IFTLE 625: If Intel Ohio is on Hold – Do They Still Get CHIPS Act Funds?
Apr 22, 2025 · By Phil Garrou · Blogs, Packaging IFTLE
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IFTLE 622: US Joint Consortium; Intel Rumors
When I was first asked why I had not yet covered the “US Joint Consortium” I responded “tongue in cheek”...
IFTLE 621: TSMC Chip and Package Activity in the U.S.
Commercial Times reports that TSMC’s Arizona wafer fab, Fab 21 Phase 1, has officially entered mass production on its 4nm...
IFTLE 620: Micross Acquires Integra; Hynix HBM booked through 2025
Micross, a portfolio company of Behrman Capital, announced on January 15, that it has acquired Integra Technologies, headquartered in Wichita,...
IFTLE 619: CHIP Flagship Facilities include Albany NY, Sunnyvale CA and Tempe AZ
CHIPS for America has announced three anticipated CHIPS for America research and development (R&D) flagship facilities. These state-of-the-art CHIP flagship...
IFTLE 618: UCIe Standard vs. UCIe Advanced vs. UCIe 3
Multi-die systems are driving the need for standardized die-to-die interconnects. Several industry alliances have come together to define such standards:...
IFTLE 617: SK Hynix considers 2.5D packaging business with Amkor
Will TSMC, SK Hynix, and Amkor be an Onshore Source for Nvidia? SK Hynix learned to package its own stacked...
IFTLE 616: Broadcom eXtreme Dimension System in Package (XDSiP™)
Broadcom has recently announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI...
IFTLE 615: TSMC Evolves CoWoS Technology Promising 9x Reticle Size by 2027
TSMC recently announced at its Open Innovation Platform (OIP) Ecosystem Forum in Europe that its chip-0n-wafer-on=substrate (CoWoS) packaging technology will...
IFTLE 614: What’s in Store for Intel’s Future? Update on NAPMP Proposers Day
Intel Reaches The Fork in the Road Digitimes had some interesting recent opinions about the future of Intel. Let’s take...
IFTLE 613: Solder Joint Reliability of Glass Core Substrate Assemblies
We have seen considerable global activity focused on developing glass core substrate assemblies and interposers, yet, as some of us...
IFTLE 612: Congratulations to the IMAPS 2024 Society Award Winners
Figure 1 shows a listing of the 2024 IMAPS Society Award winners and the feature photo above are some of...
IFTLE 611: Amkor Clarifies Arizona Facility Activity
Wolfspeed & Hemlock Semiconductor Get Their CHIPS Act Share Arizona Facility to Focus on High Performance Computing In IFTLE 577...
IFTLE 610: Looking for Silicon Interposers? Try GlobalFoundries!
If you have been looking for reliable, dependable sources of silicon interposers in anything beyond prototype quantities – like I...
IFTLE 609: TSMC/Amkor U.S. Advanced Packaging Partnership; Reshoring at IMAPS 2024
TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor...
IFTLE 608: Is Chip Packaging the New Front on the US-China CHIP WARS?
US-China CHIP WARS Now Encompass Advanced Packaging In the Aug 21st issue of Asia Times, Scott Foster wrote an interesting...
IFTLE 607: Why Nvidia’s Blackwell is Having Issues with TSMC CoWoS-L Technology
Plus: UCIe 2.0 for 3D stacking; Samsung slows down Texas expansion Nvidia’s Blackwell Experiences...
IFTLE 606: Is Intel CHIPS Act Money Being Delayed?
Also: hynix Advanced Packaging in Indiana; Fraunhofer Chiplet Center; Call to Unify Advanced Packaging Standards Is the U.S. Government Becoming...
IFTLE 605: Helping Lead the Way for Chip Packaging in India
India is a rapidly growing consumer of semiconductors. Its market was $22 billion in 2019 and is expected to nearly...
IFTLE 604: Aspencore’s Virtual Chiplet Conference
In July, Aspencore held a two-day virtual chiplet conference through its publications EE Times and embedded, Chiplets: Building a Future...
