This paper is co-authored by two of our member companies, Henkel Corporation and LPKF Laser & Electronics AG Laser Direct...
Highly-filled, fast-flow material balances reliability and processability, extends company’s package-level underfill leadership with multi-format solutions SEOUL, South Korea, Sept. 14,...
Investment to drive localized innovation and to strengthen collaboration with consumer electronics customers. Henkel has officially opened its South China...
Irvine, CA – Henkel today announced the opening of its Application Center in Santa Clara, CA designed to support product...
NCP and NCF Property Optimization Delivers High-Reliability Results Semiconductor package sizes are getting smaller and bump pitches narrower while the...
While critical to the processes, molding and encapsulation materials used in both fan-in and fan-out wafer-level packages (FI WLP/FO WLP) ...