|
Semiconductor industry can embrace sustainability by reducing consumption, addressing supply chain, and promoting circularity. The post Can the Semiconductor Industry Get Serious About Sustainability? appeared first on EE Times.
|
Send us a text The race toward more powerful AI carries a hidden cost that’s becoming impossible to ignore: skyrocketing energy consumption. Did you know AI is projected to devour 10% of global electricity by 2030? This staggering figure has even forced tech giants to delay their sustainability goals. Enter ASE’s Executive Vice President Yin […]
|
It’s 2025 and the U.S. is awash in semiconductor manufacturing investments, from TSMC’s landmark $100 billion, five-facility plan announced in March to GlobalWafers’ recent $4 billion capital infusion. As more global chip giants set their sights on American capabilities, U.S. semiconductor manufacturing capacity is poised to triple from 2022 to 2032. But there’s a big […]
|
President Trump announced that starting August 1, the U.S. will impose a 25% tariff on all imports from Japan and South Korea, which threatens to disrupt global tech supply chains dominated by these countries.
|
Agentic AI design and 3D-ICs, multi-die, and chiplets were a key part of this year’s DAC – The Chips to Systems Conference. The post DAC 2025: Agentic AI In EDA Is Just Getting Started, And Chiplets Are All The Rage appeared first on EE Times.
|
Neuromorphic computing, which mimics architecture of brain, could support growing energy demands of AI. How Can AI Be More Energy Efficient? UB Researchers Look to Human Brain For Inspiration was posted by Shannon Davis on Semiconductor Digest.
|
For decades, semiconductor development has operated on a consistent, 24- to 36-month design development cycle. While this model worked well when compute requirements were less demanding and innovation moved at a more manageable pace, AI has created a new set of rules. The breakneck speed of AI development is quickly exceeding the capabilities of current-generation […]
|
Send us a text The 75th anniversary celebration of ECTC in Dallas showcases a remarkable evolution in advanced packaging technologies, revealing how semiconductor priorities have dramatically shifted. Rather than the relentless miniaturization of the smartphone era, today’s AI-driven applications demand larger packages with more functionality and sophisticated thermal management solutions. Glass core substrates emerged as […]
|
Executive Outlook: Just because the various components in an advanced package work individually and separately doesn’t mean they will work post-assembly. The post Can You Build A Known-Good Multi-Die System? appeared first on Semiconductor Engineering.
|
Elon Musk’s AI startup xAI is rapidly burning through cash — spending $1 billion a month and projecting $13 billion in losses for 2025 — as it races to build massive AI infrastructure and catch up with rivals.
|
Send us a text What happens when the world’s thirst for artificial intelligence collides with physical limitations? The answer lies at the intersection of silicon innovation and packaging technology. From the conference hall of ECTC 2025 in Dallas, we’re joined by Sam Naffziger of AMD who reveals how AI has transformed from a peripheral topic […]
|
We reflect on some of the highlights of the week in the electronics industry. The post Assessing CHIPS Acts Value, Tariffs and Semi Equipment Growth appeared first on EE Times.
|
TSMC’s $165 billion U.S. investment gets speed boost
|
Send us a text What happens when you gather 75 years of packaging innovation under one roof? The Electronic Component Technology Conference (ECTC) has transformed from a modest gathering of 300 electronics professionals to a powerhouse event attracting over 2,500 industry leaders, researchers, and visionaries. This remarkable journey reflects how advanced packaging has evolved from […]
|
TSMC is preparing to begin 2nm chip production with wafer prices reportedly reaching $30,000 and potentially $45,000 for more advanced nodes like A16, driven by the complexity of backside power delivery.
|
Canada’s chip sector faces supply chain challenges; collaboration and innovation are key. The post Supply Chain Uncertainty Hits Canada’s Chip Sector appeared first on EE Times.
|
Send us a text Pratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore’s Law slows, requiring closer integration between chip and package design to maximize performance. • Traditional chip design treated packaging as an afterthought with designers “throwing designs over the wall” • Economic realities of advanced nodes mean companies now pay […]
|
Chipmakers TSMC, Intel and Micron publicly replied to a U.S. Department of Commerce inquiry on the national-security impact of tariffs. The post Chip Industry Warns U.S. Tariffs, Bans Could Halt Growth appeared first on EE Times.
|
Shift-left pattern-based methods help automotive IC teams verify earlier, speed time-to-market, improve quality, and boost product reliability. The post Get More Reliable Automotive ICs with a Shift Left Design Approach appeared first on EE Times.
|
Send us a text Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they’re improving semiconductor manufacturing quality. • X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality • Traditional 2D radiographic imaging is being replaced by 3D […]
