Yole Developpement

About YOLE DEVELOPPEMENT

Here are my most recent posts

Is Fan-Out packaging still popular? Equipment & material companies are the heartbeats of this ecosystem

Is Fan-Out packaging still popular? Equipment & material companies are the heartbeats of this ecosystem

“Although the inflated excitement has started to plunge after few years of hype, Fan-Out technologies are still very well established in low-end and high-end applications”, asserts Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “It has proven benefits in terms of form factor with no IC substrates, performances with increased I/O density and reliability with die p... »

Advanced Packaging Industry: A Wonderful World

The semiconductor industry is at a turning point. The slowdown in CMOS scaling, coupled with escalating costs, has prompted the industry to rely on integrated circuit (IC) packaging to extend the benefits of the More-than-Moore era. Thus, the advanced packaging industry has entered its most successful period, boosted by widespread needs for better integration; the slowdown of Moore’s law; and me... »

TOP 25 OSATs Ranking: Survival of the Fittest?

TOP 25 OSATs Ranking: Survival of the Fittest?

Out of the top 25 OSATs, Taiwan-based OSATs contributed more than half of the revenue in 2018 followed by China, US, and Malaysia. The leading giant of the outsourced semiconductor and test service providers (OSATs), ASE Technology Holding Co., Ltd. (formerly ASE Inc.) and subsidiaries, has got even bigger after the official acquisition of SPIL on April 30, 2018. In 2018, ASE Technology Holding Co... »

Advanced Substrates: The Winds of Change

Advanced Substrates: The Winds of Change

Historically, the integrated circuit (IC) substrate and board industry have assumed a passive role, especially when it comes to innovation. However, in the past few years, things have changed. The dedicated landscape welcomed innovative solutions and new players. “Today, we are facing an increasingly competitive ecosystem and players are looking to differentiate from each other’s” asserts Ma... »

Advanced Packaging: Game Changer for Semiconductor Revolution

Advanced Packaging: Game Changer for Semiconductor Revolution

Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory & computing, artificial intelligence (AI) and high-performance computing (HPC). The market today is dominated by large integrated device manufacturers (IDMs), such as Intel and Samsung, top four global o... »

The 5G Revolution is Pushing Innovations for RF front-end SiP

The 5G Revolution is Pushing Innovations for RF front-end SiP

Without a doubt, 5G has arrived and various key smartphone OEMs have already announced products that will support 5G cellular and connectivity. It is clear for everyone that 5G will totally redefine how the radio frequency (RF) front-end interacts in-between the network and the modem. The new RF bands (sub-6 GHz and mm-wave, as defined in 3GPP release 15) pose big challenges for the industry. The ... »

HPC, AI and Datacenters: the 2.5D and 3D Stacking Technologies Playground

HPC, AI and Datacenters: the 2.5D and 3D Stacking Technologies Playground

“2.5D and 3D stacking technologies are the only solutions that meet the required performance of applications like artificial intelligence (AI) and datacenter as of today”, confirms Mario Ibrahim, Technology & Market Analyst from Yole Développement (Yole). Stacking technologies are used in a variety of hardware, including 3D stacked memory, graphics processor units (GPUs), field programmab... »

Advanced Packaging: at the Heart of Innovation

The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt, the industry is entering a new age, where innovation and disruption are the keywords. In addition to mobile, Yole Développement (Yole) analysts identified emerging mega-drivers that are changing our world step-by-step. Big data, artificial intelligence (A... »

Megatrends are Changing the Future of the Lithography Equipment Market

The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding and lithography equipment market for the more than Moore (MtM)  industry is a small niche representing millions of dollars. However, megatrend markets push MtM devices to new levels of complexity, resulting in big investments. Consequently, the tot... »

Fan-Out Packaging is Becoming Imperative to Stay Competitive in Advanced Packaging

“Fan-out packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with fan-out panel level packaging (FOPLP) technology. Both companies have invested and developed FOPLP for production successfully in 20... »

Page 1 of 3123