Latest Posts
Micross Components Appoints James J. Cannon as President and Chief Executive Officer
Micross Components, Inc. (“Micross” or the “Company”), a global provider of high-reliability microelectronic products and services for aerospace, defense, space,...
PacTech Launches Scalable Modular Wet-Bench System for Advanced Semiconductor Packaging
Nauen, Germany – April 14, 2026 – PacTech – Packaging Technologies GmbH, a global provider of advanced packaging equipment and plating...
From Classroom to Career: Building the Next Generation of Microelectronic Talent
The semiconductor ecosystem is facing a significant workforce gap, with industry demand continuing to grow faster than the available talent...
Packaging the Future of AI – Key Themes from the IMAPS Device Packaging Conference
This year’s annual International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference (DPC) in Arizona was bursting with excitement and acted...
VIEW Micro Metrology: Point of View at Device Packaging 2026
A Commitment to the Next Generation The event opened with a comprehensive series of Professional Development Courses, followed by the...
New AI Hardware and Advanced Packaging Innovations from Adeia at IMAPS DPC 2026
Adeia Inc. (Nasdaq: ADEA), the technology company known for developing foundational innovations that enable next-generation solutions for the semiconductor and...
IMAPS Announces Purchase of the 3D InCites Platform
The International Microelectronics Assembly and Packaging Society (IMAPS) is pleased to announce a major milestone for the Society, with IMAPS...
IFTLE 651: Intel and Amkor Join Forces for EMIB
Amkor and Intel report that they are teaming up for Amkor high volume manufacturing (HVM) of EMIB due to “interest...
Reflections on My Year as the 3D InCites Editorial Intern
Over the past year, my role as the 3D InCites editorial intern has given me a front-row seat to one...
November Member News: Shaping the Future of Semiconductors
November was a dynamic month for the 3D InCites community and the broader semiconductor industry, with companies showcasing innovative technologies, celebrating...
Co-Packaged Optics: Today’s Biggest Packaging Push
Co-packaged optics is one of the most talked about innovations in advanced packaging right now, and it’s for good reason....
IFTLE 647: Micross AIT on Track to Deliver 300mm Bumping Onshore
Continuing our look at program information deemed “OK for public release” at the recent IMAPS Onshoring conference, let’s examine what...
IFTLE 645: ASE Packaging in Koahsiung; Amkor Advanced Packaging in AZ; US-SMC?
ASE to build new packaging facility in Kaohsiung Taipei Times reports that ASE, the world’s biggest chip assembly and testing...
Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona
Expands Investment to $7 Billion Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today...
IMAPS Executive Summit: Advanced Packaging Comes to Silicon Valley
To celebrate the re-boot of Silicon Valley’s IMAPS Chapter, Chair Rozalia Beica, Rapidus, conceptualized and launched – with the help...
IFTLE 641: Is the CHIPS Act Becoming the CHIPS Investment Act?
Plus: TSMC Packaging in AZ; Deca/Microchip/SST Non-volatile Memory Packaging Taiwans Minister of Economic Affairs reports that he received information about...
IFTLE 639: Are Things Worsening for Intel? Will Samsung Add Advanced Packaging in Texas?
Intel Concerns Continue to Grow Long time readers of IFTLE know that we have been following the technical and financial...
IFTLE 631: CHIPS Act Now Under U.S. Investment Accelerator
The U.S. Investment Accelerator was officially established on March 31, 2025, as part of an effort to modernize the investment...
