advanced packaging

Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL Challenges

Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL Challenges

Over the years, the semiconductor industry has relentlessly focused on shrinking gate dimensions to drive performance. This focus has now transitioned to the packaging side as customers are shifting from wire bonding to flip chip for use in wafer level packaging (WLP). According to VLSI Research, about 35% of chips are currently packaged using WLP techniques. Advanced packaging opportunities slowe... »

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on more than 20 informative presentations, where focused experts gave an in-depth view of new and/or improved technologies for 3DIC-related advanced packaging. Before we address these, allow me a one-sentence recap of Part 1’s key message: We no longer have one major application, like mainframes, PCs, a... »

A Tribute to Gilles Poupon, CEA-Leti’s Advanced Packaging Pope

A Tribute to Gilles Poupon, CEA-Leti’s Advanced Packaging Pope

Sitting in the bus on the way back from Grenoble to Airport Lyon, I am reflecting the last two days during which we honored Gilles Poupon, the Advanced Packaging “Pope” of CEA Leti. Upon his retirement at the end of November 2017, somehow an era ends. I have known Gilles for quite a long time: He reminded of the first time we met. It was 2003 in Munich. Gilles was a member of the CEA delegatio... »

Rudolph Announces Multiple Customers’ Acceptance  of its Firefly Inspection System

Rudolph Announces Multiple Customers’ Acceptance of its Firefly Inspection System

Wilmington, Mass. (September 12, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously announced orders from multiple semiconductor manufacturers, are now qualified for production. The Firefly Inspection Systems provide high-resolution visual and non-visual inspection in a variety of advanced packaging processes, inclu... »

Take-Aways from Test Vision 20/20 Workshop and SEMICON West Advanced Packaging Sessions

Take-Aways from Test Vision 20/20 Workshop and SEMICON West Advanced Packaging Sessions

I am convinced that increasing device complexity, higher quality requirements (e.g. automotive and medical), as well as the need for faster production ramp-ups, will force our industry to pay even more attention to design-in quality, expand self-test, even add redundancy to control logic and interconnects. In addition, wafer-probe and final test need to be expanded. Therefore, attending the Test V... »

Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products

Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of +7% between 2016 and 2022. “Advanced packaging is showing a total revenue CAGR higher than the total packaging industry (3-4%), semiconductor industry (4-5%) and generally the global electronics industry (3-4%)”, comments Andrej Ivankovic, Technology & Mar... »

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria. Representing a 20 million Euro investment, the expansion will include the construction of a new building that provides additional production and te... »

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image sensors FLORIAN, Austria, May 16, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved an industry milestone with more than 1100 EVG wafe... »

Advanced Substrates; Key Enabler of Future Advanced Packaging Solutions

Advanced Substrates; Key Enabler of Future Advanced Packaging Solutions

“Advanced substrates are the key interconnect component of advanced packaging architectures,” comments Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging & Semiconductor Manufacturing at Yole Développement (Yole). Indeed advanced substrates are critical in enabling future products and markets. To answer to technology evolution and market needs, Yole’s advanced packagi... »

The Advanced Packaging Times, they are A-Changing…or Are They?

The Advanced Packaging Times, they are A-Changing…or Are They?

It’s been a nearly a month since the 2017 IMAPS Device Packaging Conference and Global Business Council, so I’ve had plenty of time to mull over the many presentations and conversations focused on advanced packaging trends. The winds of change are blowing ever so slightly from year’s past. You had to listen carefully, and in some cases, read between the lines so not to miss them. I could rep... »

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