Recommended Reads

Advancing Autonomous Vehicles Is All in the Eyes – EE Times

Apr 07, 2020 | EE Times

One of the most vital areas of development for semi- and fully-autonomous vehicles is driver gaze and eye tracking, but there are several implementation challenges facing designers. The post Advancing Autonomous Vehicles Is All in the Eyes appeared first on EETimes.

Silicon is Reaching its Limit. What’s Next? – iMicronews

Apr 07, 2020 | I-Micronews

Written by Marissa Lee for The Business Times – The world’s energy demands are rising and the search for better power efficiency is spurring new interest in gallium nitride as a successor to silicon semiconductors. Singapore should take advantage of this trend. IF cities are truly high-tech, why can’t we drive electric cars up to […]

COVID-19 Tech Bits – SemiEngineering

Apr 07, 2020 | SemiEngineering

Tech fights COVID-19 with AI, 3D printing, supercomputers, simulation & wearables The post COVID-19 Tech Bits appeared first on Semiconductor Engineering.

Systems and Bodies on Chip – Amelia’s Fish Fry

Apr 02, 2020 | Amelia’s Weekly Fish Fry

In this week’s Fish Fry podcast, we take on systems on chips, body on chips, and much more!  First up, we check out how Havard’s Wyss University is hoping to change the future of modern drug development and approval. We take a closer look at how this team has pieced together ten “Organ Chips” to […]

MEMS in the Fight Against Covid-19 – EE Times

Apr 01, 2020 | EE Times

The race against time to fight the Covid-19 pandemic has motivated a global flurry of activity and collaboration by technology companies. The post MEMS in the Fight Against Covid-19 appeared first on EETimes.

Wafer Level Packaging Reaches New Heights – iMicronews

Mar 31, 2020 | I-Micronews

WLP will definitely be a winner by 2025, declared Yole Développement (Yole) in its new Advanced Packaging Quarterly Market Monitor. $2.5B will be the market figure to remember as it will be Fan-out (FO) package revenue by 2025. Behind this data, there is TSMC’s strategy to drive fan-out for 5G applications. In parallel, fan-in WLCSP […]