Latest Posts - Page 3
Empowering the Future: New York’s Semiconductor Industry Surge
In 2024, New York’s semiconductor industry experienced substantial growth, driven by increased funding from both the U.S. government and the...
How Arizona is Growing its Advanced Packaging Capabilities
An inside look at how ASU, local governments, and private sector companies are working together to make Arizona a hub...
IFTLE 616: Broadcom eXtreme Dimension System in Package (XDSiP™)
Broadcom has recently announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI...
ASU and Deca Technologies Selected to Lead $100M SHIELD USA Project
Shield USA Project will strengthen U.S. semiconductor packaging capabilities The National Institute of Standards and Technology — part of the...
European Semiconductor Packaging Week
The European semiconductor packaging community, together with its international colleagues, supply chain partners, customers and guests met for a full...
IFTLE 609: TSMC/Amkor U.S. Advanced Packaging Partnership; Reshoring at IMAPS 2024
TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor...
TSMC OIP 2024: Strong Partnerships Drive 3D Packaging
I have spent a considerable amount of time covering the technology associated with the front-, and back end of-the-line. So...
IFTLE 608: Is Chip Packaging the New Front on the US-China CHIP WARS?
US-China CHIP WARS Now Encompass Advanced Packaging In the Aug 21st issue of Asia Times, Scott Foster wrote an interesting...
Leaning Into Interconnectology – Musings from IMAPS Symposium 2024
Call me crazy, but after spending three days at the 2024 International Microelectronics and Packaging Society (IMAPS) Symposium in Boston...
Now There Are Four
(2nm semiconductor manufacturing foundries) UMC started the semiconductor manufacturing foundry business in 1980, followed a few years later by TSMC....
Witnessing Foundry 2.0 in Action
One of the ways I learn about advanced packaging technology and what it entails is by visiting our community member...
Kulicke & Soffa Announces Thermo-Compression Adoption & Milestones
Kulicke & Soffa announced the introduction of its latest APTURA™ thermo-compression platform in addition to three new milestones relating to industry...
ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool
The system delivers superior uniformity, enabling performance and cost efficiencies for next-generation chip packaging ACM Research, Inc., a leading supplier...
QP Technologies and Parent Company, Promex Industries Implement Sales and Marketing Reorganization
Rosie Medina named senior VP of sales and marketing Promex; Matt Hansen named VP of sales and marketing at QP...
IFTLE 600: A Notice of Intent from the CHIPS NAPMP
The National Advanced Packaging Manufacturing Program (NAPMP) is one of multiple CHIPS R&D initiatives that seek to create United States...
SEMICON West 2024: Riding the Generative AI Winds of Change
Deepak Chopra said, “All great changes are preceded by chaos.” Here’s my Aha! moment from SEMICON West 2024: After great...
IFTLE 598: NSTC Update
In February 2024, CHIPS announced that $5B would be spent in the National Semiconductor Technology Center (NSTC) to drive innovation...
The Road to the AI Era Is Paved in Semiconductor Manufacturing Innovation (The TechArena)
“The Road to the AI Era Is Paved in Semiconductor Manufacturing Innovation,” an in-depth white paper written by The TechArena...