Latest Posts
September Member News: Innovation and Collaboration
The month of September saw continued momentum in the semiconductor industry, highlighted by exciting industry events, innovative technology launches, and...
August Member News: Pivotal Shifts in Leadership, Investments and Innovation
The month of August held pivotal shifts in the semiconductor industry, marked by leadership transitions, targeted investments, and continued innovation...
Interconnectology Saves the World!
In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb...
October 2024 Member News
October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance...
SEMICON Taiwan 2024 “Breaking Limits” Member Preview
Taking place from September 3-6, SEMICON Taiwan 2024 is just around the corner. With this year’s theme, Breaking Limits: Powering...
ECTC 2024 3D InCites Community Member Preview
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of...
April Member News: Earth Day, Partnerships, Notable Achievements
As the semiconductor industry continues to experience a surge of innovation, companies worldwide are collaborating to propel technology forward while...
March Member Highlights: Anniversaries, Events, Collaborations, New Products, and More
March buzzed with innovation and collaboration in the semiconductor industry, as key players across the globe joined forces to advance...
SEMICON China 2024 Community Member Preview
SEMICON China 2024 takes place March 20-22 at the Shanghai New International Expo Centre. This year’s event is expected to...
January Member Achievements, New Hires and Grand Openings
Members of the 3D InCites community hit the year running by celebrating milestones, new hires, promotions, and grand openings. Here...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
Henkel Highlights Portfolio of Enabling Materials for Next-gen Semiconductor Devices at SEMICON Taiwan 2023
Taipei, Taiwan – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers...
2023 ECTC Community Member Preview
Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference...
Henkel Debuts Ultra-high Thermal Conductivity Pressure-less Sintering Die Attach Adhesive that Meets Automotive Grade Reliability Standards
Irvine, CA – Henkel today announced the addition of Loctite Ablestik ABP 8068TI to its growing portfolio of high thermal...
Henkel Delivers Versatile, High Thermal Die Attach Adhesive for Power IC Applications
Irvine, CA – As integrated circuits (ICs) become more dense and complex, particularly in the power device sector, new approaches...
3D InCites Awards Program Recognizes Henkel Leadership in Die Attach and Underfill Materials Development
Henkel semiconductor packaging innovations earn Material Supplier of the Year Award Irvine, CA – Henkel today announced that it has...
Henkel Unveils Semiconductor Capillary Underfill for Advanced Silicon Node Flip Chip Applications
Irvine, CA – Henkel today announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications....
Henkel Non-conductive Die Attach Film Offers Broad Wirebond Package Flexibility for High-reliability Applications
Irvine, CA – Henkel today announced the commercialization of a high-performance non-conductive die attach film (ncDAF) engineered to address the...
