Packaging IFTLE

IFTLE 425: Deca FOWLP is Going Mainstream; Highlights from Hot Chips

IFTLE 425: Deca FOWLP is Going Mainstream; Highlights from Hot Chips

Deca Technologies has confirmed that its M-Series™ fan-out wafer-level packaging (FOWLP) technology has been adopted by Qualcomm for power management integrated circuit (PMIC) devices in Samsung’s S10, the Xiaomi Mi 9 and LG G8 smartphones. And in other news, advanced packaging was the Cinderella Story at Hot Chips 2019. »

 IFTLE 424: Fingerprint Sensors Are Going Ultrasonic 

 IFTLE 424: Fingerprint Sensors Are Going Ultrasonic 

IIFTLE is always on the lookout for technologies that will require advanced packaging solutions. Fingerprint sensors for today’s latest smartphones appear to be one of those applications. Packaging for Fingerprint Sensors DIGITIMes recently reported that  the manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require extensive wafer-level backend services... »

IFTLE  423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing

IFTLE  423: GLOBALFOUNDRIES and ARM Turn to 3D Chip Stacks for High Performance Computing

A year after GLOBALFOUNDRIES cancels its 7nm program, the company is developing 3D chip stacks fabricated using GLOBALFOUNDRIES’s 12nm FinFET process and features ARM’s mesh interconnect technology in 3D. This alternative to costly node shrinking may help GLOBALFOUNDRIES maintain a market presence. »

IFTLE 422: Is Advanced Packaging Production Returning to the US by SHIP?

IFTLE 422: Is Advanced Packaging Production Returning to the US by SHIP?

Is advanced packaging production coming back to the USA?  The Navy (i.e. NSWC Crane) is currently seeking proposals from the industry for the development of technical and business plans to establish a secure on-shore design, assembly, and test capability. This facility should support the heterogeneous integration of state-of-the-art (SOTA) commercial integrated circuits (ICs) with defense specifi... »

IFTLE 421: Intel Showcases Co-EMIB Advanced Packaging Architecture

IFTLE 421: Intel Showcases Co-EMIB Advanced Packaging Architecture

Building on its previous announcements of embedded interconnect bridge (EMIB) and Foveros technologies, Intel recently provided details on three new enabling technologies for advanced packaging: Co-EMIB, managed data input/output (MDIO) and omnidirectional interconnect (ODI). »

IFTLE 420: Low-Loss NCF and Laser-Assisted TCB

IFTLE 420: Low-Loss NCF and Laser-Assisted TCB

Since it first appeared several years ago, IFTLE has been a big-time proponent of pre-applied non-conductive film (NCF) combined with thermal compression bonding (TCB) for fine-pitch bump interconnection. This technology is now being used in mass production for 3D memory die stacking DRAM (3DS DRAM) and high bandwidth memory (HBM) and appears to have become entrenched as technology-of-choice for t... »

IFTLE 419: Update on GlobalFoundries Foundry Status and Cree’s SiC Plans     

IFTLE 419: Update on GlobalFoundries Foundry Status and Cree’s SiC Plans     

Is GlobalFoundries looking for an exit or simply shedding parts of the company that do not fit its new focus? Back in IFTLE 406 we started discussing the persistent rumors that GlobalFoundries  might be “chopped up on the auction block and its businesses sold to specialty foundries that want to supply in those specific areas.” There have been rumors that Abu Dabi Investment Corp. (ADIC), the ... »

IFTLE 418: Xperi DBI Ultra for D2W Hybrid Bonding

IFTLE 418: Xperi DBI Ultra for D2W Hybrid Bonding

Requirements for interconnect pitches of 20µm and below is expected to be the norm in the future. Since typical solder bump technology is not expected to be able to meet those requirements, many companies have been examining Cu-to-Cu direct bonding. Cu-to-Cu bonding can be achieved through one of two ways: Cu-to-Cu thermal compression bonding low-temperature direct bond interconnect, commonly ref... »

IFTLE 417: Passing the Advanced Packaging Baton to TSMC’s 3D-MiM                                                

IFTLE 417: Passing the Advanced Packaging Baton to TSMC’s 3D-MiM                                                

As IFTLE has been predicting for many years, the baton is once again being passed. In the early days of advanced microelectronics, packaging breakthroughs were developed by integrated device manufacturers like IBM, DEC, NEC, Fujitsu, etc. In the early 2000s, this baton was passed to the OSATS like Amkor, ASE, SPIL, and STATSChipPAC. As it became more obvious that advanced packaging was going wafer... »

IFTLE 416: What’s Coming Next on the IC Front End? Samsung Gates All Around

IFTLE 416: What’s Coming Next on the IC Front End? Samsung Gates All Around

IFTLE has been saying for a few years that the decades-long scenario of moving from one node to the next was, for most if not all, dead and, that we had to keep our eyes open for what the next IC technology would be, because as we all know packaging only exists to protect and assist chips function. Based on the 2019 Samsung Foundry Forum, which took place this May in Santa Clara, we certainly need... »

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