Saving The World with a Global Parts Platform
Aug 22, 2023 · By SurplusGLOBAL · 3D In-Depth, Manufacturing
Design View all
A Focus on Chiplet Verification
Chiplets have become a strategic asset for designers who are implementing them in all sorts of applications. Until now, chiplet verification until now has been overlooked. I discussed this phenomenon with Dave Kelf, CEO of Breker Verification Systems, an ESD Alliance member company and provider of verification solutions that leverage...
Driving Collaboration Across Design Teams to Optimize 3D-IC Designs
Editor’s Note: Bob Smith, executive director of the ESD Alliance, a SEMI Technology Community, is a regular contributor to 3D InCites. He turns over his blog today to John Lee of Ansys, an ESD Alliance member company, who describes a disruptive change in product engineering and the requirements of the...
Devices View all
How AiP Technology Helps Enable 5G and More
For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
System-on-Chip Disintegration is Underway
We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...
Latest Posts
Plasma Dicing Enables Challenging Applications Including D2W Hybrid Bonding
Plasma dicing offers an optimized approach to die singulation as chips get smaller, thinner, and more complex. As semiconductor content...
The Rise of Organic and Glass Substrates
If you are designing a heterogeneously integrated, multi-die, high-performance device for markets such as HPC, AI, data centers, etc., then...
Hybrid Bonding takes Heterogeneous Integration to the Next Level
Hybrid bonding enables an assortment of possible chip architectures, mainly targeted at high-end applications including high-performance computing (HPC), artificial intelligence...
A Look at the Next Generation of Packaging Inspection Solutions
With the increasing expectations and demands of customers of electronic equipment, the manufacturing technologies applied are also propelled due to...
Heterogeneous IC Packaging: Building an Infrastructure
Heterogeneous IC packaging is here. It is already in production, and increasingly more customers are developing and qualifying their products...
Excitement Over Chiplets: Not for Everyone and Not Trivial for Test
Live from “Silicon Desert”: The news is all about huge spending by TSMC and Intel. Investment in advanced packaging (2.3/2.5/3D...
Digital and Physical: Thermal Twins for Developing Thermal Management Solutions
As we all know, finding thermal management solutions is becoming an increasingly critical but also an ever more challenging issue...
Updates in Test Connectivity System (TCS) from TestConX
The annual TestConX conference (www.testconx.org) was held March 5-8, 2023, in Mesa, Arizona. It offered a one-of-a-kind, one-stop shop for...
Wafer Bonding and NanoCleave: The New Lithography Scaling
NanoCleave enables Laser Debonding on Silicon with Nanometer Precision In semiconductor manufacturing, 3D integration – the manufacturing, vertical assembly, and...
Sustainability 101: What Good Are Awards?
Awards and rewards can motivate behavior. An obvious example is online gaming, where players earn stars, points, or access to...
Interconnect Reliability: From the Chip to the System
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle...
Building Chiplet Systems: Models
There is a general agreement that chiplet systems are the next step in the evolution of designing dense, complicated, and...
SiC MOSFET Challenges, Demand and Industrialization of Test & Burn-in
The coming-of-age and breakthroughs offered by silicon carbide (SiC) MOSFETs, as well as demand that is outstripping supply are rapidly...
Forging a New Future for 3D IC Design and Architecture
The semiconductor industry’s ability to coax more and more performance out of a chip has produced the most significant innovations...
Update on the UCIe™ from ITC 2022
In 1965 Gordon Moore proclaimed that there would be a “’Day of Reckoning’ when it may prove to be more...
Building a Dense 3D-IC System: Power Challenges
Recently, there has been a very healthy discussion on whether Moore’s law is still valid. While the arguments fly from...
Chiplet Designs and Heterogeneous Integration Packaging
System-on-Chip (SoC) integrates ICs (by reducing the feature size) with different functions such as central processing unit (CPU ), graphic...
Materials Science Solutions for Electronics Sustainability
This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenient...
Thermal Analysis Techniques to Improve High Density Semiconductor System Performance
Thermal problems in semiconductor electronic systems often go unnoticed and cause failures. Although thermal problems can be understood and avoided...