Electronics Packaging – From Afterthought to Product Differentiator
Nov 17, 2021 · By Steffen Kröhnert · 3D In-Depth, Processes and Technology
Design View all
Let’s Start the ESD Alliance – 3D InCites Conversation!
This post kicks off what I expect to be a regular series of blogs that will help tie the system design community to manufacturing or, more specifically, your community tackling 3D integration. I accepted Francoise’s invitation to become a 3D InCites blogger because the ESD Alliance, where I serve as...
EDPS 2020: An Inside Look at the Manufacturing-centric Presentations
Like many other industry conferences, the Electronic Design Process Symposium (EDPS 2020) had to go virtual. Not only did it keep our audience safe but allowed us to attract almost 200 registrants worldwide. Thanks to sponsorships from – ANSYS, Cadence, CEDA, Intel, Mentor – A Siemens Business, and Synopsys –...
Devices View all
How AiP Technology Helps Enable 5G and More
For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
System-on-Chip Disintegration is Underway
We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...
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