Sustainability 101: What Good Are Awards?
Jan 23, 2023 · By Julia Goldstein · 3D In-Depth, Blogs, From Different Dimensions
Design View all
Forging a New Future for 3D IC Design and Architecture
The semiconductor industry’s ability to coax more and more performance out of a chip has produced the most significant innovations of our modern era. We are starting to test the limits of how much we can squeeze onto a tiny piece of silicon, according to Sanjay Bali, vice president of...
Building a Dense 3D-IC System: Power Challenges
Recently, there has been a very healthy discussion on whether Moore’s law is still valid. While the arguments fly from both sides, there is one thing that everyone agrees on – chiplets are the solution to the need to constantly increase the functionality of SoC, while also reducing cost. Whether...
Devices View all
How AiP Technology Helps Enable 5G and More
For 5G smartphones and other millimeter-wave (mmWave) applications, antenna integration, either through antenna-in-package (AiP) or antenna-on-package (AoP) technologies, simplifies the challenges associated with designing products that operate at these high frequencies. A variety of AiP/AoP design methodologies provide the required form, fit, and function for these applications and can include...
System-on-Chip Disintegration is Underway
We have known for some time that with scaling coming to an end the industry would need to find another way to continue moving forward. One of the options is known as SoC disintegration, which is when a system-on-chip (SoC) is disintegrated into its functional parts and then connect these...
Latest Posts
SiC MOSFET Challenges, Demand and Industrialization of Test & Burn-in
The coming-of-age and breakthroughs offered by silicon carbide (SiC) MOSFETs, as well as demand that is outstripping supply are rapidly...
Update on the UCIe™ from ITC 2022
In 1965 Gordon Moore proclaimed that there would be a “’Day of Reckoning’ when it may prove to be more...
Chiplet Designs and Heterogeneous Integration Packaging
System-on-Chip (SoC) integrates ICs (by reducing the feature size) with different functions such as central processing unit (CPU ), graphic...
Materials Science Solutions for Electronics Sustainability
This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenient...
Thermal Analysis Techniques to Improve High Density Semiconductor System Performance
Thermal problems in semiconductor electronic systems often go unnoticed and cause failures. Although thermal problems can be understood and avoided...
Maskless Lithography Addresses Shift Toward Heterogeneous Integration and 3D Packaging
Moving from 2D scaling to heterogeneous integration and 3D packaging is ever-more critical to improving semiconductor device performance. In recent...
Development of Innovative Advanced Packaging Materials for System in Package
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are...
Understanding Wafer Applications in Surface Metrology
This detailed blog covers how wafers are manufactured and processed, what makes a perfect wafer, and which surface metrology approaches...
Contributing to a Greener Semiconductor Industry
Recently we read an interesting article here on 3D InCites about the role secondary markets play in contributing to a...
Considerations in Power Amplifier Package Design
Understanding the role of compromises and trade-offs in the design process Electronic packages serve many purposes including protecting, connecting, and...
Design-for-test for 3D IC Designs Comes of Age
In the era of more-than-Moore, 3D IC is the new scaling approach adopted by the marketplace. Progress has been made...
Advanced Packaging – Measuring Deep Etch Trenches
Adoption of advanced packaging is accelerating as the benefit of the classic Moore’s Law transistor shrink diminishes on a monolithic...
Metrology in Advanced Packaging
With the dawn of chiplet integration, advanced chip manufacturing and advanced packaging technologies are more complex than ever. Dies are...
Adaptive Control: The “Holy Grail” in Semiconductor Smart Manufacturing
Artificial intelligence and machine learning (AI/ML) can have various applications in smart manufacturing for semiconductor fab, advanced packaging, and electronics...
Electronics Packaging – From Afterthought to Product Differentiator
Electronics Packaging vs. Advanced Packaging Electronics packaging is generally divided into three major areas, traditional packaging – also called standard...
Maximize Large Volume Failure Analysis Throughput with Parallel Processing of Laser Ablation and Plasma FIB
Determining the causes of failures in semiconductors often requires removing overlying material to expose the failed circuit element for high-resolution...
ML/AI in Semiconductor Packaging and Electronics Manufacturing
As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing....
Autonomous Vehicles Drive AI Advances for Edge Computing
Advances in Edge Computing Must Innovate for Autonomous Vehicles to Realize Their Potential Large numbers of sensors, massive amounts of...
Artifact-free Decapsulation of 2.5D and 3D Advanced Packages
As semiconductor devices are subject to increasingly higher quality and reliability standards, extensive measures must be taken to ensure these...