3D In-Depth

Sir Walter Raleigh towered above the 50th IMAPS Symposium

Sir Walter Raleigh towered above the 50th IMAPS Symposium

Almost 500 years ago Walter Raleigh was born in England, rose rapidly in the favor of Queen Elizabeth I and was knighted in 1585. In 1587 he initiated the founding of Raleigh. Last week he welcomed – appropriately dressed – about one thousand semiconductor experts to the 50th International Symposium on Microelectronics at the Raleigh, NC, Convention Center (Figure 1). If you look closer at thi... »

European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore

European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore

There’s no doubt about it. Imaging sensor technologies have come a long way since the introduction of the digital camera. In fact, according to Gartner, image-based sensors will be the single largest category of devices for the internet of things (IoT) sensing (figure 1). That fact was made imminently clear a few weeks ago at the European Imaging and Sensors Summit, which took place September 21... »

EDPS 2017: NOT the usual Electronic DESIGN Process Symposium

EDPS 2017: NOT the usual Electronic DESIGN Process Symposium

When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold steps EDPS was traditionally held in the spring. We moved EDPS to the fall because that’s a time when more new IC projects are being planned. After many years of holding it in Monterey, we moved EDPS to Milpitas to make it more easily accessible for Silicon Valley folks... »

Spotlight on the European MEMS and Sensors Technology Showcase

Spotlight on the European MEMS and Sensors Technology Showcase

As it’s difficult to be in two places at one time, I was happy to see that the organizers of the co-located European MEMS and Sensors Summit/Imaging and Sensors Summits made sure two featured tracks —the MEMS and Sensors Technology Showcase and The Imaging Sensors Start-up Pitches — did not run in parallel. As a result, I attended both. This post focuses on the MEMS and Sensors Technolog... »

The Brighter Side of SEMICON West 2017

The Brighter Side of SEMICON West 2017

Generally, I avoid reading other journalists’ coverage of events I’ve attended until I’ve had a chance to finish my own coverage. But there it was in my inbox in a recent edition of Semiconductor Packaging News: “Five Takeaways from Semicon” by Semi Engineering’s Mark LePedus. I couldn’t resist. I had to click. I must admit, Mark is more of a hardcore technology journalist than I am,... »

2017 3D InCites Awards Ceremony and Reception: A Retrospective

2017 3D InCites Awards Ceremony and Reception: A Retrospective

Once again this year, the industry came out in full force to honor excellence in heterogeneous integration at the 2017 3D InCites Awards Ceremony and Cocktail Reception to benefit KidSizeCures for childhood cancer. After a brief ceremony during which we presented 11 awards in 10 categories (find out who won here), guests enjoyed good food, drinks, and conversation, as well as some fun activities, ... »

Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1)

Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1)

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)At SEMICON West 2016, the big story was the end of the ITRS Roadmap for dimensional scaling according to Moore’s Law and the birth of the Heterogeneous Integration Roadmap (HIR). There were many reasons for this: the cost of continued scaling vs. the reduced performance benefits, the advantages of being able to heterogeneo... »

Announcing the Winners of the 2017 3D InCites Awards!

Announcing the Winners of the 2017 3D InCites Awards!

The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as seven nominees in some fields (supplier of the year), and tallied just over 17,529 votes in total! We also saw a considerable increase in nominees using social media to promote their participation in this year’s event. As heterogeneous integration, fueled by advanced packaging and 3D integration, mov... »

Tech Session Highlights from ECTC 2017

Tech Session Highlights from ECTC 2017

Françoise promised in her recent blog that my ECTC blog would follow shortly. Finally, after attending DAC in Austin as well as the iMAPS’ SiP Conference in California’s Wine Country and shortly before attending Semicon West in San Francisco, I found some time to report what I saw and learned at ECTC 2017 in Orlando. ECTC offered six parallel tracks for the about 1500 attendees. I could of co... »

Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP

Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP

  For several years now, Herb Reiter, eda2asic, and John Ferguson, Mentor Graphics, have been evangelizing about the necessity of assembly design kits (ADK), similar to the process design kits (PDKs) for chip designers, to help drive ecosystem capabilities for what is collectively now being called high density advanced packaging (HDAP), comprising 2.5D IC, 3D IC and high density fan-out wafer... »

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