Hybrid Bonding Bridges the Technology Gap
May 27, 2021 · By KLA · 3D In-Depth, Processes and Technology
Design View all
Let’s Start the ESD Alliance – 3D InCites Conversation!
This post kicks off what I expect to be a regular series of blogs that will help tie the system design community to manufacturing or, more specifically, your community tackling 3D integration. I accepted Francoise’s invitation to become a 3D InCites blogger because the ESD Alliance, where I serve as...
EDPS 2020: An Inside Look at the Manufacturing-centric Presentations
Like many other industry conferences, the Electronic Design Process Symposium (EDPS 2020) had to go virtual. Not only did it keep our audience safe but allowed us to attract almost 200 registrants worldwide. Thanks to sponsorships from – ANSYS, Cadence, CEDA, Intel, Mentor – A Siemens Business, and Synopsys –...
Devices View all
How AiP Technology Helps Enable 5G and More
For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
System-on-Chip Disintegration is Underway
We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...
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IME – Hybrid Bonding Studies Singapore’s Institute of Microelectronics – IME / AStar – was certainly the most prolific presenter...
RF Technology in a Complete Glass Package
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Implementation of the 5G radio frequency (RF) standard is increasing rapidly [1]. Over the past four to six quarters, there...
CEA-Leti/Intel Collaboration brings 3D Powerhouses to the Advanced 3D Packaging Table
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In September of 2018, I spoke with KLA’s Stephen Hiebert and Pieter Vandewalle about the changing advanced packaging landscape, and...
Plasma Treatment During Fan-Out Packaging Maximizes Performance and Optimizes Costs
In recent years, there has been an increased focus on fan-out wafer-level packaging (FOWLP) due to the smaller packaging size...
Why We Need to Address Known Good Die (KDG) Holistically
If you love, like me, to work on the bleeding edge of technology, you will find that your personal success...
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With each passing year, emerging growth application areas such as Automotive, Cloud Computing, Industrial Automation, and Telecom (5G) Infrastructure are...
The Advantages of Outsourced Test Services
The business model in today’s competitive world of commerce has shifted over recent years to “services.” Companies like Microsoft, Amazon,...
Technologies Migrate from Both Directions to AP Processes
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