advanced packaging

Rudolph Announces Multiple Customers’ Acceptance  of its Firefly Inspection System

Rudolph Announces Multiple Customers’ Acceptance of its Firefly Inspection System

Wilmington, Mass. (September 12, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously announced orders from multiple semiconductor manufacturers, are now qualified for production. The Firefly Inspection Systems provide high-resolution visual and non-visual inspection in a variety of advanced packaging processes, inclu... »

Take-Aways from Test Vision 20/20 Workshop and SEMICON West Advanced Packaging Sessions

Take-Aways from Test Vision 20/20 Workshop and SEMICON West Advanced Packaging Sessions

I am convinced that increasing device complexity, higher quality requirements (e.g. automotive and medical), as well as the need for faster production ramp-ups, will force our industry to pay even more attention to design-in quality, expand self-test, even add redundancy to control logic and interconnects. In addition, wafer-probe and final test need to be expanded. Therefore, attending the Test V... »

Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products

Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of +7% between 2016 and 2022. “Advanced packaging is showing a total revenue CAGR higher than the total packaging industry (3-4%), semiconductor industry (4-5%) and generally the global electronics industry (3-4%)”, comments Andrej Ivankovic, Technology & Mar... »

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria. Representing a 20 million Euro investment, the expansion will include the construction of a new building that provides additional production and te... »

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

EV Group Achieves Industry Milestone With Over 1100 Wafer Bonding Chambers Installed Worldwide

Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image sensors FLORIAN, Austria, May 16, 2017—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved an industry milestone with more than 1100 EVG wafe... »

Advanced Substrates; Key Enabler of Future Advanced Packaging Solutions

Advanced Substrates; Key Enabler of Future Advanced Packaging Solutions

“Advanced substrates are the key interconnect component of advanced packaging architectures,” comments Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging & Semiconductor Manufacturing at Yole Développement (Yole). Indeed advanced substrates are critical in enabling future products and markets. To answer to technology evolution and market needs, Yole’s advanced packagi... »

The Advanced Packaging Times, they are A-Changing…or Are They?

The Advanced Packaging Times, they are A-Changing…or Are They?

It’s been a nearly a month since the 2017 IMAPS Device Packaging Conference and Global Business Council, so I’ve had plenty of time to mull over the many presentations and conversations focused on advanced packaging trends. The winds of change are blowing ever so slightly from year’s past. You had to listen carefully, and in some cases, read between the lines so not to miss them. I could rep... »

MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT

MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT

North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the installation of its flagship MRSI-M3 Die Bonder in AIM Photonics Academy’s Education and Practice Factory at the Massachusetts Institute of Technology (MIT) in Cambridge, MA, USA. This is the beginning of a grea... »

TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP

TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan-out WLP (FO-WLP). Driven by demand for thin, low-profile packages in smartphones, tablets, and wearable devices such as smart watches, fitness bands, and virtual reality headsets, fan-in WLPs are projected to have a >10% gr... »

What the Heterogeneous Integration Technology Roadmap Will Mean for 2017

What the Heterogeneous Integration Technology Roadmap Will Mean for 2017

While it seems that the semiconductor industry has suddenly embraced heterogeneous integration as the next revolutionary innovation to further the quest for higher performance and lower-power, lower-cost devices, it has actually been developing over the past four or more years. We at Dow Electronic Materials, along with many others in the industry, have been and continue to be active participants ... »

Page 1 of 41234