Erik Jan Marinissen is Principal Scientist at the world-renowned research institute imec in Leuven, Belgium, where he is responsible for research on test and design-for-test, covering topics as diverse as TSV-based 3D-stacked ICs, silicon photonics, CMOS technology nodes below 10nm, and STT-MRAMs. In addition, he is Visiting Researcher at Eindhoven University of Technology, the Netherlands. Previously, he worked at NXP Semiconductors and Philips Research Laboratories in Eindhoven. Marinissen holds an MSc degree in Computing Science (1990) and a PDEng degree in Software Technology (1992), both from Eindhoven University of Technology. He is (co-)author of 280+ journal and conference papers and (co-) inventor on twelve granted US/EP patent families. Marinissen is recipient of the Most Significant Paper Awards at ITC 2008 and ITC 2010, Best Paper Awards at the Chrysler-Delco-Ford Automotive Electronics Reliability Workshop 1995 and the IEEE International Board Test Workshop 2002, the Most Inspirational Presentation Award at the IEEE Semiconductor Wafer Test Workshop 2013, and the National Instruments Engineering Impact Award 2017 in the category ‘Electronics & Semiconductors’. He served as Editor-in-Chief of IEEE Std 1500 and as Founder and Chair, now Vice-Chair of the IEEE Std P1838 Working Group on 3D test access. Marinissen is founder of the workshops ‘Diagnostic Services in Network-on-Chips’ (DSNOC), DATE’s Friday Workshop on 3D Integration, and the IEEE ‘International Workshop on Testing Three-Dimensional Integrated Circuits’ (3D-TEST). He has been Program Chair of DDECS 2002, ETS 2006, 3D-TEST 2009-15, and DATE 2013, and General Chair of ETW 2003, DSNOC 2007-08, 3DIW 2009-10, and serves on numerous conference committees, including ATS, DATE, ETS, ITC, ITC-Asia, LATS, and VTS. He serves on the editorial boards of IEEE ‘Design & Test’ and Springer’s ‘Journal of Electronic Testing: Theory and Applications’. He is a Fellow of IEEE and Golden Core Member of Computer Society.
