The Most Comprehensive 5 Hardware Testing Processes, Not a Single One Can Be Missed Hardware Inspection Before Powering On
Jul 08, 2026 · By UT Source · 3D In-Depth, Processes and Technology, Test and Inspection
Design View all
Siemens partners with Databricks and FFT to turn production data into scalable AI-driven insights
Siemens Industrial Edge and FFT DataBridge connect shopfloor and plant data directly to the Databricks Platform – no IoT middleware required New edge to cloud connectivity offers scalable advanced analytics and a unified, AI‑ready production data foundation Industrial customers can optimize their operations, reduce costs and increase productivity Siemens announced...
SWAP Hub earns DoW Year 2 Award Investment from NSTXL
The Microelectronics Commons NSTXL (National Security Technology Accelerator) has announced the DoW Year 2 awards, with more than $200M invested across 26 projects nationwide and the Southwest Advanced Prototyping (SWAP) Hub earning continued support for multiple high-impact efforts already advancing U.S. microelectronics innovation. These awards recognize real progress and growing...
Devices View all
How Implantable Brain-Computer Interfaces Are Pushing the Boundaries of Precision Die Bonding
A patient who can no longer speak generates text directly from neural activity. A patient with paralysis controls a cursor using thought alone. Behind demonstrations like these is a difficult engineering problem: how do you assemble electronics delicate enough to interact with the human brain, while keeping them stable inside...
Navy’s Directed Energy Systems Integration Lab to Train Sailors on Laser Weapons
By Thomas McMahon Naval Surface Warfare Center, Port Hueneme Division, CA Sailors can now get certified in operating and maintaining the fleet’s most prevalent directed energy system through a new training program at Naval Surface Warfare Center, Port Hueneme Division (NSWC PHD)’s Directed Energy Systems Integration Laboratory (DESIL), with the first...
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Avoiding Common Failure Modes in Bonding Applications
Understanding common failure mechanisms allows engineers to implement preventive measures during the design and qualification phases. Delamination and Bond Failure...
SPM Wafer Cleaning for Advanced Semiconductor Manufacturing
Wafer cleaning is one of the most critical steps in the semiconductor process flow, especially as dimensions continue to shrink to below the 1-nanometer (nm) node. Photoresist residue and particulates can...
Die Bonding
Die bonding is a manufacturing process used in the packaging of semiconductors. It is the act of attaching a die (or...
Peer viewpoint: electrification and autonomous vehicles are driving a semiconductor revolution
Introduction On average, cars today contain 1,700 semiconductor chips, underscoring how crucial they are to automobiles. Semiconductor chips support a...
UCLA Samueli School of Engineering launches $125 million semiconductor hub with top industry leaders
By Christine Wei-li Lee Key takeaways A first-of-its-kind Semiconductor Hub at the UCLA Samueli School of Engineering aims to accelerate...
Accelerating 2nm & Advanced Packaging through global collaboration
AI is transforming the next-generation advanced foundry for 2nm chips, thus reshaping the semiconductor industry, writes Rozalia Beica. The semiconductor...
MasterSil 153:Used for Bonding Silicone and Metalin Strain Sensor
Overview of MasterSil 153 Master Bond MasterSil 153 is a two-component paste silicone compound for high-performance bonding and sealing applications....
Packaging: The Make-or-Break Factor in mmWave Performance
Millimeter-wave (mmWave) technology occupies the short-range, high-frequency portion of the electromagnetic spectrum—typically defined as 30 to 300 GHz—and is enabling...
From AI momentum to manufacturing reality
AI is moving past the hype, and the first real pressure is showing up in manufacturing. As demand accelerates across...
The Need for Speed: How Domestic Manufacturing Accelerates Delivery of Mission-Critical Technology
By James S. B. Chew, Vice President and General Manager, Intel Government Technologies The future of US defense capability hinges...
How Semiconductor Transistors Work: The On/Off Switches Powering Our Digital Society
Our digital society operates entirely on combinations of extremely simple information: 0 and 1. These numbers are physically generated by...
Trends in Semiconductor Manufacturing: Wafer-Level and Panel-Level Packaging
One of the most important shifts in semiconductor manufacturing today is not just the continued growth of wafer-level packaging (WLP),...
Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough
By Chandra Gupta In my last column, I described the ceramic substrate itself, and why material choice matters so deeply...
Intel Foundry Achieves Breakthrough with World’s Thinnest GaN Chiplet Technology
Han Wui Then is a senior principal engineer at Intel Foundry Technology Research specializing in advanced semiconductor materials and advanced...
Why Die Bonding Fails to Scale: How Do You Move from Prototype to Production Without Starting Over?
By Tobias Gleichmann In advanced packaging, the real challenge usually doesn’t show up during development. It shows up when processes...
Advanced Optical Metrology for Wire Bond Inspection Using 3D Area Multi-Focus (AMF) Imaging
By Austin Rose, Troy Frappier and Alan Emmans of VIEW Micro Metrology Abstract Wire bonding remains one of the most...
Engineering Copper Grain Structure for High-Yield Hybrid Bonding in 3D Packaging
Why copper grain size matters for hybrid bonding and how to control it for HBM and chiplets. Read the article...
The Next Mode of Transformation: 3D IC Integration
The semiconductor industry finds itself at a critical juncture, where the traditional paradigms of Moore’s Law are encountering fundamental physical...
Is Copper Sintering the Key to Advancing Wide Band Gap Semiconductors?
By Rejoy Surendran and Xinpei Cao, Henkel Adhesive Technologies In the mid- to high-voltage power semiconductor sector, which enables EVs,...