Peter has more than 20 years of international leadership experience in business development, operations, and strategic growth.
Peter most recently served as Vice President and General Manager for the Americas at Soleras Advanced Coatings, where he led initiatives to strengthen regional operations, expand manufacturing capacity, and secure long-term strategic agreements. Earlier in his career with Soleras and Bekaert Advanced Coatings, he managed global product launches and led teams across North America, South America, Europe, Asia, and the Middle East.
Peter said: “I’m excited to start this new chapter with MRSI. Coming out of the thin film industry, it’s energizing to dive into the die bonding technology and gain a deeper understanding of the market. The MRSI team has been incredibly welcoming and supportive in helping me get up to speed, and I truly appreciate the collaboration so far. I look forward to meeting our customers in the coming weeks.”
In his new role, Peter will focus on advancing MRSI’s die bonding business through continued innovation, operational excellence, and customer-focused growth. His experience in commercial execution, operational management, and team development will further strengthen MRSI’s ability to deliver advanced die bonding solutions, responsive service, and long-term value to customers worldwide.
For additional information, please contact:
Jennifer Russo
Marketing Manager, MRSI Systems
Global Technologies Division
Tel: +1 978 495 9731
E-mail: jennifer.russo@mycronic.com
About MRSI Systems
MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled precision and reliability for R&D, NPI, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, and optical imaging products. We provide the most flexible assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. Our commitment to excellence ensures we meet our customers’ needs with meticulous attention to detail and 24/7 field support. For more information visit www.mycronic.com/product-areas/die-bonding/.
About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Mexico, the Netherlands, Singapore, South Korea, Thailand, United Kingdom, United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com
