25 Years Perfecting the Art of Metrology
Aug 04, 2020 · By Francoise von Trapp · Test and Inspection
Design View all
Striking the Right Chord for Chiplet Integration
The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution also implies that the total amount of data processed in the world is doubling every two years or so. Electronic devices such as mobile phones, laptops, satellites, servers or self-driving...
An Update on the Fan-out Panel-Level Packaging Consortium
One topic that has been under hot debate in the semiconductor advanced packaging sector for the past few years is fan-out panel-level packaging (FOPLP). In theory, the concept of taking fan-out from a 300-mm reconstituted wafer to a large panel format as a way to lower costs seems simple, and...
Devices View all
The Future of Non-volatile Memory
Part 4 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the future of non-volatile memory. The figure above is a concept for 3D stacking of Flash devices. A thin-film field effect transistor with a silicon nitride as charge reservoir and a tunnel oxide....
The Invention of NAND Flash Memory
Part 3 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the invention of NAND flash memory. The above image is of the first comprehensive paper reporting the NAND Flash invention where Fowler-Nordheim tunneling is used for program and erase of the memory. [1] After...
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Temporary Wafer Bonding System Is Based On Electrostatics, Not Adhesives
Temporary wafer bonding is widely employed in semiconductor device fabrication and in semiconductor device packaging applications, particularly now that changes...
System-on-Chip Disintegration is Underway
We have known for some time that with scaling coming to an end the industry would need to find another...
Temporary Bonding and Mold Process to Enable Next-Gen FOWLP
Temporary wafer bonding processes were initially developed for enabling three-dimensional (3D) stacked integrated circuits (ICs). For example, dies can be...
Social Distancing Spotlight: NAMICS
Brian Schmalz, NAMICS, Talks About the Future of Electronics Materials Since we launched the program in January, the 3D InCites...
Digital Cross-section Technology for Inspecting and Measuring Buried Package Interconnects
Much has been written about the end of Dennard Scaling, the slowdown of Moore’s Law and the impact that these...
Behind the Scenes of IEEE Std 1838™-2019
Developing an industry standard is no easy task, and for those involved, its acceptance and publication is something to be...
An Inside Look at 3D-DfT Standard IEEE Std 1838™-2019
Eight years in the making, the IEEE Std 1838™-2019 Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits — or IEEE 1838,...
ISS 2020: How to Win in Our Data-driven World
From January 14 to 16, 2020 SEMI welcomed about 300 high-level executives to the Industry Strategy Symposium (ISS 2020) at...
Indium Corporation’s Andy Mackie Talks About Materials Science
“We believe that materials science changes the world,” declared Indium Corporation’s Andy Mackie during our recent sit-down together at IMAPS...
SEMICON Europa and Productronica 2019 Exhibitor Showcase
The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused...
Uniting the World Through Technology Innovation
What a week we just had at the Munich Messe in Germany! If you’ve never had the chance to attend...
Products on Parade in the Exhibits at IWLPC 2019
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out...
SEMICON Europa on Preview…
Co-located with productronica in Munich, Germany, SEMICON Europa attracts and connects industry-leading technology companies from every segment of the European...
Yole Analysts Announce Consolidation of the Die-attach Equipment Market
“The die-attach equipment market is showing a 6% CAGR between 2018 and 2024”, announces Santosh Kumar, Principal Analyst & Director...
The IWLPC Fan-out PLP Smack Down
At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which...
MSEC 2019: MEMS and Sensors Have a Lot to offer for System Designers
San Diego’s Coronado Island Marriott Resort and Spa hosted SEMI’s MEMS and Sensors Executive Congress (MSEC 2019) from Oct 23...
The Decade Ahead: Emerging MEMS and Sensors Technologies to Watch
Most of today’s blockbuster MEMS products—from pressure sensors and resonators to accelerometers and microphones—originated from academic research, a trend that...
IWLPC 2019 Brings You Advanced Packaging in an Interconnected World
Anyone whose anyone with a hand in the evolution of wafer level packaging will be in attendance or exhibiting at...
Exhibitor Highlights at IMAPS International Symposium
The 52nd International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week. Key...