IFTLE 633: What’s Inside Apple’s A20 Chip? Also: Introducing Intel EMIB-T
Jul 08, 2025 · By Phil Garrou · Blogs, Packaging IFTLE
Latest Posts
IFTLE 630: Micron HBM; More GaN in RF Devices?
HBM is one of the hottest markets right now thanks to the tremendous demand for AI GPU computing power. HBM...
IFTLE 629: GlobalFoundries New York Advanced Packaging and Photonics Center
Earlier this year GlobalFoundries (GF) announced a New York Advanced Packaging and Photonics Center (NY APPC) billed as “…the first...
IFTLE 628: TSMC System-on-Wafer in the Works; Update on Intel Layoffs
Dr. Cliff Hou, Senior Vice President and Deputy Co-COO (above), spoke at this year’s 2025 Technology Symposium. highlighting TSMC’s continued...
IFTLE 627: Amkor Studying Hybrid Panel Level Technology
In IFTLE 626 we looked at the Yole article that addressed the question of whether panel level processing was finally...
IFTLE 626: Rumors Swirl about Intel and TSMC; Update on Panel Level Processing (PLP)
Is TSMC Acquiring 20% of Intel fabs? Reports are that Intel and TSMC have reached a preliminary agreement to form...
IFTLE 625: If Intel Ohio is on Hold – Do They Still Get CHIPS Act Funds?
An aerial view from February 2024 shows construction progress at Intel’s Ohio One campus of nearly 1,000 acres in Licking...
IFTLE 624: TSMC widens lead on Samsung, Leads in 2nm Chip Production
TSMC widens edge over Samsung The Taipai Times recently offered the following interesting discussion concerning the TSMC versus Samsung rivalry:...
IFTLE 623: TSMC Advanced Packaging Coming to the U.S.A.
TSMC Invests Further in Arizona Taiwan Semiconductor Manufacturing Corporation (TSMC) plans to make a $100B investment in the United States...
IFTLE 622: US Joint Consortium; Intel Rumors
When I was first asked why I had not yet covered the “US Joint Consortium” I responded “tongue in cheek”...
IFTLE 621: TSMC Chip and Package Activity in the U.S.
Commercial Times reports that TSMC’s Arizona wafer fab, Fab 21 Phase 1, has officially entered mass production on its 4nm...
IFTLE 620: Micross Acquires Integra; Hynix HBM booked through 2025
Micross, a portfolio company of Behrman Capital, announced on January 15, that it has acquired Integra Technologies, headquartered in Wichita,...
IFTLE 619: CHIP Flagship Facilities include Albany NY, Sunnyvale CA and Tempe AZ
CHIPS for America has announced three anticipated CHIPS for America research and development (R&D) flagship facilities. These state-of-the-art CHIP flagship...
IFTLE 618: UCIe Standard vs. UCIe Advanced vs. UCIe 3
Multi-die systems are driving the need for standardized die-to-die interconnects. Several industry alliances have come together to define such standards:...
IFTLE 617: SK Hynix considers 2.5D packaging business with Amkor
Will TSMC, SK Hynix, and Amkor be an Onshore Source for Nvidia? SK Hynix learned to package its own stacked...
IFTLE 616: Broadcom eXtreme Dimension System in Package (XDSiP™)
Broadcom has recently announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI...
IFTLE 615: TSMC Evolves CoWoS Technology Promising 9x Reticle Size by 2027
TSMC recently announced at its Open Innovation Platform (OIP) Ecosystem Forum in Europe that its chip-0n-wafer-on=substrate (CoWoS) packaging technology will...
IFTLE 614: What’s in Store for Intel’s Future? Update on NAPMP Proposers Day
Intel Reaches The Fork in the Road Digitimes had some interesting recent opinions about the future of Intel. Let’s take...
IFTLE 613: Solder Joint Reliability of Glass Core Substrate Assemblies
We have seen considerable global activity focused on developing glass core substrate assemblies and interposers, yet, as some of us...
IFTLE 612: Congratulations to the IMAPS 2024 Society Award Winners
Figure 1 shows a listing of the 2024 IMAPS Society Award winners and the feature photo above are some of...
