Artifact-free Decapsulation of 2.5D and 3D Advanced Packages
Jun 30, 2021 · By Lea Heusinger-Jonda · 3D In-Depth, Test and Inspection
Latest Posts
Meeting the Challenges of 5G RF Production Test Services
Implementation of the 5G radio frequency (RF) standard is increasing rapidly [1]. Over the past four to six quarters, there...
Process Control and Inspection for High-Value Advanced Packages: It’s Complicated
In September of 2018, I spoke with KLA’s Stephen Hiebert and Pieter Vandewalle about the changing advanced packaging landscape, and...
Why We Need to Address Known Good Die (KDG) Holistically
If you love, like me, to work on the bleeding edge of technology, you will find that your personal success...
The Advantages of Outsourced Test Services
The business model in today’s competitive world of commerce has shifted over recent years to “services.” Companies like Microsoft, Amazon,...
Technologies Migrate from Both Directions to AP Processes
Advanced packaging (AP) processes are often described as the front-end-like processes that have migrated to traditionally back-end applications for packaging...
25 Years Perfecting the Art of Metrology
I first met Dr. Thomas Fries, Founder, and CEO of FRT, The Art of Metrology in 2016 at SEMI Europe’s...
Digital Cross-section Technology for Inspecting and Measuring Buried Package Interconnects
Much has been written about the end of Dennard Scaling, the slowdown of Moore’s Law and the impact that these...
Behind the Scenes of IEEE Std 1838™-2019
Developing an industry standard is no easy task, and for those involved, its acceptance and publication is something to be...
An Inside Look at 3D-DfT Standard IEEE Std 1838™-2019
Eight years in the making, the IEEE Std 1838™-2019 Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits — or IEEE 1838,...
3D Test: No Longer a Bottleneck!
When I joined imec in October 2008 to work on test and design- for- test (DfT) of 3D-stacked integrated circuits...
Reliable Process Control Solutions for the Growing Power Device Market
The expected increase of the power device market, with a compound annual growth rate (CAGR) of more than 10% —...
New Solution for Testing Chips Prior to 3D Stacking
Stacking chips on top of each other (aka 3D stacking) is a well-known approach to make more compact and powerful...
Executive Viewpoint: The Impact of Process Control on FOWLP and 3D IC
As Si interposer and 3D stacked memory devices enter into production, albeit in low volumes, semiconductor manufacturers are lining up...
Advancing Sensing Solutions to 3D and Beyond
A second side trip on the way to DATE 2015 brought me back to Nimes, France to check up on...
Putting 3D Integration to the Test
3D stacking is “already old hand”; or so declared Brion Keller, Cadence, in his keynote talk at last week’s 5th...
KLA Tencor: CV310i Wafer Edge Inspection and Metrology Module
CIRCL CV310i module is an advanced Wafer Edge inspection, metrology and profiling system tailored for Advanced Wafer Level Packaging. Simultaneous... Fogale: TMAP DUAL 3D 300 A
The TMAP DUAL 3D 300 A is a unique metrology and inspection tool available to the semiconductor industry capable of... NORDSON Dage: XM8000 Wafer X-ray Metrology Platform
Fully automatic, in-line X-ray metrology platform for the measurement and defect capture of both optically hidden and visible features in...
Cascade Microtech: In the imec 3D Test Lab
My visit to imec to meet with the Cascade Micorotech and imec 3D Test collaboration team included a tour of...