

Oct 27, 2022 | 3D InCites Podcast

For this episode, recorded during the IMAPS International Symposium, Françoise von Trapp hands over the mike to Robin Davis, of 3D InCites Member company, Deca. Davis organized and moderated a Diversity, Equity, and Inclusion town hall discussion during IMAPS, on the topic of Equality vs. Equity. A distinguished panel of industry veterans shared their perceptions […]