Latest Posts - Page 3
Leaning Into Interconnectology – Musings from IMAPS Symposium 2024
Call me crazy, but after spending three days at the 2024 International Microelectronics and Packaging Society (IMAPS) Symposium in Boston...
Now There Are Four
(2nm semiconductor manufacturing foundries) UMC started the semiconductor manufacturing foundry business in 1980, followed a few years later by TSMC....
Witnessing Foundry 2.0 in Action
One of the ways I learn about advanced packaging technology and what it entails is by visiting our community member...
Kulicke & Soffa Announces Thermo-Compression Adoption & Milestones
Kulicke & Soffa announced the introduction of its latest APTURA™ thermo-compression platform in addition to three new milestones relating to industry...
ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool
The system delivers superior uniformity, enabling performance and cost efficiencies for next-generation chip packaging ACM Research, Inc., a leading supplier...
QP Technologies and Parent Company, Promex Industries Implement Sales and Marketing Reorganization
Rosie Medina named senior VP of sales and marketing Promex; Matt Hansen named VP of sales and marketing at QP...
IFTLE 600: A Notice of Intent from the CHIPS NAPMP
The National Advanced Packaging Manufacturing Program (NAPMP) is one of multiple CHIPS R&D initiatives that seek to create United States...
SEMICON West 2024: Riding the Generative AI Winds of Change
Deepak Chopra said, “All great changes are preceded by chaos.” Here’s my Aha! moment from SEMICON West 2024: After great...
IFTLE 598: NSTC Update
In February 2024, CHIPS announced that $5B would be spent in the National Semiconductor Technology Center (NSTC) to drive innovation...
The Road to the AI Era Is Paved in Semiconductor Manufacturing Innovation (The TechArena)
“The Road to the AI Era Is Paved in Semiconductor Manufacturing Innovation,” an in-depth white paper written by The TechArena...
QP Technologies™ Expands Die Preparation Business
Adds Fully Automated Dicing Saw to Equipment Line, Enabling Even Greater Precision, Throughput for Die Singulation QP Technologies™, a leading...
IFTLE 596: Advanced Packaging Reshaping the Chip Ecosystem
The Boston Consultant Group (BCG) recently took a look at the impact that advanced packaging is having on the microelectronics...
ECTC 2024: Advanced Packaging Engineers to the Rescue!
If you were one of the almost 2000 attendees at ECTC 2024, held May 28-31 2024, in Denver, Co, then...
ASE Introduces powerSiP™ for Transformative Power Delivery
PowerSIP™ increases power efficiencies by 50% in AI and data center applications Advanced Semiconductor Engineering, Inc. (ASE), a member of...
IFTLE 593: Deep in the Heart of Texas
IFTLE has spent a lot of time recently focusing on the availability of U.S. government funds for the “onshoring” of...
ECTC 2024 3D InCites Community Member Preview
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of...
Fraunhofer IZM Joins Forces with Rapidus for High-End Performance Packaging
Fraunhofer IZM, a world-leading research institute for advanced microelectronic packaging, and Rapidus Corporation, Japan‘s high-end microelectronics manufacturer founded in 2022,...
Solving the AI Puzzle
An AI package is like a puzzle made up of individual pieces of different sizes and shapes, each one essential...
