A Legacy of Innovation: Celebrating 50 Years of VIEW Micro Metrology
Aug 07, 2026 · By VIEW Micro Metrology · 3D In-Depth, Design, Processes and Technology, Test and Inspection
Design View all
Siemens advances self-verifying agentic AI workflows for semiconductor and PCB design
Combines Siemens’ EDA expertise and software with NVIDIA AI infrastructure and software to improve result quality, time-to-results, tool-calling reliability and token efficiency for long-running engineering workloads Enables agentic AI workflows that help engineers improve productivity and design quality across the electronic design automation (EDA) lifecycle Delivers more predictable, trusted outcomes...
SPM Wafer Cleaning for Advanced Semiconductor Manufacturing
Wafer cleaning is one of the most critical steps in the semiconductor process flow, especially as dimensions continue to shrink to below the 1-nanometer (nm) node. Photoresist residue and particulates can reduce yields in large-die AI chips, impacting the performance of the final product or causing the chips to be scrapped. The sulfuric acid hydrogen peroxide step, or sulfuric peroxide mixture (SPM), is essential for removing organic contaminants from post-etch substrates and ion-implanted films, as well as for platinum silicide residue...
Devices View all
How Implantable Brain-Computer Interfaces Are Pushing the Boundaries of Precision Die Bonding
A patient who can no longer speak generates text directly from neural activity. A patient with paralysis controls a cursor using thought alone. Behind demonstrations like these is a difficult engineering problem: how do you assemble electronics delicate enough to interact with the human brain, while keeping them stable inside...
Navy’s Directed Energy Systems Integration Lab to Train Sailors on Laser Weapons
By Thomas McMahon Naval Surface Warfare Center, Port Hueneme Division, CA Sailors can now get certified in operating and maintaining the fleet’s most prevalent directed energy system through a new training program at Naval Surface Warfare Center, Port Hueneme Division (NSWC PHD)’s Directed Energy Systems Integration Laboratory (DESIL), with the first...
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Optimizing Bond Line Thickness for Maximum Heat Transfer
Tech Tip from Master Bond In thermal interface applications, bond line thickness is one of the most critical—and often overlooked—factors...
Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure
$1.5 Billion Multi-Year Advanced Packaging and Development Agreement to Support Expansion of Amkor’s U.S. Advanced Packaging Capacity Amkor Technology, Inc. today...
Thermal Process and Equipment for MLCC Manufacturing: From Binder Burnout and Co-Firing to Termination Firing
Multilayer ceramic capacitors (MLCCs) are widely used electronic components made by stacking many thin ceramic dielectric layers with internal electrodes....
Why Is Your Power Supply Ripple So Large?
What is Ripple? Since a DC regulated power supply is typically derived from an AC source via rectification, filtering, and...
Engineering Professor Wins NSF Grant to Advance Wireless Communications
Professor Hualiang Zhang, left, seen here working on remote sensing measurement project on North Campus, is part of an international...
The Most Comprehensive 5 Hardware Testing Processes, Not a Single One Can Be Missed Hardware Inspection Before Powering On
Hardware Inspection Before Powering On When a circuit board is completely soldered, when checking whether the circuit board can work...
Why Silicon Photonics Packaging Now Holds Half the Product Value
A finished chip, built on a two-nanometer process, tested and working, gets thrown in the bin. Not because the silicon...
VIEW Systems Labs – Applications Progress Around the World!
VIEW Micro Metrology is having a productive season in our systems labs in both the United States and Asia, as...
Avoiding Common Failure Modes in Bonding Applications
Understanding common failure mechanisms allows engineers to implement preventive measures during the design and qualification phases. Delamination and Bond Failure...
SPM Wafer Cleaning for Advanced Semiconductor Manufacturing
Wafer cleaning is one of the most critical steps in the semiconductor process flow, especially as dimensions continue to shrink to below the 1-nanometer (nm) node. Photoresist residue and particulates can...
Die Bonding
Die bonding is a manufacturing process used in the packaging of semiconductors. It is the act of attaching a die (or...
Siemens partners with Databricks and FFT to turn production data into scalable AI-driven insights
Siemens Industrial Edge and FFT DataBridge connect shopfloor and plant data directly to the Databricks Platform – no IoT middleware...
Peer viewpoint: electrification and autonomous vehicles are driving a semiconductor revolution
Introduction On average, cars today contain 1,700 semiconductor chips, underscoring how crucial they are to automobiles. Semiconductor chips support a...
UCLA Samueli School of Engineering launches $125 million semiconductor hub with top industry leaders
By Christine Wei-li Lee Key takeaways A first-of-its-kind Semiconductor Hub at the UCLA Samueli School of Engineering aims to accelerate...
Accelerating 2nm & Advanced Packaging through global collaboration
AI is transforming the next-generation advanced foundry for 2nm chips, thus reshaping the semiconductor industry, writes Rozalia Beica. The semiconductor...
MasterSil 153:Used for Bonding Silicone and Metalin Strain Sensor
Overview of MasterSil 153 Master Bond MasterSil 153 is a two-component paste silicone compound for high-performance bonding and sealing applications....
Packaging: The Make-or-Break Factor in mmWave Performance
Millimeter-wave (mmWave) technology occupies the short-range, high-frequency portion of the electromagnetic spectrum—typically defined as 30 to 300 GHz—and is enabling...
From AI momentum to manufacturing reality
AI is moving past the hype, and the first real pressure is showing up in manufacturing. As demand accelerates across...
The Need for Speed: How Domestic Manufacturing Accelerates Delivery of Mission-Critical Technology
By James S. B. Chew, Vice President and General Manager, Intel Government Technologies The future of US defense capability hinges...