IFTLE 541: Predicted Locations for CHIPS Innovation Hubs; Skywater/BRIDG IBAS Funding
Nov 28, 2022 · By Phil Garrou · Blogs, Packaging IFTLE
Latest Posts
IFTLE 538: Kyocera Details HDBU and HDI Processing and Looks at US On-shoring
As we noted in IFTLE 537, prior to the 2022 IMAPS conference in Boston earlier this month, IMAPS hosted a...
IFTLE 537: 2022 IMAPS Society Awards Go to Advanced Packaging Superstars
IMAPS held its 55th International Symposium on Microelectronics in Boston, October 4-6 2022. The conference drew some 900+ attendees hungry for some...
IFTLE 536: Government-sponsored Advanced Packaging Programs Taking Shape
In IFTLE 534 we discussed the DARPA Next Generation Microelectronics Manufacturing (NGMM) program which will attempt to establish a domestic...
IFTLE 535: The Resurgence of U.S. Semiconductor Fabs
Leading-edge semiconductor fabs haven’t been built in the U.S. for a while but that’s about to change. Let’s look at...
IFTLE 534: A Look at DARPA’s Next Generation Microelectronics Manufacturing (NGMM) Program
DARPA often selects its research efforts through the Broad Agency Announcement (BAA) process. The Microsystems Technology Office (MTO) at DARPA...
IFTLE 533: Fan-out, Chips-Last High-Density Packaging at Unimicron
Every now and then you run across a paper or presentation, and you say to yourself, “This clearly explains this...
IFTLE 532: Fraunhofer IZM Examines Panel Level Processing Technology Limits
Continuing our look at presentations at the 2022 ECTC, who better to examine the question “Panel Level Packaging – Where...
IFTLE 531: CHIPS and Science Act; TSMC Phoenix; Details on Apple M1
CHIPS and Science Act The CHIPS and Science Act will provide $54.2B in funding for the semiconductor and wireless industry,...
IFTLE 530: Do Chiplets Increase Security Risks? Sony and Samsung Battle for Leadership in CIS
For those of you that haven’t seen it yet, a recent July 7th post by Ed Sperling is must read...
IFTLE 529: More Hybrid Bonding from ECTC 2022
Continuing our look at key Hybrid Bonding (HB) papers at the recent ECTC 2022 in San Diego, CA. Applied Materials...
IFTLE 528: 72nd IEEE ECTC: A Showcase for Hybrid Bonding
The 72nd IEEE Electronic Components and Technology Conference (ECTC) took place at the end of May in San Diego CA....
IFTLE 527: 2nm Chips Scheduled for 2025; Advanced Packaging Becoming More Powerful Industry Segment
TSMC 2nm Chips Coming in 2025 At its recent North America Technology Symposium TSMC announced that it will begin volume...
IFTLE 526: NIST Funds SEMI/UCLA CHIPS HIR Roadmap; China Dumps US Computers
Another Heterogeneous Integration Roadmap The UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) and SEMI have announced that they have been awarded...
IFTLE 525: Activity at ASE, Amkor, Yole Développement and Adeia (Xperi)
Let’s continue our look at the key presentations at IMAPS DPC 2022 from ASE, Amkor, Yole Développement and Adeia. ASE...
IFTLE 524: IMAPS Examines the Dept. of Defense SHIP Program
As part of the 2022 IMAPS Device Packaging Conference, the IMAPS Global Business Council (GBC) devoted its 2022 session to...
IFTLE 523: What is the #1 Wafer-level Fan-out Technology In Production?
One of the most popular booths at the recent IMAPS DPC was that of wafer-level fan-out technology provider, Deca. Their...
IFTLE 522: TSMC’s Morris Chang on US On-Shoring: Is Huawei Using Packaging to Avoid US Sanctions?
Morris Chang, retired long-time CEO of TSMC, was recently quoted in the Taipai Times as saying “US efforts to increase...
IFTLE 521: AMD and Heterogeneous Integration
IMAPS DPC 2022 This year’s IMAPS Device Packaging Conference (DPC) was live once again, though most of the live attendees...
IFTLE 520: Intel Responds to the Universal Chiplet Interconnect Express
In IFTLE 517, we discussed the upcoming standardization in the chiplet world with the passage of the Universal Chiplet Interconnect...