Recommended Reads

System-in-Package industry: IDMs, OSATs, and Foundries are taking the Advantage – iMicronews

Jul 22, 2021 | I-Micronews

Through enabling design and supply chain agility, SiP will reach more than $19B by 2026. “SiP has become synonymous with technologies ranging from high-end die-to-die chiplet-type advanced integration to devices found in mobile handsets with increased integration and functionality leveraging best-in-class advanced packaging processes.” asserts Vaibhav Trivedi, Senior Technology & Market analyst, Packaging, within the […]

Advanced Packaging Technologies Overcoming the Memory System Performance and Capacity Limitation – EE Times

Jul 21, 2021 | EE Times

In the relentless pursuit to increase performance while reducing size, the semiconductor industry is exploring every avenue possible. Packaging, the process of combining different parts of a component, provides a promising area for advancements. An expert from SK hynix offers insights on how new packaging technologies, such as TSV (through-silicon via), are helping create smaller, […]

A brave new MEMS world: a $18.2B market by 2026 – iMicronews

Jul 15, 2021 | I-Micronews

The MEMS market will grow due to new opportunities in audio for microphones, microspeakers and inertial MEMS, AR/VR for optical MEMS, and other emerging applications. “Last year when COVID-19 erupted, the effects on various industries were felt immediately, which in turn had an after-effect on the MEMS business. But the crisis did not impact all […]

Will Electrification Mean the End of the Road for Automotive MEMS Pressure Sensors? – iMicronews

Jul 01, 2021 | I-Micronews

The dominance of MEMS pressure sensors in the automotive market may be under threat as the industry moves to replace Internal Combustion Engine (ICE) vehicles with EVs. Electrification will reduce many ‘traditional’ application areas in hybrid models and eliminate them altogether in fully electric vehicles. The market research and strategy consulting company, Yole Développement (Yole) […]

Member Spotlight: A Conversation about Novel Nano-Coating Technology and Collaboration

Jul 01, 2021 | 3D InCites Podcast

In this first Member Spotlight episode,  we have a conversation with  Zia Karim, Yield Engineering Systems, and Mie Lillethorup, RadiSurf about their collaboration to bring unique nanotech-based surface enhancement materials from the lab to the fab. What’s exciting about these materials and processes is the potential they hold for simplifying both temporary and permanent wafer […]

Supply Chain Resiliency – SemiEngeering

Jun 30, 2021 | SemiEngineering

The potential risks of an unsecured supply chain and how to achieve supply chain security through tools, testing, and/or professional services. The post Supply Chain Resiliency appeared first on Semiconductor Engineering.

Business Collaboration to Launch an EV Battery Swapping Service – iMicronews

Jun 22, 2021 | I-Micronews

ENEOS Holdings, (CEO: Katsuyuki Ota, hereinafter referred to as “ENEOS”) and Ample, (CEO: Khaled Hassounah, President: John de Souza, hereinafter referred to as “Ample”), a U.S-based startup that ENEOS invested in, are announcing a business collaboration to launch an EV battery swapping service in Japan. Through this partnership, both companies aim to develop an energy […]

5 Key Vulnerabilities in the Semiconductor Supply Chain – Semiconductor Digest

Jun 22, 2021 | Semiconductor Digest

There’s an ongoing push to strengthen the semiconductor supply chain, but making gains in that area is not as straightforward as some people initially believed. Here are five of the top vulnerabilities for the semiconductor sector to solve. The post 5 Key Vulnerabilities in the Semiconductor Supply Chain appeared first on Semiconductor Digest.

A Conversation with Bharat Kapoor about Creating a Resilient Semiconductor Supply Chain

Jun 22, 2021 | 3D InCites Podcast

In this episode, Françoise interviews Bharat Kapoor, lead partner, Americas, at Kearney. a global strategy and management consulting firm, where he founded and leads PERLab, the firm’s design innovation service. Bharat has solid roots in semiconductor engineering and design. His interest in electrical engineering began in his hometown in the Himalayas when he was in […]

Packaging Highlights of the TSMC Technology Symposium 2021 – SemiWiki

Jun 14, 2021 |

The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings. General 3DFabricTM Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric. 2.5D package technology – CoWoS The 2.5D packaging options are divided into the CoWoS… Read More The post Highlights of the TSMC […]

TSMC dominates the Fan-Out market: ASE and Others are Catching Up – iMicronews

Jun 10, 2021 | I-Micronews

TSMC’s Fan-Out success with Apple and high-performance computing are pushing Intel, Samsung, ASE, and all other competitors to find new innovative solutions. “As part of advanced packaging, FO solutions have become critical and effective for foundries and IDMs, increasing device performance and bandwidth and reducing the gap between Silicon and substrate.” asserts Stefan Chitoraga, Technology […]

Why are TSMC and ASE Competing to Protect Their Positions in UHD FO? – iMicronews

Jun 10, 2021 | I-Micronews

Ultra-High-Density Fan-Out (UHD FO) Packaging has started to be commercialized in the market. This advanced packaging market segment has been deeply analyzed by Yole Développement (Yole) and the advanced packaging team with a dedicated report, Fan-Out WLP and PLP Applications and Technologies 2021. In this new technology & market report, the market research & strategy […]

TSMC’s Zhang: Automotive is Going HPC – EE Times

Jun 03, 2021 | EE Times

TSMC said its customers are looking for high performance computing to support autonomous driving in vehicles. That’s new. And also old. The post TSMC’s Zhang: Automotive is Going HPC appeared first on EETimes.