Microelectronics Commons
The Microelectronics Commons is a Department of Defense (DoD) initiative that aims to create direct pathways to commercialization for U.S. microelectronics researchers and designers. It is a national network designed to:
- Enable sustained partnerships between emerging technology sources, manufacturing facilities, and interagency partners.
- Develop a pipeline of talent to bolster local semiconductor economies and contribute more broadly to the growth of a domestic semiconductor workforce.
- Bridge the microelectronics technological “Valley of Death”.
- Expand domestic microelectronics fabrication capability.
- Enhance the microelectronics education and training pipeline to bolster the microelectronics engineering workforce.
The three main elements of Microelectronic Commons are shown in Figure 1.
With the creation of regional technology hubs, each focusing on key technology areas, the Microelectronics Commons hopes to close the gap between research ideas and the realization of those ideas. Six technology areas critical to the DoD mission were selected as focus areas for the Commons. Each Hub will be advancing U.S. technology leadership in one or more of these areas:
- Secure Edge/Internet of Things (IoT) Computing
- 5G/6G
- Artificial Intelligence (AI) Hardware
- Quantum Technology
- Electromagnetic Warfare
- Commercial Leap Ahead Technologies
Deputy Secretary of Defense Kathleen Hicks recently announced the $238 MM of funding provided under the CHIPS and Science Act.
The eight awardees are:
- Northeast Microelectronics Coalition (NEMC) Hub
Awardee (Hub Lead): The Massachusetts Technology Collaborative (MassTech)
Hub Lead State: Massachusetts
FY23 Award: $19.7 M
- Silicon Crossroads Microelectronics Commons (SCMC) Hub Awardee: The Applied Research Institute (ARI)
Hub Lead State: Indiana
FY23 Award: $32.9 M - California Defense Ready Electronics and Microdevices Superhub (California DREAMS) Hub
Awardee: The University of Southern California (USC)
Hub Lead State: California
FY23 Award: $26.9 M
- Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS) Hub
Awardee: North Carolina State University (NCSU)
Hub Lead State: North Carolina
FY23 Award: $39.4 M - Southwest Advanced Prototyping (SWAP) Hub
Awardee: Arizona Board of Regents on behalf of Arizona State University
Hub Lead State: Arizona
FY23 Award: $39.8 M - Midwest Microelectronics Consortium (MMEC) Hub
Awardee: MMEC
Hub Lead State: Ohio
FY23 Award: $24.3 - Northeast Regional Defense Technology Hub (NORDTECH)
Awardee: The Research Foundation for the State University of New York (SUNY)
Hub Lead State: New York
FY23 Award: $40.0 M - California-Pacific-Northwest AI Hardware Hub (Northwest-AI Hub)
Awardee: The Board of Trustees of the Leland Stanford Junior University
Hub Lead State: California
FY23 Award: $15.3 M
Overall 360+ organizations from over 30 states will be participating in the Commons.
The Microelectronics Commons Annual Meeting was held Oct 17-18 in Washington DC. Details will be forthcoming in IFTLE on hub activities.
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US Commerce Secretary Gina Raimondo discusses the impact of the semiconductor chip shortage at UAW Region 1A office in Taylor, Michigan on November 29, 2021. (Photo Credit- Jeff Kowalsky | AFP | Getty Images)
