The 65th annual Electronics Technology Components Conference (ECTC 2015) logged record numbers (over 1500 attendees, 20% increase over last year) as the entire semiconductor industry recognizes (finally) that there is indeed money to be made in the advanced packaging sector. The flip chip and wafer level packaging sessions were full to overflowing. The 3D tech sessions offered lots of fresh conte... »
CMOS image sensors (CIS) have often been heralded as the first 3D devices in volume manufacturing. However, this is not really the case. Shellcase MVP, the first generation of CIS that used through silicon vias (TSVs) to form interconnects was still a 2D device. (Remember, TSV is not always synonymous with 3D). Chip stacking only came about with the advent of backside illuminated (BSI) CIS and ... »
Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent three days at the EDA-focused 51st Design Automation Conference in San Francisco. In addition to realizing that these two locations are about three thousand miles apart, I noticed that the packaging and EDA camps are still far apart in regards to share of mind ... »
The technologies are ready, the target high volume applications for 3D IC manufacturing have been identified, and now it’s about convincing system architects there’s more to gain from designing in 2.5D and 3D ICs than there is to lose. At last week’s European 3D TSV Summit (January 21-22), two European manufacturers took to the podium to shared their reasons for implementing 2.5D and 3D in... »
The Internet of Things, or “IoT” certainly seems to be the social media buzz phrase of the week. It seems every link I clicked on today took me to a post discussing the IoT. You can blame the flurry of technical blog coverage on recent events like the Trillion Sensors Summit, ARM TechCon 2013, CIsco’s Internet of Things World Forum, and Intel’s IDF 2013. All at once, Cisco Systems, Fai... »
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