Thermocompression Bonding for Microbump Flip Chip Soldering

An excerpt from  the Semiconductor Assembly Blog by Andy C. Mackie, Global Product Manager for Indium Corporation’s Semiconductor and Advanced Assembly Materials.

For reasons that I will discuss in a post later this year, a common factor that is emerging in the area of copper-pillar microbump 2.5D and 3D joining, is the adoption of thermocompression (TC) bonding for flip-chip flux/microbump soldering. TC bonding is now being predominantly adopted instead of reflow. Some of you may have the same response as I got at iMAPS 2011 from one well-known expert in packaging technology. He looked askance at me when I mentioned TC bonding for flip-chip and retorted: “That’s for bonding wafers, not soldering flip-chips!”. Even good old Wikipedia (at time of writing) seems to have the same problem – basically that the industry usage of the term has moved into the packaging arena. (Full Story)