3D In-Depth

Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1)

Heterogeneous Integration Versus Dimensional Scaling: One Year In (Part 1)

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)At SEMICON West 2016, the big story was the end of the ITRS Roadmap for dimensional scaling according to Moore’s Law and the birth of the Heterogeneous Integration Roadmap (HIR). There were many reasons for this: the cost of continued scaling vs. the reduced performance benefits, the advantages of being able to heterogeneo... »

Announcing the Winners of the 2017 3D InCites Awards!

Announcing the Winners of the 2017 3D InCites Awards!

The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as seven nominees in some fields (supplier of the year), and tallied just over 17,529 votes in total! We also saw a considerable increase in nominees using social media to promote their participation in this year’s event. As heterogeneous integration, fueled by advanced packaging and 3D integration, mov... »

Tech Session Highlights from ECTC 2017

Tech Session Highlights from ECTC 2017

Françoise promised in her recent blog that my ECTC blog would follow shortly. Finally, after attending DAC in Austin as well as the iMAPS’ SiP Conference in California’s Wine Country and shortly before attending Semicon West in San Francisco, I found some time to report what I saw and learned at ECTC 2017 in Orlando. ECTC offered six parallel tracks for the about 1500 attendees. I could of co... »

Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP

Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP

  For several years now, Herb Reiter, eda2asic, and John Ferguson, Mentor Graphics, have been evangelizing about the necessity of assembly design kits (ADK), similar to the process design kits (PDKs) for chip designers, to help drive ecosystem capabilities for what is collectively now being called high density advanced packaging (HDAP), comprising 2.5D IC, 3D IC and high density fan-out wafer... »

Impressions from ECTC 2017

Impressions from ECTC 2017

Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the fan-out plenary session of ECTC 2017, so tossed my stuff in my room and headed on in (wearing jeans, no less!) You can read about that here. Afterward, I had a bite to eat with industry colleagues. Back in my room at 11:15 to call it a night, only to find it raining ON my bed thanks to a leak... »

FOPLP

Fifty Shades of Fan-out Discussed at ECTC 2017

The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took place in Orlando at the Walt Disney World Swan and Dolphin Resort. The buzz started during the Tuesday evening plenary session, where panelists Douglas Yu, TSMC, Tim Olson, Deca Technologies; Steffen Kroehnert, NANIUM; Rolf Aschenbrenner... »

The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory

The Dual-Gate Thin Film Transistor for 3D Dynamic and Flash Memory

Data is now the world’s most valuable resource. Solid-state storage of data is driving an innovation revolution built upon 50 years of progress. Here we look at the dual-gate thin film transistor (DG-TFT), an extremely versatile solid-state data storage device that can be used in monolithic 3D as either a flash memory or a dynamic memory element. It has the potential to provide a path not only ... »

Meet Us at ECTC 2017 in Walt Disney World

Meet Us at ECTC 2017 in Walt Disney World

As each year passes, advanced packaging technologies offer more versatile solutions for cost-effective low-end applications, while 3D integration advancements continue to improve the performance of leading-edge products. This will be reflected at the 67th Annual Electronic Components and Technology Conference (ECTC), which takes place May 30, June 2, 2017, at the Walt Disney World Swan & Dolph... »

Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA

Part 2: IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA

The keynotes outlined in Part 1 of IMAPS DPC 2017 Covers Range of High-tech Topics, including EDA were obviously very important, but a relatively small part of the entire conference. After the two keynotes on Tuesday morning, I listened to YOLE’s presentation, delivered by Santosh Kumar, and learned that the three big memory vendors (Samsung, Micron, and Hynix) jointly hold over 200 TSV patents ... »

The Advancement of Device Packaging – A Resume on IMAPS DPC 2017

The Advancement of Device Packaging – A Resume on IMAPS DPC 2017

As part of the organizing committee, we believe this year’s IMAPS Device Packaging Conference really fulfilled what the announcement promised – the largest conference dedicated to the full spectrum of 3DIC and packaging, fan-out technologies and MEMS/sensors. We enjoyed 12% attendee growth over 2016, welcoming nearly 600 attendees from 20 countries, in addition to a 12th consecutive so... »

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