Book Reviews

Book Review: Handbook of 3D Integration – Volume 4

Book Review: Handbook of 3D Integration – Volume 4

An essential part of successfully introducing a new technology is to educate engineers and managers on its benefits and tradeoffs. That’s why Wiley started publishing the Handbook of 3D Integration Series with Volume 1 and 2 in 2008, followed by Volume 3 in 2014. This blog covers Volume 4, introduced in early May 2019. It focuses on three important 3D challenges: IC design, test, and thermal man... »

Material Value: A Narrative About More Sustainable, Less Wasteful Manufacturing

Material Value: A Narrative About More Sustainable, Less Wasteful Manufacturing

While I’m only four chapters into Material Value written by my colleague and SemiSister, Julia Goldstein, I decided to write the review before I finish reading the book, because Julia will be at ECTC next week in Las Vegas, and I want you all to be able to read the review before so that you can buy her book at the 3D InCites table and talk to her about it. And then we can talk about it in a virt... »

More-than-Moore 2.5D and 3D SiP Integration

More-than-Moore 2.5D and 3D SiP Integration

A new book on 2.5D and 3D integration, written by Riko Radojcic and published by Springer, will soon be available. The book addresses the current status of More-than-Moore system-in-package (SiP) technologies and explores the technical and business tradeoffs for deploying these options in high volume commercial IC products. We’re pleased to provide an excerpt of the preface: “There is a lot of... »

Book Review: Vertical 3D Memory Technologies

Book Review: Vertical 3D Memory Technologies

“From so simple a beginning endless forms most beautiful and most wonderful have been, and are being, evolved.” ~ Charles Darwin Charles Darwin was obviously not thinking of 3D semiconductor memories when he said this but the thought is appropriate. With the recent introduction of the first monolithic 3D Flash memory, the time is ripe to describe how the industry came to this point and what ot... »

Book Review: Design and Modeling for 3D ICs and Interposers

Book Review: Design and Modeling for 3D ICs and Interposers

For almost 50 years the semiconductor industry has practiced continued shrinking of transistor feature sizes and has been able to pack, with every new process generation, more functionality, at lower cost, onto a single piece of silicon in one IC package. However, physical limits to shrinking and rapidly increasing cost of this methodology have triggered the development of alternatives that combin... »