advanced packaging

Celebrating 25 Years of Advanced Packaging Innovation: Part 1

Celebrating 25 Years of Advanced Packaging Innovation: Part 1

After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS DPC) March5-7,2019, in Fountain Hills, Arizona, I am once again reminded why I chose to focus 3D InCites on the advanced packaging segment of the semiconductor industry. The technology is fascinating and varied, the conversation is inspiring, and the people know how to have a... »

Advanced Packaging: at the Heart of Innovation

The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the keywords. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are changing our world step-by-step. Big data, artificial intelligence (A... »

Advanced Packaging Technologies are Key for Semiconductor Innovation

Advanced Packaging Technologies are Key for Semiconductor Innovation

“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly, and Substrates at Yole Korea, part of Yole Développement (Yole).“The market grew by 21.6% year-to-year to reach a record of almost US$412 billion.” Under this dynamic context, the advanced packaging industry is playing a key role, offering huge opportunities for innov... »

Bridging the Interconnect Pitch Gap Calls for 3D Technologies

Bridging the Interconnect Pitch Gap Calls for 3D Technologies

Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s Tien Wu during his IMAPS Symposium keynote earlier this month: High-performance applications like artificial intelligence (AI), 5G, autonomous driving, and even high-end smartphones are driving the continuation of Moore’s Law augmented by More than Moore. This need for high-performan... »

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MRSI Systems’ MRSI-HVM3P Extends The MRS-HVM3 Die Bonder Family to New Applications

BILLERICA, Massachusetts, USA, August 20, 2018 – MRSI Systems (Mycronic Group), is expanding its leading high-speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC). This expansion is in response to our customer’s request to take advantage of t... »

The Advanced Packaging Industry is on the Move

The Advanced Packaging Industry is on the Move

Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts from all over the world are deeply involved in the development of innovative solutions to answer to the market demand dominated by megatrends. “Megatrend will probably be the keyword for the next 10-years within the advanced packaging industry, and more gen... »

Thermal Metamaterials for Advanced Packaging Applications from Stanford University

Thermal Metamaterials for Advanced Packaging Applications from Stanford University

Dense materials that exhibit high thermal conductivity are abundant in nature: think copper, think diamond, think silicon. And porous materials with low thermal conductivity also exist, or are easily fabricated: think polyimide, for example, or think of the various porous xerogels. But dense materials that are also thermal insulators, or porous materials that are good thermal conductors? Those are... »

Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL Challenges

Advanced Packaging Trends, Part I: Solving PR Strip and UBM/RDL Challenges

Over the years, the semiconductor industry has relentlessly focused on shrinking gate dimensions to drive performance. This focus has now transitioned to the packaging side as customers are shifting from wire bonding to flip chip for use in wafer level packaging (WLP). According to VLSI Research, about 35% of chips are currently packaged using WLP techniques. Advanced packaging opportunities slowe... »

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on more than 20 informative presentations, where focused experts gave an in-depth view of new and/or improved technologies for 3DIC-related advanced packaging. Before we address these, allow me a one-sentence recap of Part 1’s key message: We no longer have one major application, like mainframes, PCs, a... »

A Tribute to Gilles Poupon, CEA-Leti’s Advanced Packaging Pope

A Tribute to Gilles Poupon, CEA-Leti’s Advanced Packaging Pope

Sitting in the bus on the way back from Grenoble to Airport Lyon, I am reflecting the last two days during which we honored Gilles Poupon, the Advanced Packaging “Pope” of CEA Leti. Upon his retirement at the end of November 2017, somehow an era ends. I have known Gilles for quite a long time: He reminded of the first time we met. It was 2003 in Munich. Gilles was a member of the CEA delegatio... »

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