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Yearbook

3DIC_Yearbook_Vol.3_2021

3DIC_Yearbook_Vol.3_2021

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3DIC_MediaKit_2021

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Whitepapers

Using a System Technology Co-Optimization Approach for 2.5/3D Heterogeneous Semiconductor Integration

Jul 13, 2021

Moore’s law is increasingly difficult to maintain. With the economics...

Recommended Reads

System-in-Package industry: IDMs, OSATs, and Foundries are taking the Advantage – iMicronews

Jul 22, 2021

Through enabling design and supply chain agility, SiP will reach...

Advanced Packaging Technologies Overcoming the Memory System Performance and Capacity Limitation – EE Times

Jul 21, 2021

In the relentless pursuit to increase performance while reducing size,...

Community News

Don Foldenauer Joins YES as Vice President of Operations

Jul 19, 2021

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process...

Micross Expands Capabilities with the Acquisition of Microelectronics Business Assets of Ultra CEMS

Jul 15, 2021

Melville, NY (July 7, 2021) – Micross Components, Inc. (“Micross”),...

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Francoise von Trapp Francoise von Trapp Herb Reiter Herb Reiter Phil Garrou Phil Garrou Paul Werbaneth Paul Werbaneth Dean Freeman Dean Freeman Jean-Christophe ELOY Jean-Christophe ELOY Andrew Walker Andrew Walker Bill Martin Bill Martin Trine Pierik Trine Pierik

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  • 3D In-Depth
    • What is 3D Integration?
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