Packaging: The Make-or-Break Factor in mmWave Performance
May 12, 2026 · By QP Technologies · 3D In-Depth, Materials, Processes and Technology
Design View all
SWAP Hub earns DoW Year 2 Award Investment from NSTXL
The Microelectronics Commons NSTXL (National Security Technology Accelerator) has announced the DoW Year 2 awards, with more than $200M invested across 26 projects nationwide and the Southwest Advanced Prototyping (SWAP) Hub earning continued support for multiple high-impact efforts already advancing U.S. microelectronics innovation. These awards recognize real progress and growing...
Engineering Copper Grain Structure for High-Yield Hybrid Bonding in 3D Packaging
Why copper grain size matters for hybrid bonding and how to control it for HBM and chiplets. Read the article here. Abstract Hybrid bonding is reshaping advanced packaging by enabling ultra-fine pitch copper-to-copper interconnects, essential for high-bandwidth memory (HBM), chiplet integration, and 3D heterogeneous systems. While alignment precision, oxide control,...
Devices View all
How AiP Technology Helps Enable 5G and More
For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
System-on-Chip Disintegration is Underway
We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...
Latest Posts
How Semiconductor Transistors Work: The On/Off Switches Powering Our Digital Society
Our digital society operates entirely on combinations of extremely simple information: 0 and 1. These numbers are physically generated by...
Trends in Semiconductor Manufacturing: Wafer-Level and Panel-Level Packaging
One of the most important shifts in semiconductor manufacturing today is not just the continued growth of wafer-level packaging (WLP),...
Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough
By Chandra Gupta In my last column, I described the ceramic substrate itself, and why material choice matters so deeply...
Intel Foundry Achieves Breakthrough with World’s Thinnest GaN Chiplet Technology
Han Wui Then is a senior principal engineer at Intel Foundry Technology Research specializing in advanced semiconductor materials and advanced...
Why Die Bonding Fails to Scale: How Do You Move from Prototype to Production Without Starting Over?
By Tobias Gleichmann In advanced packaging, the real challenge usually doesn’t show up during development. It shows up when processes...
Advanced Optical Metrology for Wire Bond Inspection Using 3D Area Multi-Focus (AMF) Imaging
By Austin Rose, Troy Frappier and Alan Emmans of VIEW Micro Metrology Abstract Wire bonding remains one of the most...
The Next Mode of Transformation: 3D IC Integration
The semiconductor industry finds itself at a critical juncture, where the traditional paradigms of Moore’s Law are encountering fundamental physical...
Is Copper Sintering the Key to Advancing Wide Band Gap Semiconductors?
By Rejoy Surendran and Xinpei Cao, Henkel Adhesive Technologies In the mid- to high-voltage power semiconductor sector, which enables EVs,...
Product-Proven Green Alternative to Solvent and Piranha Wafer Processing using Ozone
The use of ozone in semiconductor wet processing surface preparation has gained new momentum as fabs pursue advanced cleans and...
Novel Failure Analysis Approach Correctly Identifies Rejects
Rejects can occur at various stages of semiconductor processing. The further downstream a reject occurs, the more costly the defect...
Laminography: a Non-destructive 3D X-ray Breakthrough for Advanced Packaging
By Till Dreier & Julius Hållstedt Non-destructive X-ray inspection has become a critical capability across the semiconductor and electronics industry...
CMP Technology for the Next Generation of Substrates
For decades, chemical mechanical planarization (CMP) has been one of the enabling technologies of semiconductor manufacturing. Without ultra-flat and uniform...
Engineering Copper Grain Structure for High-Yield Hybrid Bonding in 3D Packaging
By Abdelhamid El-Sawy, Ph.D., Senior R&D Scientist and Bud Troche, Senior Director of Wafer Level Packaging, MacDermid Alpha Electronics Solutions...
A Comprehensive Approach to 3D IC Physical Verification: Tackling DRC, LVS and Beyond
As the industry pushes toward ever-greater levels of semiconductor performance, integration and efficiency, the promise of 3D integrated circuits (3D...
The Telecom Network Semiconductor Trifecta
Telecommunication networks are undergoing a rapid transformation. With 5G rollouts, edge computing, and a surge in IoT devices, the pressure...
Revolutionizing Semiconductor Quality: The Dynamic Planar CT Advantage
X-Ray inspection has become an essential component in semiconductor manufacturing, with 3D imaging emerging as a critical tool for ensuring...
Copper Dual Damascene for Wafer-Level Packaging: Enabling Reliable, High-Density Interconnects
Overcoming yield loss, reliability risks, and scaling limits in advanced packaging with high-aspect-ratio copper interconnects. As device architectures shrink, delivering...
An Inside-out-view: Data Centers
The convergence and synergy of performance and sustainability required to power the next generation of AI data centers The surging...
Managing Security and Access of Semiconductor Manufacturing’s Remote Connectivity
In the complex world of semiconductor manufacturing, equipment uptime is critical to productivity. Modern industrial operations are no longer limited...
