How COVID-19 Will Impact the Electronics Field Service Industry
May 21, 2020 · By Dean Freeman · 3D In-Depth, Manufacturing
Whitepapers
The Implications of doing Business with Huawei
Design View all
Striking the Right Chord for Chiplet Integration
The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution also implies that the total amount of data processed in the world is doubling every two years or so. Electronic devices such as mobile phones, laptops, satellites, servers or self-driving...
An Update on the Fan-out Panel-Level Packaging Consortium
One topic that has been under hot debate in the semiconductor advanced packaging sector for the past few years is fan-out panel-level packaging (FOPLP). In theory, the concept of taking fan-out from a 300-mm reconstituted wafer to a large panel format as a way to lower costs seems simple, and...
EDPS 2017: NOT the usual Electronic DESIGN Process Symposium
When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold steps EDPS was traditionally held in the spring. We moved EDPS to the fall because that’s a time when more new IC projects are being planned. After many years of...
Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP
For several years now, Herb Reiter, eda2asic, and John Ferguson, Mentor Graphics, have been evangelizing about the necessity of assembly design kits (ADK), similar to the process design kits (PDKs) for chip designers, to help drive ecosystem capabilities for what is collectively now being called high density advanced packaging (HDAP),...
Devices View all
The Future of Non-volatile Memory
Part 4 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the future of non-volatile memory. The figure above is a concept for 3D stacking of Flash devices. A thin-film field effect transistor with a silicon nitride as charge reservoir and a tunnel oxide....
The Invention of NAND Flash Memory
Part 3 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the invention of NAND flash memory. The above image is of the first comprehensive paper reporting the NAND Flash invention where Fowler-Nordheim tunneling is used for program and erase of the memory. [1] After...
The Invention of Tunneling-Based Flash Memory
Part 2 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with a history lesson on the invention of tunneling-based flash memory. In 1956, William Shockley, shared the Nobel Prize in physics with J. Bardeen and W.H. Brattain, all at Bell Laboratories, “for their researches on semiconductors and...
Fan-out Packaging Confirms its Success Story
Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain true, announces Yole Développement (Yole). Will the fan-out market growth keep going? Who can challenge the leading semiconductor company, TSMC? Is panel technology coming? What will be the next killer application?...
Latest Posts
Social Distancing Spotlight: NAMICS
Brian Schmalz, NAMICS, Talks About the Future of Electronics Materials Since we launched the program in January, the 3D InCites...
Behind the Scenes of IEEE Std 1838™-2019
Developing an industry standard is no easy task, and for those involved, its acceptance and publication is something to be...
An Inside Look at 3D-DfT Standard IEEE Std 1838™-2019
Eight years in the making, the IEEE Std 1838™-2019 Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits — or IEEE 1838,...
Indium Corporation’s Andy Mackie Talks About Materials Science
“We believe that materials science changes the world,” declared Indium Corporation’s Andy Mackie during our recent sit-down together at IMAPS...
SEMICON Europa and Productronica 2019 Exhibitor Showcase
The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused...
Uniting the World Through Technology Innovation
What a week we just had at the Munich Messe in Germany! If you’ve never had the chance to attend...
Products on Parade in the Exhibits at IWLPC 2019
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out...
SEMICON Europa on Preview…
Co-located with productronica in Munich, Germany, SEMICON Europa attracts and connects industry-leading technology companies from every segment of the European...
Yole Analysts Announce Consolidation of the Die-attach Equipment Market
“The die-attach equipment market is showing a 6% CAGR between 2018 and 2024”, announces Santosh Kumar, Principal Analyst & Director...