With the dawn of chiplet integration, advanced chip manufacturing and advanced packaging technologies are more complex than ever. Dies are being integrated from different wafers, and yield management is tricky. It requires a combination of both electrical test and optical measurement – or metrology. Even more, it requires hybrid metrology using multi-sensor technology.

In this podcast episode, sponsored by FRT Metrology, a business unit of Formfactor, Moderator Will Souter speaks with Thomas Fries, VP BU & General Manager FRT Metrology; Juergen Koglin, Director Applications Engineering; and Amy Leong, Chief Marketing Officer and Senior Vice President, Mergers and Acquisitions at Formfactor. Each speaker shares their perspectives about the acquisition of FRT by FormFactor, and how together, they are paving new pathways for inspection and metrology across the chip industry.

From Koglin, you’ll learn about hybrid metrology, what it is, how it is implemented, and why it is a game-changer for advanced packaging metrology.

Leong explains why FRT was such a good fit for FormFactor. She talks about the synergies between the companies and how together, they are a powerful combination for emerging advanced packaging technologies, which require new metrology that brings flexibility to measurement where it’s needed in the back-end at the best cost of ownership.

Fries talks about his journey building FRT, its growth path, and how becoming part of FormFactor at such a critical time in the industry opened up new opportunities for the company while allowing them to maintain the family culture that is so important to their success.

 

FRT A Formfactor Company

FormFactor FRT Metrology manufactures 3D surface measurement technology for research and production. Our high-precision measuring…

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