ASE

Hello, Microelectronics and Packaging? Your Opportunities are Calling

Hello, Microelectronics and Packaging? Your Opportunities are Calling

There’s no doubt about it. This is a good time to be in the microelectronics and packaging sector of the semiconductor industry. With exciting markets like artificial intelligence (AI), 5G, and the internet of things  (IoT) technologies moving from ideas to implementation, this previously tired segment of the semiconductor industry is poised for action and faces abundant opportunities. “The s... »

Citius, Altius, Fortius Redux: More From SEMICON Korea 2018

Citius, Altius, Fortius Redux: More From SEMICON Korea 2018

The Winter Games are over and the athletes returned home, and the SEMICON Korea 2018 teams from February have their sights on SEMICON China this month after all that snow-in-Seoul settled, but I still have a few more comments about the Electropackage System and Interconnect Product technical session SEMI organized for the afternoon of 01 February 2018, and on which I reported in my first installme... »

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these products include electronic compasses, motion sensors, barometers, microphones, and fingerprint sensors. Package types include land grid arrays (LGAs), lead frame packages such as QFNs, and wafer level packages (WLPs.). Apple is expected to account for 28 p... »

Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products

Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of +7% between 2016 and 2022. “Advanced packaging is showing a total revenue CAGR higher than the total packaging industry (3-4%), semiconductor industry (4-5%) and generally the global electronics industry (3-4%)”, comments Andrej Ivankovic, Technology & Mar... »

FOPLP

Fifty Shades of Fan-out Discussed at ECTC 2017

The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took place in Orlando at the Walt Disney World Swan and Dolphin Resort. The buzz started during the Tuesday evening plenary session, where panelists Douglas Yu, TSMC, Tim Olson, Deca Technologies; Steffen Kroehnert, NANIUM; Rolf Aschenbrenner... »

Cypress Subsidiary Deca Technologies to Receive $60 Million Investment from ASE

Cypress Subsidiary Deca Technologies to Receive $60 Million Investment from ASE

SAN JOSE, Calif.,- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX and Deca Technologies, a subsidiary of Cypress Semiconductor Corp. (NASDAQ: CY), today announced the signing of an agreement whereby ASE will invest $60 million in Deca and will license Deca’s M-Series™ Fan-out Wafer-Level Packaging (FOWLP) technologies and processes. As part of the agreement, ASE and Deca will... »

TSVs for MEMS vs. TSVs for 3D ICS

TSVs for MEMS vs. TSVs for 3D ICS

The 2013 European 3D TSV Summit (January 20-22, Grenoble, France) kicked off with a pre-conference symposium on 3D TSVs for MEMS applications. My initial thought after attending, was that I’m not sure the MEMS people realize this, but some of us who don’t work in the MEMS market but DO work in the 2.5D and 3D IC space aren’t fully aware of the differences between TSVs for MEMS and TSVs for 3... »

More than Moore and 3D IC:  Decoding the Code at the GSA Silicon Summit 2013

More than Moore and 3D IC: Decoding the Code at the GSA Silicon Summit 2013

There’s probably no more fitting venue for discussing future directions for processing and packaging technology in integrated circuit fabrication than the Computer History Museum in Mountain View, CA. After all, “The mission of the Computer History Museum is to preserve and present for posterity the artifacts and stories of the information age. As such, the Museum plays a unique role in the hi... »

3D TSV Summiit

European 3D TSV Summit: 3D TSVs Come of Age

Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European 3D TSV Summit. It was such a whirlwind few days, jam-packed with quality presentations demonstrating recent progress in all things TSV by the semiconductor manufacturing community and fabulous meals with industry colleagues and friends that this flight home is the first time I’ve... »

2.5D and 3D Messages Worth Repeating

I listened in on yesterday’s webcast, 3D and 2.5D Integration: A Status Report Live Event  hosted by Solid State Technology, and while most of the information was similar to what I had heard at IMAPS Device Packaging Conference, EDPS, ECTC 2012, etc., they are clearly messages worth repeating, and some new interesting nuggets as well. Jan Vardaman, from TechSearch International, started things »

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