Yole Developpement

Advanced Packaging: Game Changer for Semiconductor Revolution

Advanced Packaging: Game Changer for Semiconductor Revolution

Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory & computing, artificial intelligence (AI) and high-performance computing (HPC). The market today is dominated by large integrated device manufacturers (IDMs), such as Intel and Samsung, top four global o... »

The 5G Revolution is Pushing Innovations for RF front-end SiP

The 5G Revolution is Pushing Innovations for RF front-end SiP

Without a doubt, 5G has arrived and various key smartphone OEMs have already announced products that will support 5G cellular and connectivity. It is clear for everyone that 5G will totally redefine how the radio frequency (RF) front-end interacts in-between the network and the modem. The new RF bands (sub-6 GHz and mm-wave, as defined in 3GPP release 15) pose big challenges for the industry. The ... »

HPC, AI and Datacenters: the 2.5D and 3D Stacking Technologies Playground

HPC, AI and Datacenters: the 2.5D and 3D Stacking Technologies Playground

“2.5D and 3D stacking technologies are the only solutions that meet the required performance of applications like artificial intelligence (AI) and datacenter as of today”, confirms Mario Ibrahim, Technology & Market Analyst from Yole Développement (Yole). Stacking technologies are used in a variety of hardware, including 3D stacked memory, graphics processor units (GPUs), field programmab... »

Advanced Packaging: at the Heart of Innovation

The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the keywords. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are changing our world step-by-step. Big data, artificial intelligence (A... »

Megatrends are Changing the Future of the Lithography Equipment Market

The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding and lithography equipment market for the more than Moore (MtM)  industry is a small niche representing millions of dollars. However, megatrend markets push MtM devices to new levels of complexity, resulting in big investments. Consequently, the tot... »

Fan-Out Packaging is Becoming Imperative to Stay Competitive in Advanced Packaging

“Fan-out packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with fan-out panel level packaging (FOPLP) technology. Both companies have invested and developed FOPLP for production successfully in 20... »

Packaging: Consumer Solutions Adapted for Automotive Applications

Packaging: Consumer Solutions Adapted for Automotive Applications

“Automotive applications are the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy, and comfort are the keywords of today’s automotive industry. Under this dynamic context, the market ... »

Polymeric Materials: Massive Adoption by the Advanced Packaging Industry

Polymeric Materials: Massive Adoption by the Advanced Packaging Industry

According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over the next five years. Driven by movements towards further miniaturization and higher functionalities, megatrend applications like artificial intelligence (AI), 5G, and augmented/virtual reality (AR/VR) are creating huge business opportunities. Therefo... »

Advanced Packaging Technologies are Key for Semiconductor Innovation

Advanced Packaging Technologies are Key for Semiconductor Innovation

“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly, and Substrates at Yole Korea, part of Yole Développement (Yole).“The market grew by 21.6% year-to-year to reach a record of almost US$412 billion.” Under this dynamic context, the advanced packaging industry is playing a key role, offering huge opportunities for innov... »

The Advanced Packaging Industry is on the Move

The Advanced Packaging Industry is on the Move

Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts from all over the world are deeply involved in the development of innovative solutions to answer to the market demand dominated by megatrends. “Megatrend will probably be the keyword for the next 10-years within the advanced packaging industry, and more gen... »

Page 1 of 3123