Bill Martin, Author at 3D InCites

Silicon Patents: Repeating the Past

Silicon Patents: Repeating the Past

“Those who cannot remember the past are condemned to repeat it” ~ George Santayana Over the past forty years, the presence of legally protected Intellectual Property (IP) has dramatically grown in the processes of electronic system development and deployment. Teams that use IP in product design and/or in subsequent product deployment and support have the additional corporate responsibilit... »

A Perfect Storm is Brewing for Complex Packaging in 2016

A Perfect Storm is Brewing for Complex Packaging in 2016

If I had not attended the 2015 3D ASIP conference, my outlook for 2016 would have been less upbeat for complex packaging (2.5/3D). But this conference showed that companies and their development organizations are NOT solely looking towards FinFETS and sub 20nm silicon process nodes to meet their integration, power, speed, weight, etc metrics.   We are in the perfect storm: out of control costs a... »

PDN Noise: PDN and Signal

PDN Noise: PDN and Signal

In a previous blog, I discussed a power design network’s (PDN) self and transfer impedances. Self impedance highlights anti-resonances causing a significant increase in the PDN’s impedance. The anti-resonances increase a design’s power, noise, and lessen performance. Transfer impedance shows the change in impedance from one location to another on the PDN structure. The higher transfer i... »

PDN Design, Target Impedance and Path Finding for IC, Package, and PCB

PDN Design, Target Impedance and Path Finding for IC, Package, and PCB

I am fortunate to work with Prof. Madhavan Swaminathan, Founder, CTO, E-System Design, and inventor of our algorithms. Long ago, as an undergraduate engineering student at University of Illinois focused on integrated circuit (IC) design, I enrolled in the required ElectroMagnetics (EM) course to discover it was all about large antennas¹. At that time, silicon and EM classes were not synchronized ... »

Subscription Renewals:  Can We Move to the 21st Century?

Subscription Renewals: Can We Move to the 21st Century?

If my fitness regimen can be Internet enabled, why can’t my magazine subscription renewals be? We all get them. Some come in emails while most use the phone call approach. You know, the “unrecognizable number” call that has a ‘few’ questions to answer that turns into many minutes of either repeating the information to or from the other speaker. If you do not answer, they continually call... »

Path Finding and 3DPF

Path Finding and 3DPF

In the past year, I have written short pieces explaining how Path Finding methodology can proactively help identify viable solutions or reactively identify solutions if something changes during manufacturing. The next few blogs will look at specific examples using a PF tool to help separate the ‘wheat from the chaff’. Signal Assignments When I was designing ASICs/SOCs at VLSI Technology, we no... »

Is Complex Packaging in High Volume Manufacturing (HVM)?

Is Complex Packaging in High Volume Manufacturing (HVM)?

Over the past year… The amount of 2.5/3D articles published has gained momentum. Some articles discuss when HVM will be achieved for this complex packaging, others discuss costs from chip to system levels, how to evaluate options, design and verify, etc. All articles are based on facts gleaned from various articles, presentations and conferences that authors have viewed or participated in. The... »

RIP ITRS V1.0: 1992-2015

RIP ITRS V1.0: 1992-2015

Prior to 1992, the high technology industry was ‘immature’. Each supply chain vendor (equipment, materials) would accumulate input from their customers that defined product roadmaps. Vendors cared little about accepting or supplying work-in-progress (WIP) to other vendors’ products. But it became obvious to many that unless they were coordinated, sales potential would be limited. A coordina... »

Can Path Finding be used in the Production Environment?

Can Path Finding be used in the Production Environment?

In previous posts, I have discussed various scenarios when Path Finding can be used. All were focused on the early design process: implementation guidelines, robust design and process centering. But what if you have a design in production and ‘something’ happens; like a process is no longer available; a component must be replaced by another, yields become erratic, etc. Is there a role for Path... »

Micro vs. Macro 3D IC Cost Analysis: Can we learn from the mid 1980’s?

Micro vs. Macro 3D IC Cost Analysis: Can we learn from the mid 1980’s?

Amy Palesko from SavanSys Solutions wrote an excellent 3D IC cost analysis article (The Cost of 3D ICs) on 3D InCites that focused on the manufacturing cost of TSV enabled devices. No question that these costs are important and will follow a classical manufacturing learning curve. But the real story is at the macro level or system costs using the new technologies. Introduction of ASIC designs…. ... »

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