Test and Inspection

ECTC 2013 Interview: Multitest Execs Tout Partial Stack Test for 3D ICs

ECTC 2013 Interview: Multitest Execs Tout Partial Stack Test for 3D ICs

Those of us following 2.5D and 3D ICs have been holding our breath waiting for test solutions to appear amidst all the controversy surrounding whether or not partial testing of 3DICs just adds cost or whether it adds value. I spent some time talking to Bob Chartrand, director of sales and service for North America and Jim Quinn, VP Global Sales and Marketing at the Multitest booth at ECTC 2013 (La... »

3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies

3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies

Proceeds to Benefit The Frances B. Hugle Engineering Scholarship Phoenix AZ and Austin TX – May 21, 2012 – 3D InCites, the premiere online content source for reliable 3D technology information, and TechSearch International, the leading market research and intelligence firm for advanced semiconductor packaging technology, today announced the first annual 3D InCites Awards. All proceeds of the a... »

A Lull in 3D Activity or Stealth Mode?

A Lull in 3D Activity or Stealth Mode?

An industry colleague commented to me recently that the press seems to have lost interest in 3DIC. As probably the industry’s most avid follower and writer of 3D related news, I had to disagree – its not that we’ve lost interest, its just that there seems to be a lull in new information. Either that or there’s lots happening behind the scenes that can’t (or won’t) be revealed. To prov... »

Rudolph Acquires Assets of Tamar Technologies

Rudolph Acquires Assets of Tamar Technologies

Rudolph Technologies, Inc., known for its process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, has taken another step in expanding its capabilities for inspection and metrology in 3D packaging through the acquisition of selected assets, including a strong patent portfolio, relating to metrology capability from Tamar Technology, New... »

BiTS Workshop 2013

Interconnectologists and Market Analysts See Eye to Eye on The Changing IC Industry at BiTS Workshop

Every year in early March, I spend a day at the BiTS Workshop (Burn-in Test Strategies), not because it’s a hotbed of 3D technology information (although this year there were some papers addressing 3D test as solutions are now becoming available) but because I’ve been working with the General Chair, Fred Taber, for years, first during my tenure at Advanced Packaging Magazine, and then at Chip... »

2013 Predictions for 3D ICs as reported by SPN

2013 Predictions for 3D ICs as reported by SPN

While most of the semiconductor trade publications wrapped up their 2013 prediction posts by mid January, Semiconductor Packaging News (SPN) forged on with its original annual Viewpoints series right up until last week. I spent some time pouring over the musings of industry executives’ contributions. Many discuss the proliferation of mobile devices driving technology requirements and 3D ICs as ... »

3D TSV Summiit

European 3D TSV Summit: But Wait, There’s More!

Day Two of the European 3D TSV Summit dawned bright and clear, with such a spectacular view of the nearby French Alps that it took real commitment to stay indoors and focus on the task at hand. But I have to admit that for the most part, it was worth the sacrifice to hear what this collection of speakers had to say. Georg Kimmich, head of Silicon Packaging R&D at ST-Ericsson delivered a dose o... »

3D TSV Summiit

European 3D TSV Summit Interview: Gilles Fresquet

Fogale Nanotech has been on my radar with its 3D TSV metrology solutions ever since I noticed their booth last summer at SEMICON West. Sometimes it takes an occasion such as a pre-arranged interview at the European 3D TSV Summit for a connection to finally take place. I was happy to have such a moment last week, and sat down with Gilles Fresquet, to learn more about Fogale’s metrology solutions ... »

3D TSVs: Will Europe Lead the Way?

The first European 3D TSV Summit (January 22-23, 2013) hasn’t even happened yet, and already its intended message is becoming clear: Europe is ready to tackle those remaining issues and lead the world down the home stretch. It makes sense, since Europe’s R&D centers (imec, CEA Leti, Fraunhofer IZM) has been leading the way from the beginning, its foundries and IDMs (ST Microelectronics an... »

“Known Good Die” has a new name

After 20 years of chasing elusive Known Good Die (KGD) to achieve high yielding advanced interconnect technologies, the semiconductor industry has come to the conclusion that its time to take a different approach. It’s called Probably Good Die, and when it comes to 2.5D and 3D ICs, particularly for Memory, it’s a means to an end. At Known Good Die 2012: Reducing Costs through Yield Optimizatio... »

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