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The demand for higher performance, greater configurability, and more cost-effective solutions is pushing the industry toward heterogeneous integration and 3D integrated circuits (3D ICs). These solutions are no longer reserved for niche applications—they are rapidly becoming essential to mainstream semiconductor design.… Read More The post Enabling the Ecosystem for True Heterogeneous 3D IC Designs appeared […]
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Monolithically integrating indium arsenide (InAs) quantum dot (QD) lasers directly onto chiplets paves the way for photonic chips. The post Paving the Way for Integrated Photonic Chips appeared first on EE Times.
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The decision to create a multi-die SiP introduces a hierarchy of interconnect technologies into the system design. The post A System Architect’s Guide to Multi-Die Interconnect appeared first on EE Times.
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As uncertainty continues to swirl under the Trump administration, Canada’s semiconductor companies look to diversify trading partners. The post U.S. Tariffs Push Canada’s Chip Sector to Collaborate Abroad appeared first on EE Times.
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Semiconductor industry can embrace sustainability by reducing consumption, addressing supply chain, and promoting circularity. The post Can the Semiconductor Industry Get Serious About Sustainability? appeared first on EE Times.
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Send us a text The race toward more powerful AI carries a hidden cost that’s becoming impossible to ignore: skyrocketing energy consumption. Did you know AI is projected to devour 10% of global electricity by 2030? This staggering figure has even forced tech giants to delay their sustainability goals. Enter ASE’s Executive Vice President Yin […]
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It’s 2025 and the U.S. is awash in semiconductor manufacturing investments, from TSMC’s landmark $100 billion, five-facility plan announced in March to GlobalWafers’ recent $4 billion capital infusion. As more global chip giants set their sights on American capabilities, U.S. semiconductor manufacturing capacity is poised to triple from 2022 to 2032. But there’s a big […]
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President Trump announced that starting August 1, the U.S. will impose a 25% tariff on all imports from Japan and South Korea, which threatens to disrupt global tech supply chains dominated by these countries.
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Agentic AI design and 3D-ICs, multi-die, and chiplets were a key part of this year’s DAC – The Chips to Systems Conference. The post DAC 2025: Agentic AI In EDA Is Just Getting Started, And Chiplets Are All The Rage appeared first on EE Times.
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Neuromorphic computing, which mimics architecture of brain, could support growing energy demands of AI. How Can AI Be More Energy Efficient? UB Researchers Look to Human Brain For Inspiration was posted by Shannon Davis on Semiconductor Digest.
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For decades, semiconductor development has operated on a consistent, 24- to 36-month design development cycle. While this model worked well when compute requirements were less demanding and innovation moved at a more manageable pace, AI has created a new set of rules. The breakneck speed of AI development is quickly exceeding the capabilities of current-generation […]
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Send us a text The 75th anniversary celebration of ECTC in Dallas showcases a remarkable evolution in advanced packaging technologies, revealing how semiconductor priorities have dramatically shifted. Rather than the relentless miniaturization of the smartphone era, today’s AI-driven applications demand larger packages with more functionality and sophisticated thermal management solutions. Glass core substrates emerged as […]
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Executive Outlook: Just because the various components in an advanced package work individually and separately doesn’t mean they will work post-assembly. The post Can You Build A Known-Good Multi-Die System? appeared first on Semiconductor Engineering.
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Elon Musk’s AI startup xAI is rapidly burning through cash — spending $1 billion a month and projecting $13 billion in losses for 2025 — as it races to build massive AI infrastructure and catch up with rivals.
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Send us a text What happens when the world’s thirst for artificial intelligence collides with physical limitations? The answer lies at the intersection of silicon innovation and packaging technology. From the conference hall of ECTC 2025 in Dallas, we’re joined by Sam Naffziger of AMD who reveals how AI has transformed from a peripheral topic […]
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We reflect on some of the highlights of the week in the electronics industry. The post Assessing CHIPS Acts Value, Tariffs and Semi Equipment Growth appeared first on EE Times.
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TSMC’s $165 billion U.S. investment gets speed boost
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Send us a text What happens when you gather 75 years of packaging innovation under one roof? The Electronic Component Technology Conference (ECTC) has transformed from a modest gathering of 300 electronics professionals to a powerhouse event attracting over 2,500 industry leaders, researchers, and visionaries. This remarkable journey reflects how advanced packaging has evolved from […]
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TSMC is preparing to begin 2nm chip production with wafer prices reportedly reaching $30,000 and potentially $45,000 for more advanced nodes like A16, driven by the complexity of backside power delivery.
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Canada’s chip sector faces supply chain challenges; collaboration and innovation are key. The post Supply Chain Uncertainty Hits Canada’s Chip Sector appeared first on EE Times.
