Die Bonding

MRSI to Present at 18th ICCSZ OC Market and Technology Seminar

MRSI to Present at 18th ICCSZ OC Market and Technology Seminar

MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show will be held at the Shenzhen Convention and Exhibition Center from September 4-7, 2019. MRSI Systems will also attend the 18th ICCSZ OC Market and Technology Seminar. This event is organized by... »

MRSI Improves Accuracy of MRSI-H/HVM-Series Die Bonders To to 1.5µm

MRSI Improves Accuracy of MRSI-H/HVM-Series Die Bonders To to 1.5µm

MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series line of die bonders. Placement accuracy was tested using industry-standard glass die reference samples. Results showed enhancement from ±3 µm at 3 sigma, to ±1.5 µm at 3 sigma. Moving forward for shipment starting from October 1, 2019, the product names will be MRSI-H and MRSI-HVM (formerly kno... »