As many of you know, this year’s SEMICON Europa in Munich is a special one for 3D InCites. The Queen of 3D is retiring, and SEMICON Europa marks her last industry event. Over the course of her career, she has played an instrumental role in the advanced packaging industry. From forming the 3D InCites member community, to reporting on companies and events around the world, her impact will always be remembered.
This year is also SEMICON Europa’s 50th anniversary. To help commemorate such an important milestone, Francoise will be interviewing SEMI Europe’s President, Laith Altimime for an upcoming podcast, alongside imec’s Luc Van den hov and ESMC’s Christian Koitsch. Together, they’ll reflect on SEMI Europa’s past, present, and future.
The event will also feature six new programs in honor of its anniversary, as well as presentations from 14 3D InCites member companies. We also have member companies exhibiting at Productronica, which is co-located with SEMICON this year. In total, we have 36 member companies exhibiting across both events! With such great representation at Francoise’s last conference, we look forward to spending as much time together as possible.
Finally, if you’re planning to attend the conference, you may be able to join us for Francoise’s retirement party – the 3D InCites Stammtisch – on Monday, November 17 at Bamberger Haus. To attend, please request an invitation from one of our sponsoring companies, or email Francoise directly to get on the waiting list.
Member Presentations
ASE
Topic TBD
- Wednesday, November 19 at 2:10 p.m.
- Bradford Factor
Topic TBD
- Wednesday, November 19 at 2:50 p.m.
- Christophe Zinck
Comet
From Atoms to Algorithms: European Suppliers’ Technological Race to Stay Ahead in the Semiconductor Market
- Tuesday, November 18 at 12:10 p.m.
- Andrew Grede
Driving Semiconductor Innovation in Europe: How AI-Powered X-ray Inspection Accelerates Time-to-Market
- Wednesday, November 19 at 11:10 a.m.
- Isabella Drolz
Leveraging Hardware-Enabled AI Image Analysis for Rapid 3D X-ray
- Wednesday, November 19 at 3:40 p.m.
- Joscha Malin
High-End Dose Management: X-ray Inspection Protecting Next-Generation Advanced Packaging
- Wednesday, November 19 at 4:40 p.m.
- Daniel Stickler
Edwards
Sustainable Fabs Start Here: Integrate, Commit, Innovate
- Tuesday, November 18 at 11:30 a.m.
- Tim Heger
EV Group
High-Throughput Digital Lithography Development for 3D Device Integration
- Wednesday, November 19 at 9:50 a.m.
- Ksenija Varga
Evatec
Photonic Integrated Circuits (PIC) – Unique PVD Solutions Helping Turn Cost Effective High Volume Manufacturing Into Reality
- Tuesday, November 18 at 3:35 p.m.
- Maurus Tschirky
Excillum
High-Resolution Inspection of Hybrid Bonds, Microbumps, and TSVs – Are X-ray Methods Ready for the Challenges of Advanced Packaging?
- Wednesday, November 19 at 5:20 p.m.
- Bjorn Hanssen
Fraunhofer IZM
The APECS Pilot Line in Powering the Evolution of Chiplet Technologies
- Wednesday, November 19 at 9 a.m.
- Rolf Aschenbrenner
Panel Discussion: Building the Packaging and Assembly Ecosystem in Europe
- Wednesday, November 19 at 5:45 p.m.
- Rolf Aschenbrenner
Henkel
Innovative Materials Addressing Thermal Management in Advanced Packaging
- Wednesday, November 19 at 10:45 a.m.
- Ram Trichur
Panel Discussion: Building the Packaging and Assembly Ecosystem in Europe
- Wednesday, November 19 at 5:45 p.m.
- Ram Trichur
KLA
Plasma Etch and Deposition for III-Vs: Driving Performance in Photonics, RF and Power Applications
- Tuesday, November 18 at 4:10 p.m.
- Richard Barnett
Kuehne + Nagel
Strengthening Semiconductor Supply Chains in an Era of Disruption
- Wednesday, November 19 at 4:35 p.m.
- Barry O’Dowd
Onto Innovation
Glass Core Substrates: Driving Scalability for HVM Through a Versatile Process Control Solution
- Wednesday, November 19 at 9:23 a.m.
- Monita Pau
SEMI
Building the Future: Global Fab Investment, Capacity Dynamics & Materials Market Outlook
- Wednesday, November 19 at 9:15 a.m.
- Clark Tseng
SEMI MEMS & Sensors Industry Group (MSIG) Update
- Wednesday, November 19 at 12 p.m.
- Paul Carey
European Chip Skills Academy
- Thursday, November 20 at 4:35 p.m.
- Victoria Cummings
Embedding Inclusion in Europe’s Semiconductor Strategy: Insights from ECDA
- Thursday, November 20 at 4:55 p.m.
- Kartikey Srivastava
Semilab
Strain Monitoring for High-Performance Semiconductor Devices by In-Line Raman Spectroscopy
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Wednesday, November 19 at 4:20 p.m.
Zsolt Szekrenyes
Shellback Semiconductor
Production-Proven Chemical-Free Green Alternative to Solvent and Piranha Wafer Processing Using Ozone
- Wednesday, November 19 at 9:29 a.m.
- Phillip Sundin
Siemens
Plan Virtual, Build Sustainable: Combining the Real and the Digital World
- Tuesday, November 18 at 10:30 a.m.
- Katharina Westrich
Beyond Simulation: Challenging the Status Quo
- Wednesday, November 19 at 1:40 p.m.
- Katharina Westrich
Digital Twin-Enabled Heterogeneous Package Assembly: AI-Driven Yield Optimization Through Early Design and Equipment Modeling
- Wednesday, November 19 at 3:50 p.m.
- Heiko Dudek
Syenta
Breakthrough Advanced Packaging Technology – Enabling High-Resolution Copper Interconnects by Combining Patterning & Deposition
- Wednesday, November 19 at 9:47 a.m.
- Sebastiaan Muller
Member Exhibits
