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Fab tools are being fine-tuned for through-silicon via processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging. The post What’s Next For TSVs appeared first on Semiconductor Engineering.
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China’s chip overcapacity prompts U.S. investigation as mature-node foundries face new competition. The post Mature-Node Foundries Face Overcapacity from China appeared first on EE Times.
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Send us a text Unlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel’s Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving demands of AI, machine learning, and […]
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A response to Daniel Nenni’s “What’s Wrong with Intel?” article, which invited alternative views. At the risk of calling down the forecast universal opprobrium, I’m going to disagree with Dan’s take on the centrality of Intel. I don’t agree that Intel is too big/important to fail or that the US can’t succeed in semiconductors without… […]
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Lam’s Dextro cobot aims to optimize wafer fab maintenance, enhancing precision and reducing errors. The post Fab Maintenance Gets a Robotic Helping Hand appeared first on EE Times.
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Send us a text This episode was recorded live at SEMICON Europa. Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies. They discuss the transition from 2D to 3D measurements in semiconductor manufacturing. Zahn explains why non-destructive, optical […]
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Fujitsu’s Monaka is a monstrous processor with four 2nm compute chiplets, 5nm SRAM, and a massive 5nm IO die. This time, without HBM memory.
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Comprehensive testing is needed to ensure that chiplet systems can withstand extreme conditions. The post Automakers And Industry Need Specific, Extremely Robust, Heterogeneously Integrated Chiplet Solutions appeared first on Semiconductor Engineering.
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Send us a text This episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence, ERS Electronic, KLA, and Semilab. It also features updates from Comet Yxlon, Trymax Semiconductor, and DSV-IMS. SEMI Europe’s 20 Under 30 program recognizes future leaders in the microelectronics […]
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The US and China trade blows yet again on semiconductor products and minerals, but Chinese companies say they’ll survive.
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Intel CEO Pat Gelsinger departs amid major changes; Intel seeks new leader. The post Intel Will Never Find Another Gelsinger, But Do They Want One? appeared first on EE Times.
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Send us a text In this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe’s technical sovereignty, and how implementing digital twins can help achieve this goal. John Behnke, of Inficon, discussed the evolution of smart manufacturing in the semiconductor industry. […]
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Design and AI companies are using a range of tools to help graduates become productive more quickly. Some are feeding their requirements directly to university. The post How Companies Onboard Graduates And Shape University Curricula appeared first on Semiconductor Engineering.
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Third-party chiplets are hitting the market as chiplet models evolve. Who’s calling the shots isn’t clear yet. The post Top-Down Vs. Bottom-Up Chiplet Design appeared first on Semiconductor Engineering.
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Qualcomm is not interested in buying Intel anymore but could consider separate parts of it.
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Send us a text This episode was recorded live at SEMICON Europa in Munich. This year’s theme of this year’s conference is “Innovation and Collaboration: Powering Sustainable Exponential Growth”. In other words, how the semiconductor industry can work together to sustainably reach the trillion dollar goal by 2030 without compromising its Net Zero goals. It’s […]
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Companies must join scholarship schemes to build a skilled workforce and combat talent shortages. The post Scholarship Scheme May Provide Solution for Talent Shortage appeared first on EE Times.
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Challenges and options vary widely depending on markets, workloads, and economics. The post One Chip Vs. Many Chiplets appeared first on Semiconductor Engineering.
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Send us a text It’s been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline […]
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The CHIPS and Science Act has allocated $11 billion for semiconductor R&D, including for advanced packaging and AI-driven design. Companies should apply now. In 2022, the United States signed the $50 billion Chips and Science Act. Under the act, the National Institute of Standards and Technology (NIST), which is part of … Read More The […]
