Herb Reiter, eda2asic, presented this poster presentation titled “The Internet of Things and Semiconductor Test” at the Test Vision 2020...
Tuesday’s (July 15) Nightly Business Report surprised me with an – in my view – very important announcement: Apple and...
Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent...
On April 9, 2014 Herb Reiter presented a 2.5D and 3D IC packaging-centric update in context with an IEEE/CPMT dinner...
Years ago I saw Dr. Wayne Dyer on Public Television. He talked about “The Power of Intention”. The engineering-driven half...
The recent announcement of the International Interconnect Technology Conference (IITC), combined with the Advanced Metallization Conference (AMC) in the Double...
When Yogi Berra made this very wise statement, he certainly didn’t mean to give specific advice what to choose. I...
Many years ago, when I started in the semiconductor business, the circuit designers only had to worry about functionality and,...
For almost 50 years the semiconductor industry has practiced continued shrinking of transistor feature sizes and has been able to...
Major SoC vendors, like Intel and IBM, started development work on 3D ICs more than a decade ago, but so...
The 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I...
At last week’s Memcon 2013, which took place Tuesday, August 6, 2013, at the Santa Clara Convention Center, Keynoter Bob...