Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November 13, 2019, two well-known industry experts, Anand Joshi and Tom Dillinger, addressed today’s hot topics —neural networks and System-on-Chip (SoC) design challenges — with short, but very informative presentations. Can We Build Neural Networks That Solve AI Chipset Power... »
“We believe that materials science changes the world,” declared Indium Corporation’s Andy Mackie during our recent sit-down together at IMAPS 2019 in Boston, MA. Even though I am a chemical engineer myself, and not a materials scientist, Andy Mackie, Ph.D., senior product manager, is reaching the choir, one engineer to another, right from the start, talking about Indium Corporation’s mater... »
The trade show floors at the combined SEMICON Europa and Productronica events can be daunting. In past years, we’ve focused our visits on the SEMICON Europa exhibitor floor, but as the lines fade between front-end processes, advanced packaging, and board assembly, getting the whole story called for visits to the Productronica halls as well. We had some great discussions about recent mergers, col... »
What a week we just had at the Munich Messe in Germany! If you’ve never had the chance to attend SEMICON Europa and Productronica simultaneously, I highly recommend you put it on your must-do list. Not only will you reach your daily step goal, but you’ll also learn about the latest in technology innovation, see how integrated the electronics supply chain has become, and get to meet with many o... »
Samsung reports that they have seen increasing interest in multi-die integration (what they call MDI) for markets such as artificial intelligence (AI) and high-performance computing (HPC). They also report a need for new electronic design automation (EDA) solutions because the traditional design doesn’t fully address the latest power and signal noise challenges. Advanced packaging technologi... »
Severine Cheramy, Director 3D Business Development, at CEA-Leti, recently brought key partners of Leti’s 3D-IC programs together at the 6th 3D VLSI Open Workshop to give an overview of their accomplishments and to demonstrate synergies between their joint efforts. The event took place in mid-October at The DoubleTree Hotel in San Jose. Leti and ST Microelectronics: Leaders in 3D VLSI Cheramy wel... »
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out the latest supplier offerings to support technology trends, and to spread the word about our new community membership opportunities on 3D InCites. But I’ll get to that part in a bit (or if your curiosity gets the better of you, scroll to the bottom.) While we didn’t get to all the exhibitors (... »
Co-located with productronica in Munich, Germany, SEMICON Europa attracts and connects industry-leading technology companies from every segment of the European microelectronics industry. Held November 12-15, this year’s events will expand attendee opportunities to exchange ideas and promote technological progress featuring the most advanced and innovative electronics manufacturing platform in ... »
“The die-attach equipment market is showing a 6% CAGR between 2018 and 2024”, announces Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea. “This industry will reach US$1.3 billion by 2024, fueled by the assembly and packaging opportunities created by semiconductor megatrends.” The latest semiconductor manufacturing report from Yole Développem... »
At IWLPC 2019, the fan-out panel-level packaging (PLP) debate continued in another of Jan Vardaman’s famous lively panel discussions, which was co-moderated by PLP technology expert, Tanja Braun, Fraunhofer IZM. Panelists were John Hunt, ASE; Joseph Dang, AT&S; Keith Best, Rudolph Technologies; Tim Olson, Deca Technologies. Fan-out PLP (FO PLP) has been a hot topic on the conference circui... »
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