Applications

ECTC 2015: Advanced Packaging Sets Sail in San Diego

ECTC 2015: Advanced Packaging Sets Sail in San Diego

The 65th annual Electronics Technology Components Conference (ECTC 2015) logged record numbers (over 1500 attendees, 20% increase over last year) as the entire semiconductor industry recognizes (finally) that there is indeed money to be made in the advanced packaging sector. The flip chip and wafer level packaging sessions were full to overflowing. The 3D tech sessions offered lots of fresh conte... »

The Future of Image Sensors is Chip Stacking

The Future of Image Sensors is Chip Stacking

CMOS image sensors (CIS) have often been heralded as the first 3D devices in volume manufacturing. However, this is not really the case. Shellcase MVP, the first generation of CIS that used through silicon vias (TSVs) to form interconnects was still a 2D device. (Remember, TSV is not always synonymous with 3D). Chip stacking only came about with the advent of backside illuminated (BSI) CIS and ... »

Should EDA vendors, OSATS, and their customers cooperate more?

Should EDA vendors, OSATS, and their customers cooperate more?

Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent three days at the EDA-focused 51st Design Automation Conference in San Francisco. In addition to realizing that these two locations are about three thousand miles apart, I noticed that the packaging and EDA camps are still far apart in regards to share of mind ... »

Lessons Learned From the Trenches of 3D IC Manufacturing for Sensor Applications

Lessons Learned From the Trenches of 3D IC Manufacturing for Sensor Applications

The technologies are ready, the target high volume  applications for 3D IC manufacturing have been identified, and now it’s about convincing system architects there’s more to gain from designing in 2.5D and 3D ICs than there is to lose. At last week’s European 3D TSV Summit (January 21-22), two European manufacturers took to the podium to shared their reasons for implementing 2.5D and 3D in... »

Internet of Things

Friday’s Blog is brought to you by the Internet of Things

The Internet of Things, or “IoT” certainly seems to be the social media buzz phrase of the week. It seems every link I clicked on today took me to a post discussing the IoT. You can blame the flurry of technical blog coverage on recent events like the Trillion Sensors Summit, ARM TechCon 2013, CIsco’s Internet of Things World Forum, and Intel’s IDF 2013. All at once, Cisco Systems, Fai... »

3D IC Commercialization: Glimmers of Progress and Push for Collaboration and Choices to Make

3D IC Commercialization: Glimmers of Progress and Push for Collaboration and Choices to Make

Recent signs that we’re getting closer to commercialization of 3D ICs? For one, analog and sensor IC company, ams AG, threw down the gauntlet, announcing it is investing more than €25M ($33M) to add manufacturing capacity for 3D ICs in its fab located near Graz, Austria. Analog 3D ICs featuring through silicon vias (TSVs) are already a reality at ams. The company introduced its first 3D IC int... »

tablets and smartphone

Reinventing the PC; MEMS and LEDs Grow Up

The PC world is dead?  Chris Hubbard, Intel’s Business PC Marketing Manager scoffs at the mere idea. “The demise of the PC industry was predicted before it was born!” he said during his opening presentation at the SEMI Americas Arizona Breakfast Forum, Friday April 12, 2013 at Intel in Chandler, AZ. Hubbard showed a chart contrasting PC revenue growth with different times over the years whe... »

3D stack courtesy of DARPA

Activity Heats up for 3D IC Chip Cooling

3D ICs have clearly caught the eye of the military and aerospace electronics industries. I came across two separate announcements – one from Georgia Institute of Technology and one from IBM Microelectronics – that each had been awarded DARPA grants to work on chip-level cooling technologies as part of the government agency’s Intrachip/Interchip Enhanced Cooling program (ICECool). According t... »

3D TSV Summiit

European 3D TSV Summit: But Wait, There’s More!

Day Two of the European 3D TSV Summit dawned bright and clear, with such a spectacular view of the nearby French Alps that it took real commitment to stay indoors and focus on the task at hand. But I have to admit that for the most part, it was worth the sacrifice to hear what this collection of speakers had to say. Georg Kimmich, head of Silicon Packaging R&D at ST-Ericsson delivered a dose o... »

tablets and smartphone

3D App Update

Because someday soon, we will find more 3D TSV devices than just CMOS image sensors inside mobile applications, I like to keep my eyes and ears open for what’s going on in those areas. Here are a few interesting tidbits I came across lately. Forget what you heard about TSMC manufacturing the next A6 processor.  According to SemiWiki blogger, Daniel Nenni, this rumor is false! He says this is be... »

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