Steffen Kroehnert is President & Founder of ESPAT-Consulting based in Dresden, Germany. He provides a wide range of consulting services around Semiconductor Packaging, Assembly and Test, mainly for customers in Europe. He spent more than 20 years in different R&D, engineering and management positions at large IDMs and OSATs in Germany and Portugal, namely Siemens Semiconductors, Infineon Technologies, Qimonda, NANIUM and Amkor Technology, where he most recently served as Senior Director Technology Development. Since 2016 Steffen has chaired the European SEMI integrated Packaging, Assembly and Test - Technology Community (ESiPAT-TC). Steffen has authored or co-authored 23 patent filings and many technical papers in the field of Packaging Technology. He also co-edited the book “Advances in Embedded and Fan-Out Wafer Level Packaging Technologies”. He is an active member of several technical and conference committees of IEEE EPS, IMAPS and SEMI Europe. Steffen holds an M.S. in Electrical Engineering and Microsystems Technologies from the Technical University of Chemnitz, Germany.