3D In Context

About Herb Reiter

After more than 20 years in technical and business roles at semiconductor and EDA companies, Herb Reiter founded eda2asic Consulting, Inc. in 2002 to focus on increasing the cooperation between EDA suppliers and ASIC vendors. In this role Herb introduced innovative IC design tools to the major semiconductor vendors worldwide. In 2008 he expanded his scope into Multi-die ICs. As chair of the GSA’s 3D-IC Working Group (2008-2011) and as SEMATECH business development consultant (2012 + ‘13), he broadened his horizon to include interposers and 3D-ICs technology, semiconductor materials as well as manufacturing, metrology and test equipment. In 2014 + '15 Herb consulted with Si2, to encourage development and standardization of data exchange formats for Interposer and 3D-IC design flows. Since early 2016 he is consulting with the newly formed Electronic System Design Alliance (formerly EDAC), to accelerate market acceptance of Multi-die ICs, the essential building blocks for the emerging System Scaling methodology.
Herb attended 40+ Continuing Education courses at Stanford University, earned an MBA at San Jose State University and Master Degrees in Business and Electrical Engineering at the University and the Technical College in Linz/Austria, respectively. He can be reached at herb@eda2asic.com

Here are my most recent posts

The Path to Smarter Fabs

The Path to Smarter Fabs

Working from the mantra “None of us knows as much as all of us,” SEMI invited manufacturers of electronic components and systems to come together and discuss how to build smarter fabs and reap key benefits like lower cost, faster turnaround as well as higher quality and more reliable products. The second annual Smart Manufacturing Workshop, held September 12, provided a very sensible approach ... »

The Importance of Fully Characterized Semiconductor Materials

The Importance of Fully Characterized Semiconductor Materials

More than 20 years ago, the cooperation between fabless IC vendors and wafer foundries started to dominate over the integrated device manufacturing (IDM) business model and established clear interfaces between design and manufacturing companies. Ever since IC designers can only create a single-die system-on-chip (SoC) design if a process design kit (PDK) informs them about their wafer foundry part... »

Courtesy of The GSA Twitter feed.

The Need For and Value of Semiconductor Industry Organizations

Recognizing the need for and value of semiconductor industry organizations, in 1994, Jodi Shelton and CEOs of fabless IC companies founded the Fabless Semiconductor Association (FSA). The traditional integrated device maker (IDM) business model was declining and the need for close cooperation between IC designers at fabless IC companies (Broadcom, Nvidia, Qualcomm, etc.) and more cost-effective wa... »

How to Transform Innovative Technologies Into Customer-Specific Solutions

How to Transform Innovative Technologies Into Customer-Specific Solutions

Technology innovations don’t reach customers right away. It takes careful collaboration with the right partners to transform a new and innovative technology into high-value, customer-specific solutions. »

What is Happening to the Memory Market?

What is Happening to the Memory Market?

Because memory represents typically about half the silicon content of a system, and multi-die packages typically combine many memory devices with one or more logic dice, I made it a point to attend both Yole Développement’s Executive Memory Breakfast and The Flash Summit on August 6th.  I, along with about 100 other industry executives, had to get up very early to make the 7 am breakfast meeti... »

Advanced SiPs Help More than Moore Reach Maturity

Advanced SiPs Help More than Moore Reach Maturity

Earlier this summer, 175 system-in-package (SiP) experts from all over the world met at the Marriott Hotel in Monterey’s Old Town at the IMAPS Advanced SiPs Conference. This conference focused exclusively on innovative SiP technology developments and trends, demonstrating that a significant part of the value creation is moving from the silicon to the package. Nozad Karim, VP: SiP/System Integrat... »

New Details About More-than-Moore Test Technology Advances

New Details About More-than-Moore Test Technology Advances

SEMICON West and the Electronic System (ES) Design West were, for the first time, co-located at the Moscone Center in San Francisco, from July 9 to 11, 2019. In addition to most keynotes, I reported about here, This blog talks about some in-depth technical presentations on test and the progress many companies made in support of “More than Moore” technology. The Test Vision Symposium The most i... »

SEMICON West Keynotes Look to a Future Beyond Moore’s Law

SEMICON West Keynotes Look to a Future Beyond Moore’s Law

Reporting from the SEMICON West keynote talks, Herb Reiter relays the perspectives of industry experts on everything from More than Moore, to hot topics and future technologies. »

The Importance of a Well-coordinated Semiconductor Supply Chain

The Importance of a Well-coordinated Semiconductor Supply Chain

Would you buy your next hotdog in parts, from un-coordinated suppliers? For example: Get the bun from a baker, the sausage from a butcher, mustard and/or ketchup and veggies from the nearest supermarket…?  If yes, you may find the sausage being too small, the veggies too big for the bun, and, when you finally finished adding mustard/ketchup and start eating, you may “enjoy” a cold sausage o... »

Book Review: Handbook of 3D Integration – Volume 4

Book Review: Handbook of 3D Integration – Volume 4

An essential part of successfully introducing a new technology is to educate engineers and managers on its benefits and tradeoffs. That’s why Wiley started publishing the Handbook of 3D Integration Series with Volume 1 and 2 in 2008, followed by Volume 3 in 2014. This blog covers Volume 4, introduced in early May 2019. It focuses on three important 3D challenges: IC design, test, and thermal man... »

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