advanced packaging

Advanced Packaging Industry: A Wonderful World

The semiconductor industry is at a turning point. The slowdown in CMOS scaling, coupled with escalating costs, has prompted the industry to rely on integrated circuit (IC) packaging to extend the benefits of the More-than-Moore era. Thus, the advanced packaging industry has entered its most successful period, boosted by widespread needs for better integration; the slowdown of Moore’s law; and me... »

Analysis Highlights Impact of Trade Friction on Electronics Industry

Analysis Highlights Impact of Trade Friction on Electronics Industry

The impact of the ban on selling components to Huawei combined with generally lower shipments for PCs and mobile phones is having an impact on the electronics industry this year. TechSearch International’s latest analysis examines the impact in terms of the OSAT financials and unit shipments. A market forecast for ball grid arrays (BGAs) and chip scale packages (CSPs) in units by package constru... »

Moore’s Law is Dead (Again), Chiplets are Hot, and other Highlights of ECTC 2019

Moore’s Law is Dead (Again), Chiplets are Hot, and other Highlights of ECTC 2019

In the blink of an eye, the 69th Electronics Component Technology Conference (ECTC 2019) has come and gone in a swirl of presentations, conversations, and networking events. Last week, (May 27-31, 2019) Las Vegas played host to 1563 attendees (the second highest number ever), who gathered to share and learn about the latest trends, drivers and technologies that make the microelectronics industry t... »

ITFLE 412: Samsung Discusses Packaging for the 4th Industrial Revolution; Yole looks at Non-TSV Options

ITFLE 412: Samsung Discusses Packaging for the 4th Industrial Revolution; Yole looks at Non-TSV Options

At the recent IMAPS Device Packaging Conference in Fountain Hills, AZ. Kyung Suk (Dan) Oh, Package Development VP at Samsung, discussed “Electronics Packaging Technologies for the 4th Industrial Revolution” Oh explained that Samsung sees today’s technology paradigm shift as going “beyond Moore” by a convergence of system integration/packaging and software. Based on the slide below, Oh sa... »

Advanced Heterogeneous Packaging Solutions for High Performance Computing

Advanced Heterogeneous Packaging Solutions for High Performance Computing

Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad, running the gamut from artificial intelligence (AI), deep learning, data center networking, supercomputers, and autonomous driving. In fact, a new generation of deep learning AI, leading central processing units (CPUs) for data center servers as wel... »

Advanced Packaging: Game Changer for Semiconductor Revolution

Advanced Packaging: Game Changer for Semiconductor Revolution

Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory & computing, artificial intelligence (AI) and high-performance computing (HPC). The market today is dominated by large integrated device manufacturers (IDMs), such as Intel and Samsung, top four global o... »

Celebrating 25 Years of Advanced Packaging Innovation: Part 1

Celebrating 25 Years of Advanced Packaging Innovation: Part 1

After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS DPC) March5-7,2019, in Fountain Hills, Arizona, I am once again reminded why I chose to focus 3D InCites on the advanced packaging segment of the semiconductor industry. The technology is fascinating and varied, the conversation is inspiring, and the people know how to have a... »

Advanced Packaging: at the Heart of Innovation

The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the keywords. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are changing our world step-by-step. Big data, artificial intelligence (A... »

Advanced Packaging Technologies are Key for Semiconductor Innovation

Advanced Packaging Technologies are Key for Semiconductor Innovation

“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly, and Substrates at Yole Korea, part of Yole Développement (Yole).“The market grew by 21.6% year-to-year to reach a record of almost US$412 billion.” Under this dynamic context, the advanced packaging industry is playing a key role, offering huge opportunities for innov... »

Bridging the Interconnect Pitch Gap Calls for 3D Technologies

Bridging the Interconnect Pitch Gap Calls for 3D Technologies

Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s Tien Wu during his IMAPS Symposium keynote earlier this month: High-performance applications like artificial intelligence (AI), 5G, autonomous driving, and even high-end smartphones are driving the continuation of Moore’s Law augmented by More than Moore. This need for high-performan... »

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