3D In Context

About Herb Reiter

After more than 20 years in technical and business roles at semiconductor and EDA companies, Herb Reiter founded eda2asic Consulting, Inc. in 2002 to focus on increasing the cooperation between EDA suppliers and ASIC vendors. In this role Herb introduced innovative IC design tools to the major semiconductor vendors worldwide. In 2008 he expanded his scope into Multi-die ICs. As chair of the GSA’s 3D-IC Working Group (2008-2011) and as SEMATECH business development consultant (2012 + ‘13), he broadened his horizon to include interposers and 3D-ICs technology, semiconductor materials as well as manufacturing, metrology and test equipment. In 2014 + '15 Herb consulted with Si2, to encourage development and standardization of data exchange formats for Interposer and 3D-IC design flows. Since early 2016 he is consulting with the newly formed Electronic System Design Alliance (formerly EDAC), to accelerate market acceptance of Multi-die ICs, the essential building blocks for the emerging System Scaling methodology.
Herb attended 40+ Continuing Education courses at Stanford University, earned an MBA at San Jose State University and Master Degrees in Business and Electrical Engineering at the University and the Technical College in Linz/Austria, respectively. He can be reached at herb@eda2asic.com

Here are my most recent posts

SEMICON West Keynotes Look to a Future Beyond Moore’s Law

SEMICON West Keynotes Look to a Future Beyond Moore’s Law

Reporting from the SEMICON West keynote talks, Herb Reiter relays the perspectives of industry experts on everything from More than Moore, to hot topics and future technologies. »

The Importance of a Well-coordinated Semiconductor Supply Chain

The Importance of a Well-coordinated Semiconductor Supply Chain

Would you buy your next hotdog in parts, from un-coordinated suppliers? For example: Get the bun from a baker, the sausage from a butcher, mustard and/or ketchup and veggies from the nearest supermarket…?  If yes, you may find the sausage being too small, the veggies too big for the bun, and, when you finally finished adding mustard/ketchup and start eating, you may “enjoy” a cold sausage o... »

Book Review: Handbook of 3D Integration – Volume 4

Book Review: Handbook of 3D Integration – Volume 4

An essential part of successfully introducing a new technology is to educate engineers and managers on its benefits and tradeoffs. That’s why Wiley started publishing the Handbook of 3D Integration Series with Volume 1 and 2 in 2008, followed by Volume 3 in 2014. This blog covers Volume 4, introduced in early May 2019. It focuses on three important 3D challenges: IC design, test, and thermal man... »

U2U 2019 Conference Dives into 2.5/3D IC Design

U2U 2019 Conference Dives into 2.5/3D IC Design

Key advanced packaging technology influencers came out in force to discuss the status of  EDA tools for 2.5D/3D IC package design at the recent User to User (U2U 2019) Conference, organized by Mentor, A Siemens’ Business and hosted at the Santa Clara Marriott. Presenters from Wave Computing, ARM, Amkor, TechSearch International Inc., and Qualcomm lent their voices to the cause. Technology T... »

TSMC’s 2019 Technology Symposium highlights 25 Years of Innovation

TSMC’s 2019 Technology Symposium highlights 25 Years of Innovation

In 1994 TSMC, a small wafer foundry from Taiwan held its first Technology Symposium. Since 1999 I have had the privilege to work with TSMC and closely follow their success in building a powerful and cost-effective ecosystem for the fabless IC vendors and foundry business model. To measure their success in hard numbers, please check IC Insights’ 2018 revenue estimates here and see that TSMC has a... »

Update on  3D X-ray and DBI Technology for Advanced and 3D Packaging

Update on 3D X-ray and DBI Technology for Advanced and 3D Packaging

The Microelectronics Packaging & Test Engineering Council (MEPTEC) held its monthly meeting at SEMI in Milpitas on April 10.  Two speakers outlined their companies’ capabilities and demonstrated their own expertise in solving specific industry challenges. Tom Gregorich presented why and how Zeiss supports IC package inspection with 3D X-ray machines, then Sitaram Arkalgud conveyed the benef... »

FLEX/MSTC Keynotes Confirm: Our Customers Need System-level Solutions

FLEX/MSTC Keynotes Confirm: Our Customers Need System-level Solutions

From February 18 to 21, 2019, Monterey, CA, was again the venue for SEMI’s Flexible Hybrid Electronics (FLEX) and MEMS & Sensors Technical Congress (MSTC), conference. As in previous years, the joint keynotes, 2-track technical sessions, and more than 50 exhibitors demonstrated the synergies between these two industry segments and their fast pace of innovation. The entire conference focused ... »

DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging

DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging

Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing printed circuit board (PCB) and system designers the latest technology advances, enabling higher performance and lower power and lower cost solutions. Bootcamps, tutorials, keynotes, and many in-depth technical sessions offered engineers up-to-date information to make th... »

ISS 2019 Continued: Facing New Challenges and Opportunities

ISS 2019 Continued: Facing New Challenges and Opportunities

Just in case you didn’t have a chance yet to read part 1 of the ISS 2019 blog, covering day 1, it’s posted here. Technology and Manufacturing Trends Day 2 started with a keynote about the magic nanodevices can create, delivered byJo de Boeck, imec’s EVP and chief strategy officer. He emphasized that we need to find smarter ways to compute, store data and connect building blocks. De Boeck ... »

ISS 2019: Semiconductor Industry Faces New Challenges and Opportunities

ISS 2019: Semiconductor Industry Faces New Challenges and Opportunities

SEMI held its annual Industry Strategy Symposium (ISS 2019) at the Ritz Carlton in Halfmoon Bay, CA January 6-9, 2019. Many high-level executives represented key areas of the electronic products supply chain. Former government officials emphasized that our country’s leaders recognize the strategic importance of semiconductors. The theme of ISS 2019 was: “The Golden Age of Semiconductors: Enabl... »

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