AI is Driving New Industrial Infrastructure for the Factory of Tomorrow
Nov 12, 2026 · By DigiKey · 3D In-Depth, Manufacturing, Processes and Technology
Design View all
Why Hybrid Bonding Is Hard to Perfect
Examples of Hybrid bonding-related imperfections – misalignment, erosion of dielectric, and over-dishing of copper that can lead to bond failures Hybrid bonding is emerging for high-performance 2.5D / 3D packaging to improve interconnect performance and density past conventional bump limits. In this post I’ll give a complete technical overview of...
Open-Cavity Plastic Packages: A Practical Approach to IC Prototyping
Developing a new IC involves more than designing and fabricating the die. At some point, the device needs to be assembled into a package so engineers can begin electrical testing, characterization, and system-level evaluation. For early-stage prototypes, time can become a packaging constraint of its own. Waiting for new package...
Devices View all
How Implantable Brain-Computer Interfaces Are Pushing the Boundaries of Precision Die Bonding
A patient who can no longer speak generates text directly from neural activity. A patient with paralysis controls a cursor using thought alone. Behind demonstrations like these is a difficult engineering problem: how do you assemble electronics delicate enough to interact with the human brain, while keeping them stable inside...
Navy’s Directed Energy Systems Integration Lab to Train Sailors on Laser Weapons
By Thomas McMahon Naval Surface Warfare Center, Port Hueneme Division, CA Sailors can now get certified in operating and maintaining the fleet’s most prevalent directed energy system through a new training program at Naval Surface Warfare Center, Port Hueneme Division (NSWC PHD)’s Directed Energy Systems Integration Laboratory (DESIL), with the first...
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The AI Packaging Bottleneck Is a Materials Opportunity
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Beyond the Grating: Rethinking High-Power Semiconductor Laser Reliability for AI Datacenter Optics
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Can Embedded Passives Fix AI’s Power Delivery Problem?
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Precision at Speed: Silver Sintering for Next-Gen Power Module
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Accelerating the Transition to Intel 18A for Secure National Security Microelectronics
As federal agencies and defense organizations race to modernize the technologies that underpin national security, the semiconductor industry has entered...
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Advanced Packaging: The Foundation of Next-Generation Semiconductor Innovation
For decades, semiconductor scaling was closely tied to putting more transistors onto progressively smaller areas of silicon. That relationship is...
Here Comes the Sun: Why the Co-Packaged Optics Transition Is “All Right”
Few songs capture the feeling of a long-awaited breakthrough better than the Beatles’ Here Comes the Sun. The song is about...
Inspecting Solder Interconnects at the Wafer Level
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Selecting a Joining Process for Microchannel Liquid Cooling Plates: Vacuum Brazing, Controlled-Atmosphere Brazing, or Diffusion Bonding?
Evolving Requirements for Liquid Cooling Plates In recent years, liquid cooling plate designs have become more complex. Smaller channels, higher...
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Autoclaving Resistance of Medical Adhesives
Resistance to steam sterilization is an important consideration for the selection of polymeric adhesives, sealants and potting compounds for use...