It’s almost ironic. As CMOS scaling (aka: Moore’s Law) has slowed due to the increased complexity and cost of achieving smaller nodes, the focus has shifted to advanced packaging and heterogeneous integration to meet demands for microelectronics devices targeting the internet of things (IoT) market. These devices perform a variety of functions (sensing, processing, remembering, transmitting) i... »
For the second consecutive year, SEMI Europe is co-locating its MEMS and Sensors/Imaging and Sensors Summits in Grenoble, France, in the heart of the Rhone-Alpes. Rather than Minatec Campus, where the event was held last year, both summits will take place at The World Trade Center Grenoble. After last year’s successful and information-packed event, I’m looking forward to attending this year’... »
One topic that has been under hot debate in the semiconductor advanced packaging sector for the past few years is fan-out panel-level packaging (FOPLP). In theory, the concept of taking fan-out from a 300-mm reconstituted wafer to a large panel format as a way to lower costs seems simple, and even the logical step. It’s not. Skeptics, many burned by the same low-cost advantage argument for inv... »
On Monday, April 16, 2018, SEMI, the industry association representing the global electronics manufacturing supply chain, and the Electronic System Design (ESD) Alliance, representing the design community, announced a strategic partnership. On Tuesday I had a very informative conference call with Bettina Weiss, VP Business Development at SEMI and Bob Smith, Executive Director, the ESD Alliance to ... »
Did you get your ECTC Advanced Program and Registration in the mail yet? Mine arrived yesterday, and I was pleased to see that this year’s Electronics Components and Technologies Conference (ECTC 2018), which takes place May 29-June 1, will be all about the new technology darlings driving development in heterogeneous integration: artificial intelligence, the human-machine interface, wearables, B... »
As it has for the past 14 years, the global microelectronics industry gathered at Wekopa Resort and Conference Center in Fountain Hills, AZ, March 6-8, 2018, for the 2018 IMAPS Device Packaging Conference (DPC) to share knowledge, discuss strategies for growth, learn about the latest heterogeneous integration from fan-out wafer level packaging (FOWLP) to 3D ICs. We also managed to get in some golf... »
March 7, 2018, the day of the 2018 3D InCites Awards Ceremony, dawned chillier than normal for this time of year in Fountain Hills, AZ. As they enjoyed their breakfast on the terrace outside the conference center, attendees of the 14th Annual iMAPS Device Packaging Conference (iMAPS DPC), may have noticed an artist hard at work creating an original mural that would later provide a backdrop to comm... »
2017 saw a clear breakthrough for 3D chip technology in commercial products. Before then, the industry had looked rather skeptically at 3D, but now it is beginning to realize that 3D does not necessarily have to cost more money. Better still, it creates new possibilities and opportunities. 3D on the market In 2017 we saw 3D chip technology start to appear in a range of different commercial ... »
SEMI’s Industry Strategy Symposium (ISS) has been on my conference bucket list for some time, so when I was offered a press pass to attend ISS 2018, there was no question about attending. One day in, and I’m not disappointed. The venue, the Ritz Carleton at Half Moon Bay, is spectacular – nothing like falling asleep to the sound of crashing waves on the beach below – and so far, the speake... »
Burlingame, California – Dec. 6, 2018 – 3D InCites, the premier content platform for heterogeneous integration technologies, today from the 2017 3D ASIP Conference, announced a collaboration with IMAPS International to co-host the 2018 3D InCites Awards, the semiconductor industry’s most prestigious award program recognizing contributions for the development of heterogeneous integration tech... »
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