Design View all

Considerations in Power Amplifier Package Design

Understanding the role of compromises and trade-offs in the design process Electronic packages serve many purposes including protecting, connecting, and cooling a device. If any of these are done improperly, the chip is rendered inefficient at best or useless altogether. For that reason, the design, construction, properties, and capabilities of...

Design-for-test for 3D IC Designs Comes of Age

In the era of more-than-Moore, 3D IC is the new scaling approach adopted by the marketplace. Progress has been made throughout the semiconductor ecosystem in bringing 3D ICs designs to the mainstream, including design-for-test (DFT). First came 2.5D Design-for-test The industry got some practice for the challenges of 3D IC...

Devices View all

How AiP Technology Helps Enable 5G and More

For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
Intel@14nm+@Skylake@Kabylake-S(DualCore)@Celeron_G3930@SR35K______DSC02678

System-on-Chip Disintegration is Underway

We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...

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