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Send us a text A semiconductor wafer travels around the globe five times on average before becoming the chip in your smartphone. Each journey represents a potential risk to device reliability that few consumers—or even industry professionals—ever consider. Behind every high-performing semiconductor device lies a carefully orchestrated logistics operation ensuring these sensitive components arrive intact […]
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Tool chains need improvement as chipmakers begin stacking AI chips, increasing the thermal density and unpredictability over time. The post How To Cool 3D-ICs appeared first on Semiconductor Engineering.
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TSMC’s decision to implement unprecedented price hikes will end the era of cheap transistors. The post TSMC Price Hikes End the Era of Cheap Transistors appeared first on EE Times.
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Multi-physics simulation and new reflow options help keep a lid on warpage. The post Mitigating Warpage In Multi-Chiplet Systems appeared first on Semiconductor Engineering.
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Nvidia has released a statement to make it clear that, no matter what deals it does with companies to provide hardware or take an equity stake in their business, it will ensure all companies have equal access to next-generation GPU hardware.
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Equipment makers pitched their role in India’s chip push as the country’s packaging ambitions take shape. The post Advanced Chip Packaging Tools Are New Battleground in India appeared first on EE Times.
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Send us a text SEMI's flagship event, SEMICON West, is moving to Phoenix, Arizona this October 7-9, 2025, after 35 years in San Francisco, coinciding with the region's semiconductor manufacturing boom and $200 billion in announced investments. In this episode, Françoise speaks with SEMI Americas president, Joe Stockunas, who shares reasons for the move and […]
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AI, geopolitics, and the increased need for collaboration are reshaping the chip industry. The post Lessons From 30 Years In The Trenches On The Future Of Semiconductor Manufacturing appeared first on Semiconductor Engineering.
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Semicon India 2025 marked the signing of twelve MoUs between startups, government bodies, and multinationals. The post Semicon India 2025: PM Modi Maps Vision To Target Global Chip Industry appeared first on EE Times.
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Send us a text The IMAPS International Symposium returns to the Town & Country Resort in San Diego from September 29-October 2, 2024, featuring restructured technical tracks, new Monday panel discussions, and exciting networking events including a special reception aboard the USS Midway aircraft carrier. General Chair Benson Chan and outgoing IMAPS President Erica Folk […]
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What changes are needed to stack 24 layers of high-bandwidth memory. The post Challenges In Stacking HBM appeared first on Semiconductor Engineering.
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New orders show growth, but production and employment remain challenged amid persistent tariff impacts. The post Manufacturing Contraction Slows in August appeared first on EE Times.
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Send us a text X-ray technology reveals what the naked eye cannot see – the intricate world of semiconductor interconnects that power our digital lives. In this deep dive with Ben Peecock, Senior Director of Business Development at Nordson Test and Inspection, we uncover the critical differences between x-ray inspection and metrology that keep semiconductor […]
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In an era dominated by artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC), the demand for semiconductors that deliver high data throughput, low latency, and energy efficiency has never been greater. Traditional chip designs often struggle to keep pace with these requirements, leading… Read More The post Revolutionizing Chip Packaging: The Impact of […]
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The Global Advanced Chip Packaging Market is estimated to be valued at USD 50.38 billion in 2025 and is expected to reach USD 79.85 billion by 2032, exhibiting a compound annual growth rate (CAGR) of 6.8% from 2025 to 2032. Advanced Chip Packaging Market Size Projected to Grow $79.85B By 2032 was posted by Shannon Davis […]
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The new version of the UCIe standard has enhanced the data rate for chiplets to answer demand from bandwidth-hungry applications The post UCIe 3.0 Doubles Data Rate For 2D Chiplets appeared first on EE Times.
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Americans are footing the bill for the sheer amount of electricity required to operate the data centers responsible for providing access to AI tools and services.
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TSMC is probing an alleged leak of 2nm process integration images to Japan’s Rapidus, though the data’s content, impact, and Rapidus’s involvement remain uncertain.
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The flip side of Intel’s massive layoffs is the formation of startup companies aiming to explore new design frontiers. The post The Bright Side of Intel Exodus: Chip Startups appeared first on EE Times.
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Send us a text Thailand is positioning itself as a new hotspot for semiconductor and microelectronics manufacturing, building on existing infrastructure and establishing key partnerships throughout the region. Managing editor Jillian McNichol shares insights from her recent trip to Thailand where she toured facilities and interviewed industry leaders about the country’s ambitious plans. • Thailand […]
