Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968,...
Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for...
The CITRIS Workforce Innovation Program helps UC students pursue world-changing research and accelerate their careers. The Center for Information Technology...
Onto Innovation announced the completion of a newly constructed cleanroom manufacturing area on site in Bloomington. Equipped with 20 new...
SEMICON Europa kicks off next week as microelectronics experts and visionaries gather for insights into advanced technologies that are driving...
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
Chaired by 3D InCites Community member Steffen Kröhnert of ESPAT Consulting, the Electronics System-Integration Technology Conferences (ESTC) series is a...
Sustainability, smart technologies, and workforce development will take center stage at SEMICON West 2022 Hybrid, July 12-14 at the Moscone...
Next week the top global event for Advanced System-in-Package technologies comes to Sedona. Combining the 3D ASIP and IMAPS SiP...
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components...
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and...
We presume all are excited about the upcoming SEMICON West show. I know we sure are! Be sure to stop...
SEMICON Europa is back! On the agenda? The latest innovations and smart applications powering the next wave of semiconductor industry...
The IMAPS 2021 program is set to be knowledge-packed, offering materials both in person and on demand, including keynote presentations...
Aiming at facilitating mutual engagement, the SEMI Packaging Technology Seminar will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts, to collectively strengthen the semiconductor back-end industry in...
Calling All Semiconductor/Microelectronics Packaging Interns! – We want to know what your summer internship was like. Here’s your chance to...
For the second time in its 71-year history, ECTC will be presented as a virtual conference, opening Tuesday, June 1,...
The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international...
