The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies, and business trends.
IMAPS has rebranded its well-attended, annual Advanced System-in-Package conference to the Chiplet & Heterogeneous Integration Packaging Conference CHIPcon. As the world’s leading semiconductor companies continue to push the edge of process technology, the industry is seeing a marked shift in device design and architectures to overcome economic and time-to-market challenges. Heald at the DoubleTree Hilton in San Jose, CHIPcon 2023 will offer cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, high-performance computing and networking market segments.
If you missed Francoise’s interview regarding the conference rebranding and new focus, here is her Podcast episode with Steve Kummerl,TI and Mark Gerber, ASE — part of the team that put together the very robust agenda, with expert speakers from across the chiplet ecosystem.
And of course, here is the agenda for our Community Members:
| MONDAY, JULY 24 | |
| 9:00am-12:15pm | Heterogeneous Integration Roadmap Workshop CHAIR: Bill Chen, ASE |
| 1:00pm-3:00pm | PDC 1: System-in-Package (SiP) – System Solutions Through Miniaturization Mark Gerber, ASE |
TUESDAY, JULY 25
Session 1:
CHIPLET INTEGRATION WORKFLOWS AND CO-DESIGN
Session Chair: John Park, Cadence
| 11:00am-11:30am | Workflows for tackling heterogeneous integration of chiplets for 2.5/3D Kevin Rinebold, Siemens |
Session 1 continued:
CHIPLET INTEGRATION WORKFLOWS AND CO-DESIGN
Session Chair: Kevin Rinebold, Siemens
| 1:30pm-2:00pm | Chiplet/Package Co-Design/Analysis Challenges and Opportunities John Park, Cadence |
| 4:45pm-6:00pm | Panel Session: ARE CHIPLETS THE ANSWER FOR AI, ML AND PHOTONICS/CPO? Moderator Jan Vardaman, TechSearch InternationalConfirmed Panelists: Ivor Barber, AMD Yin Chang, ASE, Inc. Swadesh Choudhary, Intel Corp. Mike Kelly, Amkor Technology Chong Zhang, Ayar Labs |
| WEDNESDAY, JULY 25
11:00am-11:30am |
Advanced Insulation Materials Designed for High-Density Package for High Speed Application |
| 3:00pm-3:30pm | Session 4: ADVANCED SiP PACKAGING FOR MOBILE AND WEARABLE Session Chair: Mark Gerber, ASE US Next Generation 5G mmW Module Architecture Tilson Chung, ASE, Inc. |
| 4:15pm-4:45pm | Session 5: AUTOMOTIVE, POWER & SENSOR PACKAGING Session Chair: Curtis Zwenger, Amkor TechnologyPower Packaging and Integration for Automotive Applications KyungSu Kim, Amkor Technology |
Tabletop Exhibitors:
3DInCites
Amkor Technology
ASE
Finetech USA
Indium Corporation
Mosaic Microsystems
NAMICS Technologies, Inc.
QP Technologies
TechSearch International, Inc.
