Latest Posts
VPT Components and MRSI Systems Jointly Address Manufacturing Challenges
By Al Russo (VP of Engineering), VPT Components, Irving Wang and Jon Medernach, MRSI Systems VPT Components is one of...
Finetech USA Adds Clean Room Space to its Customer Applications Center
Finetech, a leading provider of precision die bonders and advanced rework equipment, announces the completion of a Class 1000 (ISO...
Eutectic Die Attach Optimizes High Power GaN Devices
Details how to reduce chip-to-package junction temperature to improve GaN chip efficiency and reliability StratEdge Corporation, a leader in the...
Finetech Demos Flip-chip Bonding at MIT Bootcamp for Integrated Photonics
On January 17, Finetech participated in the Massachusetts Institute of Technology’s (MIT) Integrated Photonics bootcamp, a week-long, hands-on learning experience...
MRSI Improves Accuracy of MRSI-H/HVM-Series Die Bonders To to 1.5µm
MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series line of die bonders. Placement accuracy...
